JP2014017428A5 - - Google Patents
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- Publication number
- JP2014017428A5 JP2014017428A5 JP2012155204A JP2012155204A JP2014017428A5 JP 2014017428 A5 JP2014017428 A5 JP 2014017428A5 JP 2012155204 A JP2012155204 A JP 2012155204A JP 2012155204 A JP2012155204 A JP 2012155204A JP 2014017428 A5 JP2014017428 A5 JP 2014017428A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- pressure
- pressure chamber
- polishing
- holding surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims description 46
- 238000005498 polishing Methods 0.000 claims description 18
- 238000000926 separation method Methods 0.000 claims description 6
- 238000001514 detection method Methods 0.000 claims description 3
- 238000007517 polishing process Methods 0.000 claims description 2
- 238000000034 method Methods 0.000 claims 2
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012155204A JP5856546B2 (ja) | 2012-07-11 | 2012-07-11 | 研磨装置および研磨方法 |
| US13/932,062 US9105516B2 (en) | 2012-07-03 | 2013-07-01 | Polishing apparatus and polishing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012155204A JP5856546B2 (ja) | 2012-07-11 | 2012-07-11 | 研磨装置および研磨方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2014017428A JP2014017428A (ja) | 2014-01-30 |
| JP2014017428A5 true JP2014017428A5 (enExample) | 2015-10-01 |
| JP5856546B2 JP5856546B2 (ja) | 2016-02-09 |
Family
ID=50111852
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012155204A Active JP5856546B2 (ja) | 2012-07-03 | 2012-07-11 | 研磨装置および研磨方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5856546B2 (enExample) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6190286B2 (ja) * | 2014-02-14 | 2017-08-30 | 株式会社荏原製作所 | 基板保持装置および研磨装置 |
| SG10202100910UA (en) | 2015-08-18 | 2021-03-30 | Ebara Corp | Substrate adsorption method, substrate holding apparatus, substrate polishing apparatus, elastic film, substrate adsorption determination method for substrate holding apparatus, and pressure control m |
| SG10201606197XA (en) | 2015-08-18 | 2017-03-30 | Ebara Corp | Substrate adsorption method, substrate holding apparatus, substrate polishing apparatus, elastic film, substrate adsorption determination method for substrate holding apparatus, and pressure control method for substrate holding apparatus |
| JP6463303B2 (ja) * | 2016-05-13 | 2019-01-30 | 株式会社荏原製作所 | 弾性膜、基板保持装置、基板研磨装置、基板保持装置における基板吸着判定方法および圧力制御方法 |
| EP4079451A4 (en) * | 2019-12-18 | 2024-01-03 | Ebara Corporation | SLIDE, SUBSTRATE TRANSPORT DEVICE AND SUBSTRATE TREATMENT DEVICE |
| JP6847286B2 (ja) * | 2020-04-02 | 2021-03-24 | 株式会社荏原製作所 | 基板処理装置 |
| US12138732B2 (en) | 2020-12-14 | 2024-11-12 | Applied Materials, Inc. | Polishing system apparatus and methods for defect reduction at a substrate edge |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005123485A (ja) * | 2003-10-17 | 2005-05-12 | Ebara Corp | 研磨装置 |
| US7044832B2 (en) * | 2003-11-17 | 2006-05-16 | Applied Materials | Load cup for chemical mechanical polishing |
| JP5155517B2 (ja) * | 2005-04-21 | 2013-03-06 | 株式会社荏原製作所 | ウエハ受渡装置及びポリッシング装置 |
| JP5390807B2 (ja) * | 2008-08-21 | 2014-01-15 | 株式会社荏原製作所 | 研磨方法および装置 |
| JP5597033B2 (ja) * | 2010-06-07 | 2014-10-01 | 株式会社荏原製作所 | 研磨装置および方法 |
-
2012
- 2012-07-11 JP JP2012155204A patent/JP5856546B2/ja active Active
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