JP6703939B2 - 研磨システム - Google Patents

研磨システム Download PDF

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Publication number
JP6703939B2
JP6703939B2 JP2016516918A JP2016516918A JP6703939B2 JP 6703939 B2 JP6703939 B2 JP 6703939B2 JP 2016516918 A JP2016516918 A JP 2016516918A JP 2016516918 A JP2016516918 A JP 2016516918A JP 6703939 B2 JP6703939 B2 JP 6703939B2
Authority
JP
Japan
Prior art keywords
polishing
pad
abrasive
layer
polishing pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2016516918A
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English (en)
Japanese (ja)
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JP2016538139A (ja
JP2016538139A5 (enExample
Inventor
ポール エス． ラグ，
ポール エス． ラグ，
デュイ ケー． レフー，
デュイ ケー． レフー，
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Innovative Properties Co
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of JP2016538139A publication Critical patent/JP2016538139A/ja
Publication of JP2016538139A5 publication Critical patent/JP2016538139A5/ja
Application granted granted Critical
Publication of JP6703939B2 publication Critical patent/JP6703939B2/ja
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Anticipated expiration legal-status Critical

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B24B37/044—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor characterised by the composition of the lapping agent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/402—Chemomechanical polishing [CMP] of semiconductor materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP2016516918A 2013-09-25 2014-09-23 研磨システム Active JP6703939B2 (ja)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
US201361882369P 2013-09-25 2013-09-25
US61/882,369 2013-09-25
US201361918369P 2013-12-19 2013-12-19
US61/918,369 2013-12-19
US201462019068P 2014-06-30 2014-06-30
US62/019,068 2014-06-30
PCT/US2014/056966 WO2015048011A1 (en) 2013-09-25 2014-09-23 Multi-layered polishing pads

Publications (3)

Publication Number Publication Date
JP2016538139A JP2016538139A (ja) 2016-12-08
JP2016538139A5 JP2016538139A5 (enExample) 2017-11-02
JP6703939B2 true JP6703939B2 (ja) 2020-06-03

Family

ID=52744387

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016516918A Active JP6703939B2 (ja) 2013-09-25 2014-09-23 研磨システム

Country Status (8)

Country Link
US (1) US10071459B2 (enExample)
EP (1) EP3050082B1 (enExample)
JP (1) JP6703939B2 (enExample)
KR (1) KR102252673B1 (enExample)
CN (1) CN105579194B (enExample)
SG (1) SG11201602207QA (enExample)
TW (1) TWI699257B (enExample)
WO (1) WO2015048011A1 (enExample)

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US10821573B2 (en) 2014-10-17 2020-11-03 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
US10875153B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Advanced polishing pad materials and formulations
TWI689406B (zh) 2014-10-17 2020-04-01 美商應用材料股份有限公司 研磨墊及製造其之方法
US11745302B2 (en) 2014-10-17 2023-09-05 Applied Materials, Inc. Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process
WO2016060712A1 (en) 2014-10-17 2016-04-21 Applied Materials, Inc. Cmp pad construction with composite material properties using additive manufacturing processes
US10875145B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
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WO2017142805A1 (en) * 2016-02-16 2017-08-24 3M Innovative Properties Company Polishing systems and methods of making and using same
CN109075057B (zh) 2016-03-09 2023-10-20 应用材料公司 垫结构及制造方法
JP6901297B2 (ja) * 2017-03-22 2021-07-14 株式会社フジミインコーポレーテッド 研磨用組成物
US10596763B2 (en) 2017-04-21 2020-03-24 Applied Materials, Inc. Additive manufacturing with array of energy sources
JP7181860B2 (ja) * 2017-05-12 2022-12-01 株式会社クラレ ポリウレタンを含む研磨層とその研磨層の改質方法，研磨パッド及び研磨方法
JP7300441B2 (ja) * 2017-07-11 2023-06-29 スリーエム イノベイティブ プロパティズ カンパニー 適合性コーティングを含む研磨物品及びそれらからのポリッシングシステム
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CN107639554B (zh) * 2017-11-10 2024-12-20 江苏瑞和磨料磨具有限公司 一种粗磨抛光一次完成的双面磨砂布
CN111684571A (zh) 2018-02-05 2020-09-18 应用材料公司 用于3d打印的cmp垫的压电终点指示
JP7373503B2 (ja) 2018-05-07 2023-11-02 アプライド マテリアルズ インコーポレイテッド 親水性及びゼータ電位の調節可能な化学機械研磨パッド
US11738423B2 (en) * 2018-07-31 2023-08-29 Taiwan Semiconductor Manufacturing Co., Ltd. Chemical mechanical polishing apparatus and method
CN112654655A (zh) 2018-09-04 2021-04-13 应用材料公司 先进抛光垫配方
WO2020066671A1 (ja) * 2018-09-28 2020-04-02 株式会社フジミインコーポレーテッド 研磨パッド、及びそれを用いた研磨方法
US11331767B2 (en) 2019-02-01 2022-05-17 Micron Technology, Inc. Pads for chemical mechanical planarization tools, chemical mechanical planarization tools, and related methods
US11851570B2 (en) 2019-04-12 2023-12-26 Applied Materials, Inc. Anionic polishing pads formed by printing processes
KR102803330B1 (ko) * 2019-09-04 2025-05-07 에스케이이노베이션 주식회사 식각 조성물, 이를 이용한 절연막의 식각방법 및 반도체 소자의 제조방법
US11813712B2 (en) 2019-12-20 2023-11-14 Applied Materials, Inc. Polishing pads having selectively arranged porosity
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CN112429803A (zh) * 2020-11-02 2021-03-02 湖南长科诚享石化科技有限公司 破乳反应器
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CN115157111B (zh) * 2022-07-13 2024-03-15 安徽禾臣新材料有限公司 一种玻璃加工用抛光垫及其制备方法
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Also Published As

Publication number Publication date
KR20160060691A (ko) 2016-05-30
JP2016538139A (ja) 2016-12-08
EP3050082A1 (en) 2016-08-03
US20160229023A1 (en) 2016-08-11
CN105579194A (zh) 2016-05-11
EP3050082A4 (en) 2017-05-17
SG11201602207QA (en) 2016-04-28
TWI699257B (zh) 2020-07-21
WO2015048011A1 (en) 2015-04-02
EP3050082B1 (en) 2021-05-05
CN105579194B (zh) 2019-04-26
KR102252673B1 (ko) 2021-05-18
US10071459B2 (en) 2018-09-11
TW201532731A (zh) 2015-09-01

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