KR102615968B1 - 폴리싱 패드 및 시스템과 이의 제조 및 사용 방법 - Google Patents

폴리싱 패드 및 시스템과 이의 제조 및 사용 방법 Download PDF

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Publication number
KR102615968B1
KR102615968B1 KR1020187012529A KR20187012529A KR102615968B1 KR 102615968 B1 KR102615968 B1 KR 102615968B1 KR 1020187012529 A KR1020187012529 A KR 1020187012529A KR 20187012529 A KR20187012529 A KR 20187012529A KR 102615968 B1 KR102615968 B1 KR 102615968B1
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South Korea
Prior art keywords
polishing
less
layer
micrometers
polishing pad
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Korean (ko)
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KR20180066126A (ko
Inventor
두이 케이 레후
데이비드 에프 슬라마
Original Assignee
쓰리엠 이노베이티브 프로퍼티즈 컴파니
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Publication of KR20180066126A publication Critical patent/KR20180066126A/ko
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B24B37/245—Pads with fixed abrasives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B24D11/02—Backings, e.g. foils, webs, mesh fabrics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
    • B24D3/28—Resins or natural or synthetic macromolecular compounds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • B24D18/0009—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for using moulds or presses
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
KR1020187012529A 2015-10-07 2016-10-07 폴리싱 패드 및 시스템과 이의 제조 및 사용 방법 Active KR102615968B1 (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201562238668P 2015-10-07 2015-10-07
US62/238,668 2015-10-07
US201562266963P 2015-12-14 2015-12-14
US62/266,963 2015-12-14
PCT/US2016/055908 WO2017062719A1 (en) 2015-10-07 2016-10-07 Polishing pads and systems and methods of making and using the same

Publications (2)

Publication Number Publication Date
KR20180066126A KR20180066126A (ko) 2018-06-18
KR102615968B1 true KR102615968B1 (ko) 2023-12-19

Family

ID=57178518

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020187012529A Active KR102615968B1 (ko) 2015-10-07 2016-10-07 폴리싱 패드 및 시스템과 이의 제조 및 사용 방법

Country Status (7)

Country Link
US (1) US11154959B2 (enExample)
EP (1) EP3359335B1 (enExample)
JP (1) JP6949833B2 (enExample)
KR (1) KR102615968B1 (enExample)
CN (1) CN108136564B (enExample)
TW (1) TWI769988B (enExample)
WO (1) WO2017062719A1 (enExample)

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TWI626117B (zh) * 2017-01-19 2018-06-11 智勝科技股份有限公司 研磨墊及研磨方法
JP7165719B2 (ja) * 2017-08-04 2022-11-04 スリーエム イノベイティブ プロパティズ カンパニー 平坦性が向上された微細複製研磨表面
TWI650202B (zh) * 2017-08-22 2019-02-11 智勝科技股份有限公司 研磨墊、研磨墊的製造方法及研磨方法
WO2019038675A1 (en) 2017-08-25 2019-02-28 3M Innovative Properties Company SURFACE SURFACE SURFACE POLISHING PAD
US11685013B2 (en) * 2018-01-24 2023-06-27 Taiwan Semiconductor Manufacturing Company, Ltd. Polishing pad for chemical mechanical planarization
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CN108972381A (zh) * 2018-07-26 2018-12-11 成都时代立夫科技有限公司 一种cmp抛光垫封边工艺
US11158533B2 (en) 2018-11-07 2021-10-26 Vanguard International Semiconductor Corporation Semiconductor structures and fabrication method thereof
US11331767B2 (en) 2019-02-01 2022-05-17 Micron Technology, Inc. Pads for chemical mechanical planarization tools, chemical mechanical planarization tools, and related methods
TWI850338B (zh) * 2019-02-28 2024-08-01 美商應用材料股份有限公司 拋光墊、化學機械拋光系統、及控制拋光墊的背襯層的剛度的方法
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DE102020209519A1 (de) * 2020-07-29 2022-02-03 Robert Bosch Gesellschaft mit beschränkter Haftung Verfahren zur Herstellung eines Schaumschleifmittels und Schaumschleifmittel
IT202100007232A1 (it) * 2021-03-25 2022-09-25 Surfaces Tech Abrasives S P A Modulo abrasivo e relativa cinghia modulare
KR102538440B1 (ko) * 2021-05-26 2023-05-30 에스케이엔펄스 주식회사 연마 시스템, 연마 패드 및 반도체 소자의 제조방법
US12162118B2 (en) 2021-07-01 2024-12-10 Creeley Patent Llc Flexible density sanding system
KR102594068B1 (ko) * 2021-10-12 2023-10-24 에스케이엔펄스 주식회사 연마패드 및 이를 이용한 반도체 소자의 제조방법
JP7441916B2 (ja) * 2021-10-12 2024-03-01 エスケー エンパルス カンパニー リミテッド 研磨パッドおよびこれを用いた半導体素子の製造方法
WO2023085470A1 (ko) * 2021-11-12 2023-05-19 케이피엑스케미칼 주식회사 탄소나노튜브로 결속된 고내마모성 박막 코팅을 포함하는 복합 연마패드 및 이의 제조방법
US20240253178A1 (en) * 2021-11-12 2024-08-01 Kpx Chemical Co., Ltd. Composite polishing pad including carbon nanotubes, and method for producing same
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TWI841907B (zh) * 2022-01-17 2024-05-11 貝達先進材料股份有限公司 研磨墊、製造研磨墊之方法及研磨裝置
KR20230166405A (ko) 2022-05-30 2023-12-07 삼성전자주식회사 연마 패드 및 이를 포함하는 기판 처리 장치

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Also Published As

Publication number Publication date
CN108136564B (zh) 2021-06-22
WO2017062719A1 (en) 2017-04-13
JP2018535104A (ja) 2018-11-29
US11154959B2 (en) 2021-10-26
CN108136564A (zh) 2018-06-08
EP3359335B1 (en) 2023-07-05
US20180281148A1 (en) 2018-10-04
JP6949833B2 (ja) 2021-10-13
EP3359335A1 (en) 2018-08-15
TW201726316A (zh) 2017-08-01
TWI769988B (zh) 2022-07-11
KR20180066126A (ko) 2018-06-18

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