JP2016538139A5 - - Google Patents
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- Publication number
- JP2016538139A5 JP2016538139A5 JP2016516918A JP2016516918A JP2016538139A5 JP 2016538139 A5 JP2016538139 A5 JP 2016538139A5 JP 2016516918 A JP2016516918 A JP 2016516918A JP 2016516918 A JP2016516918 A JP 2016516918A JP 2016538139 A5 JP2016538139 A5 JP 2016538139A5
- Authority
- JP
- Japan
- Prior art keywords
- polishing
- substrate
- polishing pad
- main surface
- base layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005498 polishing Methods 0.000 claims 11
- 239000000758 substrate Substances 0.000 claims 5
- 239000000919 ceramic Substances 0.000 claims 3
- 239000002131 composite material Substances 0.000 claims 2
- 239000012530 fluid Substances 0.000 claims 2
- 239000011159 matrix material Substances 0.000 claims 1
- 239000002245 particle Substances 0.000 claims 1
Applications Claiming Priority (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201361882369P | 2013-09-25 | 2013-09-25 | |
| US61/882,369 | 2013-09-25 | ||
| US201361918369P | 2013-12-19 | 2013-12-19 | |
| US61/918,369 | 2013-12-19 | ||
| US201462019068P | 2014-06-30 | 2014-06-30 | |
| US62/019,068 | 2014-06-30 | ||
| PCT/US2014/056966 WO2015048011A1 (en) | 2013-09-25 | 2014-09-23 | Multi-layered polishing pads |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2016538139A JP2016538139A (ja) | 2016-12-08 |
| JP2016538139A5 true JP2016538139A5 (enExample) | 2017-11-02 |
| JP6703939B2 JP6703939B2 (ja) | 2020-06-03 |
Family
ID=52744387
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016516918A Active JP6703939B2 (ja) | 2013-09-25 | 2014-09-23 | 研磨システム |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US10071459B2 (enExample) |
| EP (1) | EP3050082B1 (enExample) |
| JP (1) | JP6703939B2 (enExample) |
| KR (1) | KR102252673B1 (enExample) |
| CN (1) | CN105579194B (enExample) |
| SG (1) | SG11201602207QA (enExample) |
| TW (1) | TWI699257B (enExample) |
| WO (1) | WO2015048011A1 (enExample) |
Families Citing this family (41)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3049215B1 (en) * | 2013-09-25 | 2021-04-14 | 3M Innovative Properties Company | Composite ceramic abrasive polishing solution |
| US9873180B2 (en) | 2014-10-17 | 2018-01-23 | Applied Materials, Inc. | CMP pad construction with composite material properties using additive manufacturing processes |
| KR20240015167A (ko) | 2014-10-17 | 2024-02-02 | 어플라이드 머티어리얼스, 인코포레이티드 | 애디티브 제조 프로세스들을 이용한 복합 재료 특성들을 갖는 ｃｍｐ 패드 구성 |
| US10821573B2 (en) | 2014-10-17 | 2020-11-03 | Applied Materials, Inc. | Polishing pads produced by an additive manufacturing process |
| US10399201B2 (en) | 2014-10-17 | 2019-09-03 | Applied Materials, Inc. | Advanced polishing pads having compositional gradients by use of an additive manufacturing process |
| US10875145B2 (en) | 2014-10-17 | 2020-12-29 | Applied Materials, Inc. | Polishing pads produced by an additive manufacturing process |
| US9776361B2 (en) | 2014-10-17 | 2017-10-03 | Applied Materials, Inc. | Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles |
| TWI689406B (zh) | 2014-10-17 | 2020-04-01 | 美商應用材料股份有限公司 | 研磨墊及製造其之方法 |
| US10875153B2 (en) | 2014-10-17 | 2020-12-29 | Applied Materials, Inc. | Advanced polishing pad materials and formulations |
| US11745302B2 (en) | 2014-10-17 | 2023-09-05 | Applied Materials, Inc. | Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process |
| CN107614200B (zh) * | 2015-05-13 | 2020-05-08 | 3M创新有限公司 | 抛光垫和使用抛光垫的系统和方法 |
| CN106281219A (zh) * | 2015-05-22 | 2017-01-04 | 江苏益林金刚石工具有限公司 | 一种水油双溶性金刚石复合研磨膏及其制备方法 |
| CN113103145B (zh) | 2015-10-30 | 2023-04-11 | 应用材料公司 | 形成具有期望ζ电位的抛光制品的设备与方法 |
| US10593574B2 (en) | 2015-11-06 | 2020-03-17 | Applied Materials, Inc. | Techniques for combining CMP process tracking data with 3D printed CMP consumables |
| KR20240015161A (ko) | 2016-01-19 | 2024-02-02 | 어플라이드 머티어리얼스, 인코포레이티드 | 다공성 화학적 기계적 연마 패드들 |
| US10391605B2 (en) | 2016-01-19 | 2019-08-27 | Applied Materials, Inc. | Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process |
| JP2019513161A (ja) * | 2016-02-16 | 2019-05-23 | スリーエム イノベイティブ プロパティズ カンパニー | 研磨システム、並びにその製造方法及び使用方法 |
| WO2017155969A1 (en) | 2016-03-09 | 2017-09-14 | Applied Materials, Inc. | Pad structure and fabrication methods |
| JP6901297B2 (ja) * | 2017-03-22 | 2021-07-14 | 株式会社フジミインコーポレーテッド | 研磨用組成物 |
| US20180304539A1 (en) | 2017-04-21 | 2018-10-25 | Applied Materials, Inc. | Energy delivery system with array of energy sources for an additive manufacturing apparatus |
| WO2018207670A1 (ja) * | 2017-05-12 | 2018-11-15 | 株式会社クラレ | 鎖伸長剤，ポリウレタンとその改質方法，研磨層，研磨パッド及び研磨方法 |
| SG11202000246QA (en) * | 2017-07-11 | 2020-02-27 | 3M Innovative Properties Co | Abrasive articles including conformable coatings and polishing system therefrom |
| US11471999B2 (en) | 2017-07-26 | 2022-10-18 | Applied Materials, Inc. | Integrated abrasive polishing pads and manufacturing methods |
| JP7165719B2 (ja) | 2017-08-04 | 2022-11-04 | スリーエム イノベイティブ プロパティズ カンパニー | 平坦性が向上された微細複製研磨表面 |
| US11072050B2 (en) | 2017-08-04 | 2021-07-27 | Applied Materials, Inc. | Polishing pad with window and manufacturing methods thereof |
| WO2019032286A1 (en) | 2017-08-07 | 2019-02-14 | Applied Materials, Inc. | ABRASIVE DISTRIBUTION POLISHING PADS AND METHODS OF MAKING SAME |
| WO2019038675A1 (en) | 2017-08-25 | 2019-02-28 | 3M Innovative Properties Company | SURFACE SURFACE SURFACE POLISHING PAD |
| CN107639554B (zh) * | 2017-11-10 | 2024-12-20 | 江苏瑞和磨料磨具有限公司 | 一种粗磨抛光一次完成的双面磨砂布 |
| WO2019152222A1 (en) | 2018-02-05 | 2019-08-08 | Applied Materials, Inc. | Piezo-electric end-pointing for 3d printed cmp pads |
| US11826876B2 (en) | 2018-05-07 | 2023-11-28 | Applied Materials, Inc. | Hydrophilic and zeta potential tunable chemical mechanical polishing pads |
| US11738423B2 (en) * | 2018-07-31 | 2023-08-29 | Taiwan Semiconductor Manufacturing Co., Ltd. | Chemical mechanical polishing apparatus and method |
| KR20210042171A (ko) | 2018-09-04 | 2021-04-16 | 어플라이드 머티어리얼스, 인코포레이티드 | 진보한 폴리싱 패드들을 위한 제형들 |
| EP3858546A4 (en) * | 2018-09-28 | 2021-12-01 | Fujimi Incorporated | POLISHING PAD AND POLISHING PROCESS USING IT |
| US11331767B2 (en) | 2019-02-01 | 2022-05-17 | Micron Technology, Inc. | Pads for chemical mechanical planarization tools, chemical mechanical planarization tools, and related methods |
| US11851570B2 (en) | 2019-04-12 | 2023-12-26 | Applied Materials, Inc. | Anionic polishing pads formed by printing processes |
| KR102803330B1 (ko) * | 2019-09-04 | 2025-05-07 | 에스케이이노베이션 주식회사 | 식각 조성물, 이를 이용한 절연막의 식각방법 및 반도체 소자의 제조방법 |
| US11813712B2 (en) | 2019-12-20 | 2023-11-14 | Applied Materials, Inc. | Polishing pads having selectively arranged porosity |
| US11806829B2 (en) | 2020-06-19 | 2023-11-07 | Applied Materials, Inc. | Advanced polishing pads and related polishing pad manufacturing methods |
| CN112429803A (zh) * | 2020-11-02 | 2021-03-02 | 湖南长科诚享石化科技有限公司 | 破乳反应器 |
| US11878389B2 (en) | 2021-02-10 | 2024-01-23 | Applied Materials, Inc. | Structures formed using an additive manufacturing process for regenerating surface texture in situ |
| CN115157111B (zh) * | 2022-07-13 | 2024-03-15 | 安徽禾臣新材料有限公司 | 一种玻璃加工用抛光垫及其制备方法 |
Family Cites Families (62)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB791580A (en) * | 1955-07-26 | 1958-03-05 | British United Shoe Machinery | Improvements in or relating to the cutting of sheet materials |
| US3036003A (en) | 1957-08-07 | 1962-05-22 | Sinclair Research Inc | Lubricating oil composition |
| US3236770A (en) | 1960-09-28 | 1966-02-22 | Sinclair Research Inc | Transaxle lubricant |
| NL137371C (enExample) | 1963-08-02 | |||
| NL145565B (nl) | 1965-01-28 | 1975-04-15 | Shell Int Research | Werkwijze ter bereiding van een smeermiddelcompositie. |
| US3414347A (en) | 1965-03-30 | 1968-12-03 | Edroy Products Company Inc | Binocular with pivoted lens plate |
| US3574576A (en) | 1965-08-23 | 1971-04-13 | Chevron Res | Distillate fuel compositions having a hydrocarbon substituted alkylene polyamine |
| US3539633A (en) | 1965-10-22 | 1970-11-10 | Standard Oil Co | Di-hydroxybenzyl polyamines |
| US3461172A (en) | 1966-11-22 | 1969-08-12 | Consolidation Coal Co | Hydrogenation of ortho-phenolic mannich bases |
| US3448047A (en) | 1967-04-05 | 1969-06-03 | Standard Oil Co | Lube oil dispersants |
| US3586629A (en) | 1968-09-16 | 1971-06-22 | Mobil Oil Corp | Metal salts as lubricant additives |
| US3726882A (en) | 1968-11-08 | 1973-04-10 | Standard Oil Co | Ashless oil additives |
| US3591598A (en) | 1968-11-08 | 1971-07-06 | Standard Oil Co | Certain condensation products derived from mannich bases |
| US3725480A (en) | 1968-11-08 | 1973-04-03 | Standard Oil Co | Ashless oil additives |
| US3634515A (en) | 1968-11-08 | 1972-01-11 | Standard Oil Co | Alkylene polyamide formaldehyde |
| US3980569A (en) | 1974-03-15 | 1976-09-14 | The Lubrizol Corporation | Dispersants and process for their preparation |
| US4314827A (en) | 1979-06-29 | 1982-02-09 | Minnesota Mining And Manufacturing Company | Non-fused aluminum oxide-based abrasive mineral |
| US4623364A (en) | 1984-03-23 | 1986-11-18 | Norton Company | Abrasive material and method for preparing the same |
| CA1254238A (en) | 1985-04-30 | 1989-05-16 | Alvin P. Gerk | Process for durable sol-gel produced alumina-based ceramics, abrasive grain and abrasive products |
| US4770671A (en) | 1985-12-30 | 1988-09-13 | Minnesota Mining And Manufacturing Company | Abrasive grits formed of ceramic containing oxides of aluminum and yttrium, method of making and using the same and products made therewith |
| IN172215B (enExample) | 1987-03-25 | 1993-05-08 | Lubrizol Corp | |
| US4881951A (en) | 1987-05-27 | 1989-11-21 | Minnesota Mining And Manufacturing Co. | Abrasive grits formed of ceramic containing oxides of aluminum and rare earth metal, method of making and products made therewith |
| US5157088A (en) | 1987-11-19 | 1992-10-20 | Dishong Dennis M | Nitrogen-containing esters of carboxy-containing interpolymers |
| KR0146707B1 (ko) | 1988-10-24 | 1998-08-01 | 죤 제이.마혼 | 아미드 함유 마찰 개질제를 함유한 전동유체 |
| US5378251A (en) | 1991-02-06 | 1995-01-03 | Minnesota Mining And Manufacturing Company | Abrasive articles and methods of making and using same |
| US5152917B1 (en) | 1991-02-06 | 1998-01-13 | Minnesota Mining & Mfg | Structured abrasive article |
| US5310455A (en) | 1992-07-10 | 1994-05-10 | Lsi Logic Corporation | Techniques for assembling polishing pads for chemi-mechanical polishing of silicon wafers |
| US5958794A (en) | 1995-09-22 | 1999-09-28 | Minnesota Mining And Manufacturing Company | Method of modifying an exposed surface of a semiconductor wafer |
| US6194317B1 (en) * | 1998-04-30 | 2001-02-27 | 3M Innovative Properties Company | Method of planarizing the upper surface of a semiconductor wafer |
| JP3239843B2 (ja) | 1998-05-11 | 2001-12-17 | 関西日本電気株式会社 | 半導体装置の製造方法 |
| US6036586A (en) * | 1998-07-29 | 2000-03-14 | Micron Technology, Inc. | Apparatus and method for reducing removal forces for CMP pads |
| US6183346B1 (en) | 1998-08-05 | 2001-02-06 | 3M Innovative Properties Company | Abrasive article with embossed isolation layer and methods of making and using |
| US6439967B2 (en) * | 1998-09-01 | 2002-08-27 | Micron Technology, Inc. | Microelectronic substrate assembly planarizing machines and methods of mechanical and chemical-mechanical planarization of microelectronic substrate assemblies |
| US6319108B1 (en) * | 1999-07-09 | 2001-11-20 | 3M Innovative Properties Company | Metal bond abrasive article comprising porous ceramic abrasive composites and method of using same to abrade a workpiece |
| US6306012B1 (en) | 1999-07-20 | 2001-10-23 | Micron Technology, Inc. | Methods and apparatuses for planarizing microelectronic substrate assemblies |
| US6241596B1 (en) | 2000-01-14 | 2001-06-05 | Applied Materials, Inc. | Method and apparatus for chemical mechanical polishing using a patterned pad |
| US6746311B1 (en) * | 2000-01-24 | 2004-06-08 | 3M Innovative Properties Company | Polishing pad with release layer |
| US6620508B2 (en) | 2000-01-25 | 2003-09-16 | Nippon Aerosil Co., Ltd. | Oxide powder and method for preparing the same, and product using the same |
| US20020197935A1 (en) * | 2000-02-14 | 2002-12-26 | Mueller Brian L. | Method of polishing a substrate |
| BR0110423A (pt) | 2000-05-09 | 2003-02-04 | 3M Innovative Properties Co | Artigo abrasivo tridimensional conformado, método para produzir o mesmo, e, método para refinar uma superfìcie de peça de trabalho |
| WO2002028802A2 (en) | 2000-10-06 | 2002-04-11 | 3M Innovative Properties Company | Ceramic aggregate particles |
| US6645624B2 (en) | 2000-11-10 | 2003-11-11 | 3M Innovative Properties Company | Composite abrasive particles and method of manufacture |
| US6551366B1 (en) * | 2000-11-10 | 2003-04-22 | 3M Innovative Properties Company | Spray drying methods of making agglomerate abrasive grains and abrasive articles |
| US20030134581A1 (en) | 2002-01-11 | 2003-07-17 | Wang Hsing Maw | Device for chemical mechanical polishing |
| US6679758B2 (en) | 2002-04-11 | 2004-01-20 | Saint-Gobain Abrasives Technology Company | Porous abrasive articles with agglomerated abrasives |
| JP3849593B2 (ja) * | 2002-06-28 | 2006-11-22 | Ｊｓｒ株式会社 | 研磨パッド及び複層型研磨パッド |
| US7230154B2 (en) | 2002-12-31 | 2007-06-12 | Ossur Hf | Wound dressing |
| KR101018942B1 (ko) * | 2003-01-10 | 2011-03-02 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 화학 기계적 평탄화 적용을 위한 패드 구조물 |
| JP2005146036A (ja) * | 2003-11-12 | 2005-06-09 | Sanwa Kenma Kogyo Kk | 精密研磨剤 |
| TWI227729B (en) | 2003-12-19 | 2005-02-11 | Eternal Chemical Co Ltd | A slurry for color photoresist planarization |
| WO2005077602A1 (en) | 2004-02-17 | 2005-08-25 | Skc Co., Ltd. | Base pad polishing pad and multi-layer pad comprising the same |
| JP4616571B2 (ja) * | 2004-03-31 | 2011-01-19 | 東洋ゴム工業株式会社 | 研磨パッド |
| ATE517960T1 (de) * | 2005-01-26 | 2011-08-15 | Lg Chemical Ltd | Ceroxidschleifmittel und diese enthaltende aufschlämmung |
| US7494519B2 (en) | 2005-07-28 | 2009-02-24 | 3M Innovative Properties Company | Abrasive agglomerate polishing method |
| US7399330B2 (en) | 2005-10-18 | 2008-07-15 | 3M Innovative Properties Company | Agglomerate abrasive grains and methods of making the same |
| US7594845B2 (en) | 2005-10-20 | 2009-09-29 | 3M Innovative Properties Company | Abrasive article and method of modifying the surface of a workpiece |
| EP1779971A1 (en) * | 2005-10-28 | 2007-05-02 | Princo Corp. | Pad conditioner for conditioning a CMP pad and method of making such a pad conditioner |
| US7226345B1 (en) | 2005-12-09 | 2007-06-05 | The Regents Of The University Of California | CMP pad with designed surface features |
| US8162723B2 (en) * | 2006-03-09 | 2012-04-24 | Cabot Microelectronics Corporation | Method of polishing a tungsten carbide surface |
| JP2011173958A (ja) * | 2010-02-23 | 2011-09-08 | Tokyo Electron Ltd | スラリー製造方法、スラリー、研磨方法及び研磨装置 |
| EP3049215B1 (en) | 2013-09-25 | 2021-04-14 | 3M Innovative Properties Company | Composite ceramic abrasive polishing solution |
| WO2015153601A1 (en) * | 2014-04-03 | 2015-10-08 | 3M Innovative Properties Company | Polishing pads and systems and methods of making and using the same |
-
2014
- 2014-09-23 WO PCT/US2014/056966 patent/WO2015048011A1/en not_active Ceased
- 2014-09-23 US US14/915,650 patent/US10071459B2/en active Active
- 2014-09-23 SG SG11201602207QA patent/SG11201602207QA/en unknown
- 2014-09-23 EP EP14848991.7A patent/EP3050082B1/en active Active
- 2014-09-23 JP JP2016516918A patent/JP6703939B2/ja active Active
- 2014-09-23 KR KR1020167010339A patent/KR102252673B1/ko active Active
- 2014-09-23 CN CN201480052077.1A patent/CN105579194B/zh active Active
- 2014-09-24 TW TW103133088A patent/TWI699257B/zh active