TWI769988B - 拋光墊與系統及其製造與使用方法 - Google Patents

拋光墊與系統及其製造與使用方法 Download PDF

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Publication number
TWI769988B
TWI769988B TW105132463A TW105132463A TWI769988B TW I769988 B TWI769988 B TW I769988B TW 105132463 A TW105132463 A TW 105132463A TW 105132463 A TW105132463 A TW 105132463A TW I769988 B TWI769988 B TW I769988B
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TW
Taiwan
Prior art keywords
polishing
layer
polishing pad
less
microns
Prior art date
Application number
TW105132463A
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English (en)
Chinese (zh)
Other versions
TW201726316A (zh
Inventor
達 卡 雷虎
大衛 法蘭克 斯拉瑪
Original Assignee
美商3M新設資產公司
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Application filed by 美商3M新設資產公司 filed Critical 美商3M新設資產公司
Publication of TW201726316A publication Critical patent/TW201726316A/zh
Application granted granted Critical
Publication of TWI769988B publication Critical patent/TWI769988B/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B24B37/245—Pads with fixed abrasives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B24D11/02—Backings, e.g. foils, webs, mesh fabrics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
    • B24D3/28—Resins or natural or synthetic macromolecular compounds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • B24D18/0009—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for using moulds or presses
    • H10P52/00—

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
TW105132463A 2015-10-07 2016-10-06 拋光墊與系統及其製造與使用方法 TWI769988B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US201562238668P 2015-10-07 2015-10-07
US62/238,668 2015-10-07
US201562266963P 2015-12-14 2015-12-14
US62/266,963 2015-12-14

Publications (2)

Publication Number Publication Date
TW201726316A TW201726316A (zh) 2017-08-01
TWI769988B true TWI769988B (zh) 2022-07-11

Family

ID=57178518

Family Applications (1)

Application Number Title Priority Date Filing Date
TW105132463A TWI769988B (zh) 2015-10-07 2016-10-06 拋光墊與系統及其製造與使用方法

Country Status (7)

Country Link
US (1) US11154959B2 (enExample)
EP (1) EP3359335B1 (enExample)
JP (1) JP6949833B2 (enExample)
KR (1) KR102615968B1 (enExample)
CN (1) CN108136564B (enExample)
TW (1) TWI769988B (enExample)
WO (1) WO2017062719A1 (enExample)

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TWI650202B (zh) * 2017-08-22 2019-02-11 智勝科技股份有限公司 研磨墊、研磨墊的製造方法及研磨方法
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US11685013B2 (en) * 2018-01-24 2023-06-27 Taiwan Semiconductor Manufacturing Company, Ltd. Polishing pad for chemical mechanical planarization
TWI658585B (zh) * 2018-03-30 2019-05-01 世界先進積體電路股份有限公司 半導體結構及其製造方法
CN108972381A (zh) * 2018-07-26 2018-12-11 成都时代立夫科技有限公司 一种cmp抛光垫封边工艺
US11158533B2 (en) 2018-11-07 2021-10-26 Vanguard International Semiconductor Corporation Semiconductor structures and fabrication method thereof
US11331767B2 (en) 2019-02-01 2022-05-17 Micron Technology, Inc. Pads for chemical mechanical planarization tools, chemical mechanical planarization tools, and related methods
TWI850338B (zh) 2019-02-28 2024-08-01 美商應用材料股份有限公司 拋光墊、化學機械拋光系統、及控制拋光墊的背襯層的剛度的方法
WO2020255744A1 (ja) * 2019-06-19 2020-12-24 株式会社クラレ 研磨パッド、研磨パッドの製造方法及び研磨方法
DE102019218560A1 (de) * 2019-11-29 2021-06-02 Robert Bosch Gmbh Schaumschleifmittel und Verfahren zur Herstellung
US11448391B2 (en) 2019-12-27 2022-09-20 Creeley Patent Llc Illuminating drywall sponge device
TWI717183B (zh) * 2020-01-03 2021-01-21 銓科光電材料股份有限公司 晶圓拋光墊
US20230211455A1 (en) * 2020-06-25 2023-07-06 3M Innovative Properties Company Polishing pads and systems for and methods of using same
DE102020209519A1 (de) * 2020-07-29 2022-02-03 Robert Bosch Gesellschaft mit beschränkter Haftung Verfahren zur Herstellung eines Schaumschleifmittels und Schaumschleifmittel
KR102538440B1 (ko) * 2021-05-26 2023-05-30 에스케이엔펄스 주식회사 연마 시스템, 연마 패드 및 반도체 소자의 제조방법
US12162118B2 (en) 2021-07-01 2024-12-10 Creeley Patent Llc Flexible density sanding system
KR102594068B1 (ko) * 2021-10-12 2023-10-24 에스케이엔펄스 주식회사 연마패드 및 이를 이용한 반도체 소자의 제조방법
JP7441916B2 (ja) * 2021-10-12 2024-03-01 エスケー エンパルス カンパニー リミテッド 研磨パッドおよびこれを用いた半導体素子の製造方法
US20240253178A1 (en) * 2021-11-12 2024-08-01 Kpx Chemical Co., Ltd. Composite polishing pad including carbon nanotubes, and method for producing same
WO2023085470A1 (ko) * 2021-11-12 2023-05-19 케이피엑스케미칼 주식회사 탄소나노튜브로 결속된 고내마모성 박막 코팅을 포함하는 복합 연마패드 및 이의 제조방법
US20250033162A1 (en) * 2021-12-31 2025-01-30 3M Innovative Properties Company Microreplicated polishing pad including fluorinated polymer window
TWI841907B (zh) * 2022-01-17 2024-05-11 貝達先進材料股份有限公司 研磨墊、製造研磨墊之方法及研磨裝置

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TW201505758A (zh) * 2013-03-07 2015-02-16 羅門哈斯電子材料Ｃｍｐ控股公司 具有寬譜終點偵測窗之多層化學機械硏磨墊

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JP2001512057A (ja) * 1997-07-30 2001-08-21 スキャッパ、グループ、ピー・エル・シー 半導体ウエハーの研磨
US20020031984A1 (en) * 1997-12-30 2002-03-14 Moore Scott E. Method and apparatus for mechanical and chemical-mechanical planarization of microelectronic substrates
TW200406287A (en) * 2002-06-07 2004-05-01 Praxair Technology Inc Subpad having robust, sealed edges
US7226345B1 (en) * 2005-12-09 2007-06-05 The Regents Of The University Of California CMP pad with designed surface features
TW201505758A (zh) * 2013-03-07 2015-02-16 羅門哈斯電子材料Ｃｍｐ控股公司 具有寬譜終點偵測窗之多層化學機械硏磨墊

Also Published As

Publication number Publication date
KR20180066126A (ko) 2018-06-18
US11154959B2 (en) 2021-10-26
US20180281148A1 (en) 2018-10-04
JP6949833B2 (ja) 2021-10-13
EP3359335A1 (en) 2018-08-15
EP3359335B1 (en) 2023-07-05
TW201726316A (zh) 2017-08-01
KR102615968B1 (ko) 2023-12-19
CN108136564A (zh) 2018-06-08
WO2017062719A1 (en) 2017-04-13
JP2018535104A (ja) 2018-11-29
CN108136564B (zh) 2021-06-22

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