JP2016538139A5 - - Google Patents
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- Publication number
- JP2016538139A5 JP2016538139A5 JP2016516918A JP2016516918A JP2016538139A5 JP 2016538139 A5 JP2016538139 A5 JP 2016538139A5 JP 2016516918 A JP2016516918 A JP 2016516918A JP 2016516918 A JP2016516918 A JP 2016516918A JP 2016538139 A5 JP2016538139 A5 JP 2016538139A5
- Authority
- JP
- Japan
- Prior art keywords
- polishing
- substrate
- polishing pad
- main surface
- base layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005498 polishing Methods 0.000 claims 11
- 239000000758 substrate Substances 0.000 claims 5
- 239000000919 ceramic Substances 0.000 claims 3
- 239000002131 composite material Substances 0.000 claims 2
- 239000012530 fluid Substances 0.000 claims 2
- 239000011159 matrix material Substances 0.000 claims 1
- 239000002245 particle Substances 0.000 claims 1
Applications Claiming Priority (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201361882369P | 2013-09-25 | 2013-09-25 | |
| US61/882,369 | 2013-09-25 | ||
| US201361918369P | 2013-12-19 | 2013-12-19 | |
| US61/918,369 | 2013-12-19 | ||
| US201462019068P | 2014-06-30 | 2014-06-30 | |
| US62/019,068 | 2014-06-30 | ||
| PCT/US2014/056966 WO2015048011A1 (en) | 2013-09-25 | 2014-09-23 | Multi-layered polishing pads |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2016538139A JP2016538139A (ja) | 2016-12-08 |
| JP2016538139A5 true JP2016538139A5 (enExample) | 2017-11-02 |
| JP6703939B2 JP6703939B2 (ja) | 2020-06-03 |
Family
ID=52744387
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016516918A Active JP6703939B2 (ja) | 2013-09-25 | 2014-09-23 | 研磨システム |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US10071459B2 (enExample) |
| EP (1) | EP3050082B1 (enExample) |
| JP (1) | JP6703939B2 (enExample) |
| KR (1) | KR102252673B1 (enExample) |
| CN (1) | CN105579194B (enExample) |
| SG (1) | SG11201602207QA (enExample) |
| TW (1) | TWI699257B (enExample) |
| WO (1) | WO2015048011A1 (enExample) |
Families Citing this family (41)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SG11201602206PA (en) * | 2013-09-25 | 2016-04-28 | 3M Innovative Properties Co | Composite ceramic abrasive polishing solution |
| US9873180B2 (en) | 2014-10-17 | 2018-01-23 | Applied Materials, Inc. | CMP pad construction with composite material properties using additive manufacturing processes |
| US11745302B2 (en) | 2014-10-17 | 2023-09-05 | Applied Materials, Inc. | Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process |
| US10399201B2 (en) | 2014-10-17 | 2019-09-03 | Applied Materials, Inc. | Advanced polishing pads having compositional gradients by use of an additive manufacturing process |
| CN113579992A (zh) | 2014-10-17 | 2021-11-02 | 应用材料公司 | 使用加成制造工艺的具复合材料特性的cmp衬垫建构 |
| TWI689406B (zh) | 2014-10-17 | 2020-04-01 | 美商應用材料股份有限公司 | 研磨墊及製造其之方法 |
| US10821573B2 (en) | 2014-10-17 | 2020-11-03 | Applied Materials, Inc. | Polishing pads produced by an additive manufacturing process |
| US10875153B2 (en) | 2014-10-17 | 2020-12-29 | Applied Materials, Inc. | Advanced polishing pad materials and formulations |
| US10875145B2 (en) | 2014-10-17 | 2020-12-29 | Applied Materials, Inc. | Polishing pads produced by an additive manufacturing process |
| US9776361B2 (en) | 2014-10-17 | 2017-10-03 | Applied Materials, Inc. | Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles |
| WO2016183126A1 (en) * | 2015-05-13 | 2016-11-17 | 3M Innovative Properties Company | Polishing pads and systems for and methods of using same |
| CN106281219A (zh) * | 2015-05-22 | 2017-01-04 | 江苏益林金刚石工具有限公司 | 一种水油双溶性金刚石复合研磨膏及其制备方法 |
| JP6940495B2 (ja) | 2015-10-30 | 2021-09-29 | アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ | 所望のゼータ電位を有する研磨用物品を形成するための装置及び方法 |
| US10593574B2 (en) | 2015-11-06 | 2020-03-17 | Applied Materials, Inc. | Techniques for combining CMP process tracking data with 3D printed CMP consumables |
| KR20240015161A (ko) | 2016-01-19 | 2024-02-02 | 어플라이드 머티어리얼스, 인코포레이티드 | 다공성 화학적 기계적 연마 패드들 |
| US10391605B2 (en) | 2016-01-19 | 2019-08-27 | Applied Materials, Inc. | Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process |
| WO2017142805A1 (en) * | 2016-02-16 | 2017-08-24 | 3M Innovative Properties Company | Polishing systems and methods of making and using same |
| WO2017155969A1 (en) | 2016-03-09 | 2017-09-14 | Applied Materials, Inc. | Pad structure and fabrication methods |
| JP6901297B2 (ja) * | 2017-03-22 | 2021-07-14 | 株式会社フジミインコーポレーテッド | 研磨用組成物 |
| US20180304539A1 (en) | 2017-04-21 | 2018-10-25 | Applied Materials, Inc. | Energy delivery system with array of energy sources for an additive manufacturing apparatus |
| US11053339B2 (en) * | 2017-05-12 | 2021-07-06 | Kuraray Co., Ltd. | Polyurethane for polishing layer, polishing layer including polyurethane and modification method of the polishing layer, polishing pad, and polishing method |
| WO2019012388A1 (en) * | 2017-07-11 | 2019-01-17 | 3M Innovative Properties Company | ABRASIVE ARTICLES COMPRISING CONFORMABLE COATINGS AND POLISHING SYSTEM COMPRISING THE SAME |
| US11471999B2 (en) | 2017-07-26 | 2022-10-18 | Applied Materials, Inc. | Integrated abrasive polishing pads and manufacturing methods |
| US11072050B2 (en) | 2017-08-04 | 2021-07-27 | Applied Materials, Inc. | Polishing pad with window and manufacturing methods thereof |
| CN111032284B (zh) * | 2017-08-04 | 2022-11-04 | 3M创新有限公司 | 具有增强的共平面性的微复制型抛光表面 |
| WO2019032286A1 (en) | 2017-08-07 | 2019-02-14 | Applied Materials, Inc. | ABRASIVE DISTRIBUTION POLISHING PADS AND METHODS OF MAKING SAME |
| CN111032285B (zh) | 2017-08-25 | 2022-07-19 | 3M创新有限公司 | 表面突起抛光垫 |
| CN107639554B (zh) * | 2017-11-10 | 2024-12-20 | 江苏瑞和磨料磨具有限公司 | 一种粗磨抛光一次完成的双面磨砂布 |
| KR20200108098A (ko) | 2018-02-05 | 2020-09-16 | 어플라이드 머티어리얼스, 인코포레이티드 | 3d 프린트된 cmp 패드들을 위한 압전 엔드포인팅 |
| KR20200140931A (ko) | 2018-05-07 | 2020-12-16 | 어플라이드 머티어리얼스, 인코포레이티드 | 친수성 및 제타 전위 조정가능한 화학적 기계적 연마 패드들 |
| US11738423B2 (en) * | 2018-07-31 | 2023-08-29 | Taiwan Semiconductor Manufacturing Co., Ltd. | Chemical mechanical polishing apparatus and method |
| KR20210042171A (ko) | 2018-09-04 | 2021-04-16 | 어플라이드 머티어리얼스, 인코포레이티드 | 진보한 폴리싱 패드들을 위한 제형들 |
| JP7420728B2 (ja) * | 2018-09-28 | 2024-01-23 | 株式会社フジミインコーポレーテッド | 研磨パッド、及びそれを用いた研磨方法 |
| US11331767B2 (en) | 2019-02-01 | 2022-05-17 | Micron Technology, Inc. | Pads for chemical mechanical planarization tools, chemical mechanical planarization tools, and related methods |
| US11851570B2 (en) | 2019-04-12 | 2023-12-26 | Applied Materials, Inc. | Anionic polishing pads formed by printing processes |
| KR102803330B1 (ko) * | 2019-09-04 | 2025-05-07 | 에스케이이노베이션 주식회사 | 식각 조성물, 이를 이용한 절연막의 식각방법 및 반도체 소자의 제조방법 |
| US11813712B2 (en) | 2019-12-20 | 2023-11-14 | Applied Materials, Inc. | Polishing pads having selectively arranged porosity |
| US11806829B2 (en) | 2020-06-19 | 2023-11-07 | Applied Materials, Inc. | Advanced polishing pads and related polishing pad manufacturing methods |
| CN112429803A (zh) * | 2020-11-02 | 2021-03-02 | 湖南长科诚享石化科技有限公司 | 破乳反应器 |
| US11878389B2 (en) | 2021-02-10 | 2024-01-23 | Applied Materials, Inc. | Structures formed using an additive manufacturing process for regenerating surface texture in situ |
| CN115157111B (zh) * | 2022-07-13 | 2024-03-15 | 安徽禾臣新材料有限公司 | 一种玻璃加工用抛光垫及其制备方法 |
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| SG11201608219WA (en) * | 2014-04-03 | 2016-10-28 | 3M Innovative Properties Co | Polishing pads and systems and methods of making and using the same |
-
2014
- 2014-09-23 WO PCT/US2014/056966 patent/WO2015048011A1/en not_active Ceased
- 2014-09-23 US US14/915,650 patent/US10071459B2/en active Active
- 2014-09-23 JP JP2016516918A patent/JP6703939B2/ja active Active
- 2014-09-23 CN CN201480052077.1A patent/CN105579194B/zh active Active
- 2014-09-23 KR KR1020167010339A patent/KR102252673B1/ko active Active
- 2014-09-23 SG SG11201602207QA patent/SG11201602207QA/en unknown
- 2014-09-23 EP EP14848991.7A patent/EP3050082B1/en active Active
- 2014-09-24 TW TW103133088A patent/TWI699257B/zh active