TWI769988B - 拋光墊與系統及其製造與使用方法 - Google Patents

拋光墊與系統及其製造與使用方法 Download PDF

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Publication number
TWI769988B
TWI769988B TW105132463A TW105132463A TWI769988B TW I769988 B TWI769988 B TW I769988B TW 105132463 A TW105132463 A TW 105132463A TW 105132463 A TW105132463 A TW 105132463A TW I769988 B TWI769988 B TW I769988B
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TW
Taiwan
Prior art keywords
polishing
layer
polishing pad
less
microns
Prior art date
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TW105132463A
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English (en)
Chinese (zh)
Other versions
TW201726316A (zh
Inventor
達 卡 雷虎
大衛 法蘭克 斯拉瑪
Original Assignee
美商3M新設資產公司
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Publication date
Application filed by 美商3M新設資產公司 filed Critical 美商3M新設資產公司
Publication of TW201726316A publication Critical patent/TW201726316A/zh
Application granted granted Critical
Publication of TWI769988B publication Critical patent/TWI769988B/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B24B37/245—Pads with fixed abrasives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B24D11/02—Backings, e.g. foils, webs, mesh fabrics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
    • B24D3/28—Resins or natural or synthetic macromolecular compounds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • B24D18/0009—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for using moulds or presses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
TW105132463A 2015-10-07 2016-10-06 拋光墊與系統及其製造與使用方法 TWI769988B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US201562238668P 2015-10-07 2015-10-07
US62/238,668 2015-10-07
US201562266963P 2015-12-14 2015-12-14
US62/266,963 2015-12-14

Publications (2)

Publication Number Publication Date
TW201726316A TW201726316A (zh) 2017-08-01
TWI769988B true TWI769988B (zh) 2022-07-11

Family

ID=57178518

Family Applications (1)

Application Number Title Priority Date Filing Date
TW105132463A TWI769988B (zh) 2015-10-07 2016-10-06 拋光墊與系統及其製造與使用方法

Country Status (7)

Country Link
US (1) US11154959B2 (enExample)
EP (1) EP3359335B1 (enExample)
JP (1) JP6949833B2 (enExample)
KR (1) KR102615968B1 (enExample)
CN (1) CN108136564B (enExample)
TW (1) TWI769988B (enExample)
WO (1) WO2017062719A1 (enExample)

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JP7273796B2 (ja) * 2017-08-25 2023-05-15 スリーエム イノベイティブ プロパティズ カンパニー 表面突起研磨パッド
US11685013B2 (en) * 2018-01-24 2023-06-27 Taiwan Semiconductor Manufacturing Company, Ltd. Polishing pad for chemical mechanical planarization
TWI658585B (zh) * 2018-03-30 2019-05-01 世界先進積體電路股份有限公司 半導體結構及其製造方法
CN108972381A (zh) * 2018-07-26 2018-12-11 成都时代立夫科技有限公司 一种cmp抛光垫封边工艺
US11158533B2 (en) 2018-11-07 2021-10-26 Vanguard International Semiconductor Corporation Semiconductor structures and fabrication method thereof
US11331767B2 (en) * 2019-02-01 2022-05-17 Micron Technology, Inc. Pads for chemical mechanical planarization tools, chemical mechanical planarization tools, and related methods
TWI850338B (zh) 2019-02-28 2024-08-01 美商應用材料股份有限公司 拋光墊、化學機械拋光系統、及控制拋光墊的背襯層的剛度的方法
KR102674356B1 (ko) * 2019-06-19 2024-06-11 주식회사 쿠라레 연마 패드, 연마 패드의 제조 방법 및 연마 방법
DE102019218560A1 (de) * 2019-11-29 2021-06-02 Robert Bosch Gmbh Schaumschleifmittel und Verfahren zur Herstellung
US11448391B2 (en) 2019-12-27 2022-09-20 Creeley Patent Llc Illuminating drywall sponge device
TWI717183B (zh) * 2020-01-03 2021-01-21 銓科光電材料股份有限公司 晶圓拋光墊
WO2021260629A1 (en) * 2020-06-25 2021-12-30 3M Innovative Properties Company Polishing pads and systems for and methods of using same
DE102020209519A1 (de) * 2020-07-29 2022-02-03 Robert Bosch Gesellschaft mit beschränkter Haftung Verfahren zur Herstellung eines Schaumschleifmittels und Schaumschleifmittel
KR102538440B1 (ko) * 2021-05-26 2023-05-30 에스케이엔펄스 주식회사 연마 시스템, 연마 패드 및 반도체 소자의 제조방법
US12162118B2 (en) 2021-07-01 2024-12-10 Creeley Patent Llc Flexible density sanding system
JP7441916B2 (ja) * 2021-10-12 2024-03-01 エスケー エンパルス カンパニー リミテッド 研磨パッドおよびこれを用いた半導体素子の製造方法
EP4431235A4 (en) * 2021-11-12 2025-09-10 Kpx Chemical Co Ltd COMPOSITE POLISHING PAD HAVING A HIGHLY ABRASION-RESISTANT THIN FILM COATING BONDED WITH CARBON NANOTUBES, AND PROCESS FOR PRODUCING THE SAME
CN117545591A (zh) * 2021-11-12 2024-02-09 韩商Kpx化学股份有限公司 包括碳纳米管的复合抛光垫及其生产方法
KR20240132321A (ko) * 2021-12-31 2024-09-03 쓰리엠 이노베이티브 프로퍼티즈 컴파니 플루오르화 중합체 윈도우를 포함하는 미세복제된 폴리싱 패드
TWI841907B (zh) * 2022-01-17 2024-05-11 貝達先進材料股份有限公司 研磨墊、製造研磨墊之方法及研磨裝置

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TW201505758A (zh) * 2013-03-07 2015-02-16 羅門哈斯電子材料Ｃｍｐ控股公司 具有寬譜終點偵測窗之多層化學機械硏磨墊

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US20020031984A1 (en) * 1997-12-30 2002-03-14 Moore Scott E. Method and apparatus for mechanical and chemical-mechanical planarization of microelectronic substrates
TW200406287A (en) * 2002-06-07 2004-05-01 Praxair Technology Inc Subpad having robust, sealed edges
US7226345B1 (en) * 2005-12-09 2007-06-05 The Regents Of The University Of California CMP pad with designed surface features
TW201505758A (zh) * 2013-03-07 2015-02-16 羅門哈斯電子材料Ｃｍｐ控股公司 具有寬譜終點偵測窗之多層化學機械硏磨墊

Also Published As

Publication number Publication date
CN108136564A (zh) 2018-06-08
JP6949833B2 (ja) 2021-10-13
CN108136564B (zh) 2021-06-22
US11154959B2 (en) 2021-10-26
EP3359335B1 (en) 2023-07-05
JP2018535104A (ja) 2018-11-29
EP3359335A1 (en) 2018-08-15
KR20180066126A (ko) 2018-06-18
TW201726316A (zh) 2017-08-01
US20180281148A1 (en) 2018-10-04
WO2017062719A1 (en) 2017-04-13
KR102615968B1 (ko) 2023-12-19

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