JP2016538139A5 - - Google Patents
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- Publication number
- JP2016538139A5 JP2016538139A5 JP2016516918A JP2016516918A JP2016538139A5 JP 2016538139 A5 JP2016538139 A5 JP 2016538139A5 JP 2016516918 A JP2016516918 A JP 2016516918A JP 2016516918 A JP2016516918 A JP 2016516918A JP 2016538139 A5 JP2016538139 A5 JP 2016538139A5
- Authority
- JP
- Japan
- Prior art keywords
- polishing
- substrate
- polishing pad
- main surface
- base layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005498 polishing Methods 0.000 claims 11
- 239000000758 substrate Substances 0.000 claims 5
- 238000005296 abrasive Methods 0.000 claims 3
- 239000000919 ceramic Substances 0.000 claims 3
- 239000002131 composite material Substances 0.000 claims 2
- 239000012530 fluid Substances 0.000 claims 2
- 239000000969 carrier Substances 0.000 claims 1
- 239000011159 matrix material Substances 0.000 claims 1
- 239000002245 particle Substances 0.000 claims 1
Claims (2)
- 基板を研磨するためのシステムであって、
前記基板を受容して保持するように構成されたキャリヤアセンブリと、
研磨パッドと、
前記研磨パッドが連結された圧盤と、
前記研磨パッドと前記基板との間に配置された研磨溶液と、を含み、
前記研磨パッドは、第１の主表面及び前記第１の主表面と反対側の第２の主表面を有するベース層を含み、
前記研磨溶液は、流体成分、及び、セラミック研磨材複合体を含み、
前記セラミック研磨材複合体は、多孔性セラミックマトリックス中に分散された個別の研磨粒子を含み、かつ、前記流体成分中に分散されており、
研磨作業を行うために前記研磨パッドが前記基板に対して移動可能となるように構成されている、システム。 - 前記研磨パッドが、前記第１の主表面及び前記第２の主表面の一方又は両方から前記ベース層内に延びる複数の空洞を更に含む、請求項１に記載の基板を研磨するためのシステム。
Applications Claiming Priority (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201361882369P | 2013-09-25 | 2013-09-25 | |
| US61/882,369 | 2013-09-25 | ||
| US201361918369P | 2013-12-19 | 2013-12-19 | |
| US61/918,369 | 2013-12-19 | ||
| US201462019068P | 2014-06-30 | 2014-06-30 | |
| US62/019,068 | 2014-06-30 | ||
| PCT/US2014/056966 WO2015048011A1 (en) | 2013-09-25 | 2014-09-23 | Multi-layered polishing pads |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2016538139A JP2016538139A (ja) | 2016-12-08 |
| JP2016538139A5 true JP2016538139A5 (ja) | 2017-11-02 |
| JP6703939B2 JP6703939B2 (ja) | 2020-06-03 |
Family
ID=52744387
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016516918A Active JP6703939B2 (ja) | 2013-09-25 | 2014-09-23 | 研磨システム |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US10071459B2 (ja) |
| EP (1) | EP3050082B1 (ja) |
| JP (1) | JP6703939B2 (ja) |
| KR (1) | KR102252673B1 (ja) |
| CN (1) | CN105579194B (ja) |
| SG (1) | SG11201602207QA (ja) |
| TW (1) | TWI699257B (ja) |
| WO (1) | WO2015048011A1 (ja) |
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| CN117283450A (zh) | 2016-01-19 | 2023-12-26 | 应用材料公司 | 多孔化学机械抛光垫 |
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| KR102608124B1 (ko) * | 2017-08-04 | 2023-11-29 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 향상된 동일 평면성을 갖는 미세복제된 폴리싱 표면 |
| US11072050B2 (en) | 2017-08-04 | 2021-07-27 | Applied Materials, Inc. | Polishing pad with window and manufacturing methods thereof |
| WO2019032286A1 (en) | 2017-08-07 | 2019-02-14 | Applied Materials, Inc. | ABRASIVE DISTRIBUTION POLISHING PADS AND METHODS OF MAKING SAME |
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-
2014
- 2014-09-23 CN CN201480052077.1A patent/CN105579194B/zh active Active
- 2014-09-23 US US14/915,650 patent/US10071459B2/en active Active
- 2014-09-23 KR KR1020167010339A patent/KR102252673B1/ko active IP Right Grant
- 2014-09-23 JP JP2016516918A patent/JP6703939B2/ja active Active
- 2014-09-23 SG SG11201602207QA patent/SG11201602207QA/en unknown
- 2014-09-23 EP EP14848991.7A patent/EP3050082B1/en active Active
- 2014-09-23 WO PCT/US2014/056966 patent/WO2015048011A1/en active Application Filing
- 2014-09-24 TW TW103133088A patent/TWI699257B/zh active
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