JP2018535104A5 - - Google Patents

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Publication number
JP2018535104A5
JP2018535104A5 JP2018517739A JP2018517739A JP2018535104A5 JP 2018535104 A5 JP2018535104 A5 JP 2018535104A5 JP 2018517739 A JP2018517739 A JP 2018517739A JP 2018517739 A JP2018517739 A JP 2018517739A JP 2018535104 A5 JP2018535104 A5 JP 2018535104A5
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JP
Japan
Prior art keywords
polishing
substrate
polishing pad
polymer
preparing
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JP2018517739A
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English (en)
Japanese (ja)
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JP2018535104A (ja
JP6949833B2 (ja
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Priority claimed from PCT/US2016/055908 external-priority patent/WO2017062719A1/en
Publication of JP2018535104A publication Critical patent/JP2018535104A/ja
Publication of JP2018535104A5 publication Critical patent/JP2018535104A5/ja
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Publication of JP6949833B2 publication Critical patent/JP6949833B2/ja
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JP2018517739A 2015-10-07 2016-10-07 研磨パッド及びシステム、並びにその製造方法及び使用方法 Active JP6949833B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201562238668P 2015-10-07 2015-10-07
US62/238,668 2015-10-07
US201562266963P 2015-12-14 2015-12-14
US62/266,963 2015-12-14
PCT/US2016/055908 WO2017062719A1 (en) 2015-10-07 2016-10-07 Polishing pads and systems and methods of making and using the same

Publications (3)

Publication Number Publication Date
JP2018535104A JP2018535104A (ja) 2018-11-29
JP2018535104A5 true JP2018535104A5 (enExample) 2019-11-14
JP6949833B2 JP6949833B2 (ja) 2021-10-13

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Family Applications (1)

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JP2018517739A Active JP6949833B2 (ja) 2015-10-07 2016-10-07 研磨パッド及びシステム、並びにその製造方法及び使用方法

Country Status (7)

Country Link
US (1) US11154959B2 (enExample)
EP (1) EP3359335B1 (enExample)
JP (1) JP6949833B2 (enExample)
KR (1) KR102615968B1 (enExample)
CN (1) CN108136564B (enExample)
TW (1) TWI769988B (enExample)
WO (1) WO2017062719A1 (enExample)

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WO2019038675A1 (en) 2017-08-25 2019-02-28 3M Innovative Properties Company SURFACE SURFACE SURFACE POLISHING PAD
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TWI658585B (zh) * 2018-03-30 2019-05-01 世界先進積體電路股份有限公司 半導體結構及其製造方法
CN108972381A (zh) * 2018-07-26 2018-12-11 成都时代立夫科技有限公司 一种cmp抛光垫封边工艺
US11158533B2 (en) 2018-11-07 2021-10-26 Vanguard International Semiconductor Corporation Semiconductor structures and fabrication method thereof
US11331767B2 (en) 2019-02-01 2022-05-17 Micron Technology, Inc. Pads for chemical mechanical planarization tools, chemical mechanical planarization tools, and related methods
TWI850338B (zh) * 2019-02-28 2024-08-01 美商應用材料股份有限公司 拋光墊、化學機械拋光系統、及控制拋光墊的背襯層的剛度的方法
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WO2021260629A1 (en) * 2020-06-25 2021-12-30 3M Innovative Properties Company Polishing pads and systems for and methods of using same
DE102020209519A1 (de) * 2020-07-29 2022-02-03 Robert Bosch Gesellschaft mit beschränkter Haftung Verfahren zur Herstellung eines Schaumschleifmittels und Schaumschleifmittel
IT202100007232A1 (it) * 2021-03-25 2022-09-25 Surfaces Tech Abrasives S P A Modulo abrasivo e relativa cinghia modulare
KR102538440B1 (ko) * 2021-05-26 2023-05-30 에스케이엔펄스 주식회사 연마 시스템, 연마 패드 및 반도체 소자의 제조방법
US12162118B2 (en) 2021-07-01 2024-12-10 Creeley Patent Llc Flexible density sanding system
KR102594068B1 (ko) * 2021-10-12 2023-10-24 에스케이엔펄스 주식회사 연마패드 및 이를 이용한 반도체 소자의 제조방법
JP7441916B2 (ja) * 2021-10-12 2024-03-01 エスケー エンパルス カンパニー リミテッド 研磨パッドおよびこれを用いた半導体素子の製造方法
WO2023085470A1 (ko) * 2021-11-12 2023-05-19 케이피엑스케미칼 주식회사 탄소나노튜브로 결속된 고내마모성 박막 코팅을 포함하는 복합 연마패드 및 이의 제조방법
US20240253178A1 (en) * 2021-11-12 2024-08-01 Kpx Chemical Co., Ltd. Composite polishing pad including carbon nanotubes, and method for producing same
CN118613348A (zh) * 2021-12-31 2024-09-06 3M创新有限公司 包括氟化聚合物窗口的微复制型抛光垫
TWI841907B (zh) * 2022-01-17 2024-05-11 貝達先進材料股份有限公司 研磨墊、製造研磨墊之方法及研磨裝置
KR20230166405A (ko) 2022-05-30 2023-12-07 삼성전자주식회사 연마 패드 및 이를 포함하는 기판 처리 장치

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