JP5856546B2 - 研磨装置および研磨方法 - Google Patents

研磨装置および研磨方法 Download PDF

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Publication number
JP5856546B2
JP5856546B2 JP2012155204A JP2012155204A JP5856546B2 JP 5856546 B2 JP5856546 B2 JP 5856546B2 JP 2012155204 A JP2012155204 A JP 2012155204A JP 2012155204 A JP2012155204 A JP 2012155204A JP 5856546 B2 JP5856546 B2 JP 5856546B2
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wafer
substrate
polishing
top ring
pressure
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Japanese (ja)
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JP2014017428A5 (enExample
JP2014017428A (ja
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顕 中村
顕 中村
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Ebara Corp
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Ebara Corp
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Priority to JP2012155204A priority Critical patent/JP5856546B2/ja
Priority to US13/932,062 priority patent/US9105516B2/en
Publication of JP2014017428A publication Critical patent/JP2014017428A/ja
Publication of JP2014017428A5 publication Critical patent/JP2014017428A5/ja
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  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP2012155204A 2012-07-03 2012-07-11 研磨装置および研磨方法 Active JP5856546B2 (ja)

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JP2012155204A JP5856546B2 (ja) 2012-07-11 2012-07-11 研磨装置および研磨方法
US13/932,062 US9105516B2 (en) 2012-07-03 2013-07-01 Polishing apparatus and polishing method

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JP2012155204A JP5856546B2 (ja) 2012-07-11 2012-07-11 研磨装置および研磨方法

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JP2014017428A JP2014017428A (ja) 2014-01-30
JP2014017428A5 JP2014017428A5 (enExample) 2015-10-01
JP5856546B2 true JP5856546B2 (ja) 2016-02-09

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Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6190286B2 (ja) * 2014-02-14 2017-08-30 株式会社荏原製作所 基板保持装置および研磨装置
SG10202100910UA (en) 2015-08-18 2021-03-30 Ebara Corp Substrate adsorption method, substrate holding apparatus, substrate polishing apparatus, elastic film, substrate adsorption determination method for substrate holding apparatus, and pressure control m
SG10201606197XA (en) 2015-08-18 2017-03-30 Ebara Corp Substrate adsorption method, substrate holding apparatus, substrate polishing apparatus, elastic film, substrate adsorption determination method for substrate holding apparatus, and pressure control method for substrate holding apparatus
JP6463303B2 (ja) * 2016-05-13 2019-01-30 株式会社荏原製作所 弾性膜、基板保持装置、基板研磨装置、基板保持装置における基板吸着判定方法および圧力制御方法
EP4079451A4 (en) * 2019-12-18 2024-01-03 Ebara Corporation SLIDE, SUBSTRATE TRANSPORT DEVICE AND SUBSTRATE TREATMENT DEVICE
JP6847286B2 (ja) * 2020-04-02 2021-03-24 株式会社荏原製作所 基板処理装置
US12138732B2 (en) 2020-12-14 2024-11-12 Applied Materials, Inc. Polishing system apparatus and methods for defect reduction at a substrate edge

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005123485A (ja) * 2003-10-17 2005-05-12 Ebara Corp 研磨装置
US7044832B2 (en) * 2003-11-17 2006-05-16 Applied Materials Load cup for chemical mechanical polishing
JP5155517B2 (ja) * 2005-04-21 2013-03-06 株式会社荏原製作所 ウエハ受渡装置及びポリッシング装置
JP5390807B2 (ja) * 2008-08-21 2014-01-15 株式会社荏原製作所 研磨方法および装置
JP5597033B2 (ja) * 2010-06-07 2014-10-01 株式会社荏原製作所 研磨装置および方法

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JP2014017428A (ja) 2014-01-30

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