KR102615968B1 - 폴리싱 패드 및 시스템과 이의 제조 및 사용 방법 - Google Patents

폴리싱 패드 및 시스템과 이의 제조 및 사용 방법 Download PDF

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Publication number
KR102615968B1
KR102615968B1 KR1020187012529A KR20187012529A KR102615968B1 KR 102615968 B1 KR102615968 B1 KR 102615968B1 KR 1020187012529 A KR1020187012529 A KR 1020187012529A KR 20187012529 A KR20187012529 A KR 20187012529A KR 102615968 B1 KR102615968 B1 KR 102615968B1
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South Korea
Prior art keywords
polishing
less
layer
micrometers
polishing pad
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Korean (ko)
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KR20180066126A (ko
Inventor
두이 케이 레후
데이비드 에프 슬라마
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쓰리엠 이노베이티브 프로퍼티즈 컴파니
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Publication of KR20180066126A publication Critical patent/KR20180066126A/ko
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B24B37/245—Pads with fixed abrasives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B24D11/02—Backings, e.g. foils, webs, mesh fabrics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
    • B24D3/28—Resins or natural or synthetic macromolecular compounds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • B24D18/0009—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for using moulds or presses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
KR1020187012529A 2015-10-07 2016-10-07 폴리싱 패드 및 시스템과 이의 제조 및 사용 방법 Active KR102615968B1 (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201562238668P 2015-10-07 2015-10-07
US62/238,668 2015-10-07
US201562266963P 2015-12-14 2015-12-14
US62/266,963 2015-12-14
PCT/US2016/055908 WO2017062719A1 (en) 2015-10-07 2016-10-07 Polishing pads and systems and methods of making and using the same

Publications (2)

Publication Number Publication Date
KR20180066126A KR20180066126A (ko) 2018-06-18
KR102615968B1 true KR102615968B1 (ko) 2023-12-19

Family

ID=57178518

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020187012529A Active KR102615968B1 (ko) 2015-10-07 2016-10-07 폴리싱 패드 및 시스템과 이의 제조 및 사용 방법

Country Status (7)

Country Link
US (1) US11154959B2 (enExample)
EP (1) EP3359335B1 (enExample)
JP (1) JP6949833B2 (enExample)
KR (1) KR102615968B1 (enExample)
CN (1) CN108136564B (enExample)
TW (1) TWI769988B (enExample)
WO (1) WO2017062719A1 (enExample)

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TWI626117B (zh) * 2017-01-19 2018-06-11 智勝科技股份有限公司 研磨墊及研磨方法
CN111032284B (zh) * 2017-08-04 2022-11-04 3M创新有限公司 具有增强的共平面性的微复制型抛光表面
TWI650202B (zh) * 2017-08-22 2019-02-11 智勝科技股份有限公司 研磨墊、研磨墊的製造方法及研磨方法
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US11685013B2 (en) * 2018-01-24 2023-06-27 Taiwan Semiconductor Manufacturing Company, Ltd. Polishing pad for chemical mechanical planarization
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US12186855B2 (en) * 2019-06-19 2025-01-07 Kuraray Co., Ltd. Polishing pad, method for manufacturing polishing pad, and polishing method
DE102019218560A1 (de) * 2019-11-29 2021-06-02 Robert Bosch Gmbh Schaumschleifmittel und Verfahren zur Herstellung
US11448391B2 (en) 2019-12-27 2022-09-20 Creeley Patent Llc Illuminating drywall sponge device
TWI717183B (zh) * 2020-01-03 2021-01-21 銓科光電材料股份有限公司 晶圓拋光墊
KR20230028318A (ko) * 2020-06-25 2023-02-28 쓰리엠 이노베이티브 프로퍼티즈 컴파니 폴리싱 패드 및 이를 사용하는 시스템 및 방법
DE102020209519A1 (de) * 2020-07-29 2022-02-03 Robert Bosch Gesellschaft mit beschränkter Haftung Verfahren zur Herstellung eines Schaumschleifmittels und Schaumschleifmittel
KR102538440B1 (ko) * 2021-05-26 2023-05-30 에스케이엔펄스 주식회사 연마 시스템, 연마 패드 및 반도체 소자의 제조방법
WO2023279053A1 (en) 2021-07-01 2023-01-05 Creeley Patent Llc Flexible density sanding system
JP7441916B2 (ja) * 2021-10-12 2024-03-01 エスケー エンパルス カンパニー リミテッド 研磨パッドおよびこれを用いた半導体素子の製造方法
US20240217056A1 (en) * 2021-11-12 2024-07-04 Kpx Chemical Co., Ltd. Composite polishing pad including highly abrasion-resistant thin film coating bound with carbon nanotubes, and method for producing same
JP2024522338A (ja) * 2021-11-12 2024-06-18 ケーピーエックス ケミカル カンパニー リミテッド カーボンナノチューブを含む複合研磨パッド及びその製造方法
KR20240132321A (ko) * 2021-12-31 2024-09-03 쓰리엠 이노베이티브 프로퍼티즈 컴파니 플루오르화 중합체 윈도우를 포함하는 미세복제된 폴리싱 패드
TWI841907B (zh) * 2022-01-17 2024-05-11 貝達先進材料股份有限公司 研磨墊、製造研磨墊之方法及研磨裝置

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Also Published As

Publication number Publication date
KR20180066126A (ko) 2018-06-18
TW201726316A (zh) 2017-08-01
CN108136564A (zh) 2018-06-08
EP3359335A1 (en) 2018-08-15
TWI769988B (zh) 2022-07-11
US20180281148A1 (en) 2018-10-04
JP6949833B2 (ja) 2021-10-13
JP2018535104A (ja) 2018-11-29
US11154959B2 (en) 2021-10-26
WO2017062719A1 (en) 2017-04-13
CN108136564B (zh) 2021-06-22
EP3359335B1 (en) 2023-07-05

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