JP6004941B2 - 相分離したポリマーブレンドを含む研磨パッド並びにその製造及び使用方法 - Google Patents
相分離したポリマーブレンドを含む研磨パッド並びにその製造及び使用方法 Download PDFInfo
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- JP6004941B2 JP6004941B2 JP2012547231A JP2012547231A JP6004941B2 JP 6004941 B2 JP6004941 B2 JP 6004941B2 JP 2012547231 A JP2012547231 A JP 2012547231A JP 2012547231 A JP2012547231 A JP 2012547231A JP 6004941 B2 JP6004941 B2 JP 6004941B2
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
Description
本出願は、2009年12月30日に出願された米国特許仮出願第61/291,176号の利益を主張し、その開示内容の全体を参照により本明細書に援用する。
本開示は、研磨パッド、並びに研磨パッドの製造方法、及び研磨プロセス(例えば化学機械的平坦化プロセス)における研磨パッドの使用方法に関する。
本開示の例示的実施形態による研磨パッド2の製造を三工程プロセスで行った:高分子ブレンドを押し出して高分子フィルムを成形する工程、高分子フィルムの複数のシートを三次元研磨要素構造を有する複合シートに圧縮成形する工程、及び、複合フィルムを発泡体材料を含む複合層に積層する工程。
本開示の例示的実施形態による研磨パッド2の製造を三工程プロセスで行った。高分子ブレンドを押し出して高分子フィルムを成形する工程、高分子フィルムのシートを三次元構造を有するフィルムに圧縮成形する工程、及び、複合フィルムを発泡体材料を含む複合層に積層する工程。
本開示の例示的実施形態による研磨パッド2の製造を三工程プロセスで行った。高分子ブレンドを押し出して高分子フィルムを成形する工程、高分子フィルムのシートを型押しして三次元構造を有するフィルムに成形する工程、及び、複合フィルムを発泡体材料を含む複合層に積層する工程。
本開示の代替的実施形態による非平坦研磨パッドの製造を三工程プロセスで行った。高分子ブレンドを押し出して高分子フィルムを成形する工程、高分子フィルムの主面の表面上に放射状に間隔を有して離れた複数の同心円形溝をミリングする工程、及び、複合フィルムを発泡体材料を含む複合層に積層する工程。
Claims (5)
- 第一主面と、前記第一主面とは反対側の第二主面と、を有するシート、及び、
前記第一主面から前記第一主面に対して実質的に垂直な第一方向に沿って外向きに延びる複数の研磨要素、を含む研磨パッドであって、少なくとも一部の前記研磨要素は、前記シートと一体成形され、他の研磨要素の1つ以上に対する前記研磨要素の横の動きを制限するために横向きに接続されるが、前記研磨要素の研磨表面に対して実質的に垂直な軸においては可動性を維持し、前記複数の研磨要素の少なくとも一部は、第一連続性ポリマー相と第二不連続性ポリマー相と複数の孔とを含み、前記複数の研磨要素の少なくとも1つは透明な無孔の研磨要素である、研磨パッド。 - 第一主面と、前記第一主面とは反対側の第二主面と、を有する支持層、及び、
各研磨要素が、前記支持層に接着することにより、前記第一主面に取り付けられた複数の研磨要素、を含む研磨パッドであって、各研磨要素は、露出した研磨表面を有し、
前記研磨要素は、前記支持層の前記第一主面から前記第一主面に対して実質的に垂直な第一方向に沿って延び、更に前記複数の研磨要素の少なくとも一部は第一連続性ポリマー相と第二不連続性ポリマー相と複数の孔とを含み、前記複数の研磨要素の少なくとも1つは透明な無孔の研磨要素である、研磨パッド。 - 請求項1または2に記載の研磨パッドの研磨表面に基材の表面を接触させる工程と、
前記基材の前記表面を摩耗させるために前記研磨パッドを前記基材に対して相対的に移動させる工程と、を含む、研磨パッドの使用方法。 - 熱を適用しながら第一ポリマーを第二ポリマーと混合して流体成形組成物を形成する工程と、
前記流体成形組成物を成形型に分注する工程と、
前記流体成形組成物を冷却して、前記第一ポリマーを含む第一連続性ポリマー相と前記第二ポリマーを含む第二不連続性ポリマー相とを含む研磨パッドを形成する工程と、を含む請求項1に記載の研磨パッドの製造方法であって、前記研磨パッドは、第一主表面と、第一主表面とは反対側の第二主表面と、を有する、方法。 - 第一ポリマーを含む第一連続性ポリマー相と、第二ポリマーを含む第二不連続性ポリマー相と、を含む複数の研磨要素を形成する工程と、
第一主面とは反対側の第二主面を有する支持層の前記第一主面に前記研磨要素を接着して研磨パッドを形成する工程と、
前記第一主面上に前記複数の研磨要素を有するパターンを形成する工程と、を含む、請求項2に記載の研磨パッドの製造方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29117609P | 2009-12-30 | 2009-12-30 | |
US61/291,176 | 2009-12-30 | ||
PCT/US2010/062204 WO2011082155A2 (en) | 2009-12-30 | 2010-12-28 | Polishing pads including phase-separated polymer blend and method of making and using the same |
Publications (3)
Publication Number | Publication Date |
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JP2013516768A JP2013516768A (ja) | 2013-05-13 |
JP2013516768A5 JP2013516768A5 (ja) | 2014-02-06 |
JP6004941B2 true JP6004941B2 (ja) | 2016-10-12 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012547231A Active JP6004941B2 (ja) | 2009-12-30 | 2010-12-28 | 相分離したポリマーブレンドを含む研磨パッド並びにその製造及び使用方法 |
Country Status (7)
Country | Link |
---|---|
US (1) | US9162340B2 (ja) |
JP (1) | JP6004941B2 (ja) |
KR (1) | KR20120125612A (ja) |
CN (1) | CN102686362A (ja) |
SG (1) | SG181678A1 (ja) |
TW (1) | TWI552832B (ja) |
WO (1) | WO2011082155A2 (ja) |
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2010
- 2010-12-28 US US13/514,741 patent/US9162340B2/en active Active
- 2010-12-28 SG SG2012043568A patent/SG181678A1/en unknown
- 2010-12-28 CN CN2010800603140A patent/CN102686362A/zh active Pending
- 2010-12-28 WO PCT/US2010/062204 patent/WO2011082155A2/en active Application Filing
- 2010-12-28 JP JP2012547231A patent/JP6004941B2/ja active Active
- 2010-12-28 KR KR1020127019847A patent/KR20120125612A/ko not_active Application Discontinuation
- 2010-12-29 TW TW099146701A patent/TWI552832B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
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TW201136710A (en) | 2011-11-01 |
TWI552832B (zh) | 2016-10-11 |
US20120315830A1 (en) | 2012-12-13 |
US9162340B2 (en) | 2015-10-20 |
CN102686362A (zh) | 2012-09-19 |
JP2013516768A (ja) | 2013-05-13 |
WO2011082155A2 (en) | 2011-07-07 |
KR20120125612A (ko) | 2012-11-16 |
SG181678A1 (en) | 2012-07-30 |
WO2011082155A3 (en) | 2011-11-17 |
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