JP6703939B2 - 研磨システム - Google Patents

研磨システム Download PDF

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Publication number
JP6703939B2
JP6703939B2 JP2016516918A JP2016516918A JP6703939B2 JP 6703939 B2 JP6703939 B2 JP 6703939B2 JP 2016516918 A JP2016516918 A JP 2016516918A JP 2016516918 A JP2016516918 A JP 2016516918A JP 6703939 B2 JP6703939 B2 JP 6703939B2
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JP
Japan
Prior art keywords
polishing
pad
abrasive
layer
polishing pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2016516918A
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English (en)
Japanese (ja)
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JP2016538139A5 (enExample
JP2016538139A (ja
Inventor
ポール エス. ラグ,
ポール エス. ラグ,
デュイ ケー. レフー,
デュイ ケー. レフー,
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Innovative Properties Co
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3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of JP2016538139A publication Critical patent/JP2016538139A/ja
Publication of JP2016538139A5 publication Critical patent/JP2016538139A5/ja
Application granted granted Critical
Publication of JP6703939B2 publication Critical patent/JP6703939B2/ja
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Anticipated expiration legal-status Critical

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • B24B37/11Lapping tools
    • B24B37/20Lapping pads for working plane surfaces
    • B24B37/22Lapping pads for working plane surfaces characterised by a multi-layered structure
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • B24B37/04Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B24B37/044Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor characterised by the composition of the lapping agent
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • B24B37/11Lapping tools
    • B24B37/20Lapping pads for working plane surfaces
    • B24B37/24Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09GPOLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00Polishing compositions
    • C09G1/02Polishing compositions containing abrasives or grinding agents
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • B24B37/11Lapping tools
    • B24B37/20Lapping pads for working plane surfaces
    • B24B37/26Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
JP2016516918A 2013-09-25 2014-09-23 研磨システム Active JP6703939B2 (ja)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
US201361882369P 2013-09-25 2013-09-25
US61/882,369 2013-09-25
US201361918369P 2013-12-19 2013-12-19
US61/918,369 2013-12-19
US201462019068P 2014-06-30 2014-06-30
US62/019,068 2014-06-30
PCT/US2014/056966 WO2015048011A1 (en) 2013-09-25 2014-09-23 Multi-layered polishing pads

Publications (3)

Publication Number Publication Date
JP2016538139A JP2016538139A (ja) 2016-12-08
JP2016538139A5 JP2016538139A5 (enExample) 2017-11-02
JP6703939B2 true JP6703939B2 (ja) 2020-06-03

Family

ID=52744387

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016516918A Active JP6703939B2 (ja) 2013-09-25 2014-09-23 研磨システム

Country Status (8)

Country Link
US (1) US10071459B2 (enExample)
EP (1) EP3050082B1 (enExample)
JP (1) JP6703939B2 (enExample)
KR (1) KR102252673B1 (enExample)
CN (1) CN105579194B (enExample)
SG (1) SG11201602207QA (enExample)
TW (1) TWI699257B (enExample)
WO (1) WO2015048011A1 (enExample)

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CN111032284B (zh) * 2017-08-04 2022-11-04 3M创新有限公司 具有增强的共平面性的微复制型抛光表面
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CN107639554B (zh) * 2017-11-10 2024-12-20 江苏瑞和磨料磨具有限公司 一种粗磨抛光一次完成的双面磨砂布
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US11738423B2 (en) * 2018-07-31 2023-08-29 Taiwan Semiconductor Manufacturing Co., Ltd. Chemical mechanical polishing apparatus and method
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JP7420728B2 (ja) * 2018-09-28 2024-01-23 株式会社フジミインコーポレーテッド 研磨パッド、及びそれを用いた研磨方法
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KR102803330B1 (ko) * 2019-09-04 2025-05-07 에스케이이노베이션 주식회사 식각 조성물, 이를 이용한 절연막의 식각방법 및 반도체 소자의 제조방법
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CN112429803A (zh) * 2020-11-02 2021-03-02 湖南长科诚享石化科技有限公司 破乳反应器
US11878389B2 (en) 2021-02-10 2024-01-23 Applied Materials, Inc. Structures formed using an additive manufacturing process for regenerating surface texture in situ
CN115157111B (zh) * 2022-07-13 2024-03-15 安徽禾臣新材料有限公司 一种玻璃加工用抛光垫及其制备方法

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Also Published As

Publication number Publication date
CN105579194B (zh) 2019-04-26
SG11201602207QA (en) 2016-04-28
EP3050082B1 (en) 2021-05-05
TW201532731A (zh) 2015-09-01
TWI699257B (zh) 2020-07-21
KR20160060691A (ko) 2016-05-30
WO2015048011A1 (en) 2015-04-02
US20160229023A1 (en) 2016-08-11
US10071459B2 (en) 2018-09-11
EP3050082A1 (en) 2016-08-03
EP3050082A4 (en) 2017-05-17
JP2016538139A (ja) 2016-12-08
CN105579194A (zh) 2016-05-11
KR102252673B1 (ko) 2021-05-18

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