JP6949833B2 - 研磨パッド及びシステム、並びにその製造方法及び使用方法 - Google Patents

研磨パッド及びシステム、並びにその製造方法及び使用方法 Download PDF

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Publication number
JP6949833B2
JP6949833B2 JP2018517739A JP2018517739A JP6949833B2 JP 6949833 B2 JP6949833 B2 JP 6949833B2 JP 2018517739 A JP2018517739 A JP 2018517739A JP 2018517739 A JP2018517739 A JP 2018517739A JP 6949833 B2 JP6949833 B2 JP 6949833B2
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Japan
Prior art keywords
polishing
less
layer
pad
polishing pad
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JP2018517739A
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English (en)
Japanese (ja)
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JP2018535104A5 (enExample
JP2018535104A (ja
Inventor
デュイ ケー． ルフー，
デュイ ケー． ルフー，
デイビッド エフ． スラマ，
デイビッド エフ． スラマ，
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3M Innovative Properties Co
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3M Innovative Properties Co
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Publication of JP2018535104A5 publication Critical patent/JP2018535104A5/ja
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B24B37/245—Pads with fixed abrasives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B24D11/02—Backings, e.g. foils, webs, mesh fabrics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
    • B24D3/28—Resins or natural or synthetic macromolecular compounds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • B24D18/0009—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for using moulds or presses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
JP2018517739A 2015-10-07 2016-10-07 研磨パッド及びシステム、並びにその製造方法及び使用方法 Active JP6949833B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201562238668P 2015-10-07 2015-10-07
US62/238,668 2015-10-07
US201562266963P 2015-12-14 2015-12-14
US62/266,963 2015-12-14
PCT/US2016/055908 WO2017062719A1 (en) 2015-10-07 2016-10-07 Polishing pads and systems and methods of making and using the same

Publications (3)

Publication Number Publication Date
JP2018535104A JP2018535104A (ja) 2018-11-29
JP2018535104A5 JP2018535104A5 (enExample) 2019-11-14
JP6949833B2 true JP6949833B2 (ja) 2021-10-13

Family

ID=57178518

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018517739A Active JP6949833B2 (ja) 2015-10-07 2016-10-07 研磨パッド及びシステム、並びにその製造方法及び使用方法

Country Status (7)

Country Link
US (1) US11154959B2 (enExample)
EP (1) EP3359335B1 (enExample)
JP (1) JP6949833B2 (enExample)
KR (1) KR102615968B1 (enExample)
CN (1) CN108136564B (enExample)
TW (1) TWI769988B (enExample)
WO (1) WO2017062719A1 (enExample)

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WO2017073556A1 (ja) * 2015-10-27 2017-05-04 富士紡ホールディングス株式会社 ラッピング材及びその製造方法、並びに、研磨物の製造方法
TWI626117B (zh) * 2017-01-19 2018-06-11 智勝科技股份有限公司 研磨墊及研磨方法
KR102608124B1 (ko) * 2017-08-04 2023-11-29 쓰리엠 이노베이티브 프로퍼티즈 컴파니 향상된 동일 평면성을 갖는 미세복제된 폴리싱 표면
TWI650202B (zh) * 2017-08-22 2019-02-11 智勝科技股份有限公司 研磨墊、研磨墊的製造方法及研磨方法
CN111032285B (zh) * 2017-08-25 2022-07-19 3M创新有限公司 表面突起抛光垫
US11685013B2 (en) * 2018-01-24 2023-06-27 Taiwan Semiconductor Manufacturing Company, Ltd. Polishing pad for chemical mechanical planarization
TWI658585B (zh) * 2018-03-30 2019-05-01 世界先進積體電路股份有限公司 半導體結構及其製造方法
CN108972381A (zh) * 2018-07-26 2018-12-11 成都时代立夫科技有限公司 一种cmp抛光垫封边工艺
US11158533B2 (en) 2018-11-07 2021-10-26 Vanguard International Semiconductor Corporation Semiconductor structures and fabrication method thereof
US11331767B2 (en) 2019-02-01 2022-05-17 Micron Technology, Inc. Pads for chemical mechanical planarization tools, chemical mechanical planarization tools, and related methods
TWI850338B (zh) 2019-02-28 2024-08-01 美商應用材料股份有限公司 拋光墊、化學機械拋光系統、及控制拋光墊的背襯層的剛度的方法
WO2020255744A1 (ja) * 2019-06-19 2020-12-24 株式会社クラレ 研磨パッド、研磨パッドの製造方法及び研磨方法
DE102019218560A1 (de) * 2019-11-29 2021-06-02 Robert Bosch Gmbh Schaumschleifmittel und Verfahren zur Herstellung
US11448391B2 (en) 2019-12-27 2022-09-20 Creeley Patent Llc Illuminating drywall sponge device
TWI717183B (zh) * 2020-01-03 2021-01-21 銓科光電材料股份有限公司 晶圓拋光墊
KR20230028318A (ko) * 2020-06-25 2023-02-28 쓰리엠 이노베이티브 프로퍼티즈 컴파니 폴리싱 패드 및 이를 사용하는 시스템 및 방법
DE102020209519A1 (de) * 2020-07-29 2022-02-03 Robert Bosch Gesellschaft mit beschränkter Haftung Verfahren zur Herstellung eines Schaumschleifmittels und Schaumschleifmittel
KR102538440B1 (ko) * 2021-05-26 2023-05-30 에스케이엔펄스 주식회사 연마 시스템, 연마 패드 및 반도체 소자의 제조방법
US12162118B2 (en) 2021-07-01 2024-12-10 Creeley Patent Llc Flexible density sanding system
JP7441916B2 (ja) * 2021-10-12 2024-03-01 エスケー エンパルス カンパニー リミテッド 研磨パッドおよびこれを用いた半導体素子の製造方法
CN117794686A (zh) * 2021-11-12 2024-03-29 韩商Kpx化学股份有限公司 包括与碳纳米管结合的高耐磨薄膜涂层的复合抛光垫和生产该复合抛光垫的方法
US20240253178A1 (en) * 2021-11-12 2024-08-01 Kpx Chemical Co., Ltd. Composite polishing pad including carbon nanotubes, and method for producing same
US20250033162A1 (en) * 2021-12-31 2025-01-30 3M Innovative Properties Company Microreplicated polishing pad including fluorinated polymer window
TWI841907B (zh) * 2022-01-17 2024-05-11 貝達先進材料股份有限公司 研磨墊、製造研磨墊之方法及研磨裝置

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Also Published As

Publication number Publication date
EP3359335B1 (en) 2023-07-05
WO2017062719A1 (en) 2017-04-13
KR102615968B1 (ko) 2023-12-19
EP3359335A1 (en) 2018-08-15
TWI769988B (zh) 2022-07-11
KR20180066126A (ko) 2018-06-18
CN108136564B (zh) 2021-06-22
JP2018535104A (ja) 2018-11-29
TW201726316A (zh) 2017-08-01
US11154959B2 (en) 2021-10-26
US20180281148A1 (en) 2018-10-04
CN108136564A (zh) 2018-06-08

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