JP2010238765A5 - - Google Patents

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Publication number
JP2010238765A5
JP2010238765A5 JP2009082708A JP2009082708A JP2010238765A5 JP 2010238765 A5 JP2010238765 A5 JP 2010238765A5 JP 2009082708 A JP2009082708 A JP 2009082708A JP 2009082708 A JP2009082708 A JP 2009082708A JP 2010238765 A5 JP2010238765 A5 JP 2010238765A5
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JP
Japan
Prior art keywords
semiconductor wafer
double
grinding
sides
contact position
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JP2009082708A
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English (en)
Japanese (ja)
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JP2010238765A (ja
JP5437680B2 (ja
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Priority claimed from JP2009082708A external-priority patent/JP5437680B2/ja
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Publication of JP2010238765A5 publication Critical patent/JP2010238765A5/ja
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JP2009082708A 2009-03-30 2009-03-30 半導体ウェーハの両面研削装置及び両面研削方法 Active JP5437680B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009082708A JP5437680B2 (ja) 2009-03-30 2009-03-30 半導体ウェーハの両面研削装置及び両面研削方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009082708A JP5437680B2 (ja) 2009-03-30 2009-03-30 半導体ウェーハの両面研削装置及び両面研削方法

Publications (3)

Publication Number Publication Date
JP2010238765A JP2010238765A (ja) 2010-10-21
JP2010238765A5 true JP2010238765A5 (enExample) 2012-04-12
JP5437680B2 JP5437680B2 (ja) 2014-03-12

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ID=43092860

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JP2009082708A Active JP5437680B2 (ja) 2009-03-30 2009-03-30 半導体ウェーハの両面研削装置及び両面研削方法

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JP (1) JP5437680B2 (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6250435B2 (ja) * 2014-02-26 2017-12-20 光洋機械工業株式会社 両頭平面研削法
CN110744378B (zh) * 2019-11-14 2024-10-11 江苏万源新材料股份有限公司 一种裤三通自动成型设备
CN110842762A (zh) * 2019-11-19 2020-02-28 天津中环领先材料技术有限公司 一种大尺寸硅圆片减薄装置及其减薄工艺
CN110860998B (zh) * 2019-12-09 2025-05-27 中环领先(徐州)半导体材料有限公司 双面减薄的装置和方法
CN114770366B (zh) * 2022-05-17 2023-11-17 西安奕斯伟材料科技股份有限公司 一种硅片双面研磨装置的静压板及硅片双面研磨装置
CN115070604B (zh) * 2022-06-09 2023-09-29 西安奕斯伟材料科技股份有限公司 双面研磨装置和双面研磨方法
CN115383616B (zh) * 2022-09-22 2024-05-31 西安奕斯伟材料科技股份有限公司 研磨装置、研磨方法及硅片
CN119188470A (zh) * 2024-11-18 2024-12-27 西安奕斯伟材料科技股份有限公司 硅片平坦度调整系统
CN120715743A (zh) * 2025-04-18 2025-09-30 浙江求是半导体设备有限公司 一种晶圆双面减薄方法和系统

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002346923A (ja) * 2001-05-29 2002-12-04 Sumitomo Heavy Ind Ltd 加工装置
JP2002346924A (ja) * 2001-05-29 2002-12-04 Sumitomo Heavy Ind Ltd ワークホルダ

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