JP2011066342A5 - - Google Patents

Download PDF

Info

Publication number
JP2011066342A5
JP2011066342A5 JP2009217854A JP2009217854A JP2011066342A5 JP 2011066342 A5 JP2011066342 A5 JP 2011066342A5 JP 2009217854 A JP2009217854 A JP 2009217854A JP 2009217854 A JP2009217854 A JP 2009217854A JP 2011066342 A5 JP2011066342 A5 JP 2011066342A5
Authority
JP
Japan
Prior art keywords
wafer
hole
absence
detecting
image processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2009217854A
Other languages
English (en)
Japanese (ja)
Other versions
JP5541770B2 (ja
JP2011066342A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2009217854A priority Critical patent/JP5541770B2/ja
Priority claimed from JP2009217854A external-priority patent/JP5541770B2/ja
Priority to KR1020100089936A priority patent/KR101657316B1/ko
Priority to CN201010287709.6A priority patent/CN102019581B/zh
Publication of JP2011066342A publication Critical patent/JP2011066342A/ja
Publication of JP2011066342A5 publication Critical patent/JP2011066342A5/ja
Application granted granted Critical
Publication of JP5541770B2 publication Critical patent/JP5541770B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2009217854A 2009-09-18 2009-09-18 ウェーハ研磨装置およびウェーハの製造方法 Active JP5541770B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2009217854A JP5541770B2 (ja) 2009-09-18 2009-09-18 ウェーハ研磨装置およびウェーハの製造方法
KR1020100089936A KR101657316B1 (ko) 2009-09-18 2010-09-14 웨이퍼 연마 장치 및 웨이퍼의 제조 방법
CN201010287709.6A CN102019581B (zh) 2009-09-18 2010-09-17 晶圆研磨装置和晶圆的制造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009217854A JP5541770B2 (ja) 2009-09-18 2009-09-18 ウェーハ研磨装置およびウェーハの製造方法

Publications (3)

Publication Number Publication Date
JP2011066342A JP2011066342A (ja) 2011-03-31
JP2011066342A5 true JP2011066342A5 (enExample) 2012-10-25
JP5541770B2 JP5541770B2 (ja) 2014-07-09

Family

ID=43861573

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009217854A Active JP5541770B2 (ja) 2009-09-18 2009-09-18 ウェーハ研磨装置およびウェーハの製造方法

Country Status (3)

Country Link
JP (1) JP5541770B2 (enExample)
KR (1) KR101657316B1 (enExample)
CN (1) CN102019581B (enExample)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101616464B1 (ko) 2014-11-18 2016-04-29 주식회사 엘지실트론 웨이퍼 연마장비의 웨이퍼 로딩장치 및 웨이퍼 로딩위치 조정 방법
CN109434671A (zh) * 2018-10-11 2019-03-08 德淮半导体有限公司 一种晶圆加工设备及加工方法
JP2020059095A (ja) * 2018-10-11 2020-04-16 株式会社ブイ・テクノロジー ウェハの研磨装置および研磨方法
CN111347061B (zh) * 2018-12-24 2021-03-30 有研半导体材料有限公司 一种硅环加工的工艺方法
CN110752169B (zh) * 2019-10-21 2022-03-22 西安奕斯伟材料科技有限公司 一种晶圆处理装置和上下料方法
CN110767587B (zh) * 2019-10-21 2022-04-01 西安奕斯伟材料科技有限公司 一种晶圆处理装置和上下料方法
CN110695840B (zh) * 2019-11-07 2021-02-02 许昌学院 一种基于光电检测的半导体研磨装置
CN110900342B (zh) * 2019-11-29 2020-12-08 上海磐盟电子材料有限公司 一种磨片机
JP7565591B2 (ja) 2021-01-06 2024-10-11 不二越機械工業株式会社 ウェハ研磨用キャリアおよびウェハ研磨装置
CN113579989B (zh) * 2021-08-13 2024-01-26 西安奕斯伟材料科技股份有限公司 滑片检测装置和抛光系统
JP7748892B2 (ja) * 2022-02-24 2025-10-03 三菱マテリアルテクノ株式会社 移載装置、研磨設備、及び移載方法
JP7769391B2 (ja) * 2023-04-13 2025-11-13 株式会社太陽 両面研磨装置
CN117260450B (zh) * 2023-11-22 2024-01-23 连云港弘鼎石英有限公司 一种具有防尘机构的石英制品加工用磨边设备
CN119833445B (zh) * 2025-01-09 2025-09-02 北京日扬弘创智能装备有限公司 用于半导体制造设备控制的方法、系统、装置及设备

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5679055A (en) * 1996-05-31 1997-10-21 Memc Electronic Materials, Inc. Automated wafer lapping system
JP4030247B2 (ja) * 1999-05-17 2008-01-09 株式会社荏原製作所 ドレッシング装置及びポリッシング装置
JP3663348B2 (ja) * 2000-09-26 2005-06-22 Ｔｏｗａ株式会社 研磨装置及び研磨方法
JP4337581B2 (ja) * 2004-02-27 2009-09-30 信越半導体株式会社 半導体ウエーハの両面研磨装置及び割れ検査方法
JP2005288648A (ja) * 2004-04-02 2005-10-20 Sumco Corp 両面研磨装置の異物検出方法
JP4522360B2 (ja) * 2005-12-02 2010-08-11 日東電工株式会社 半導体ウエハの位置決定方法およびこれを用いた装置
JP2009123790A (ja) * 2007-11-13 2009-06-04 Disco Abrasive Syst Ltd 研削装置

Similar Documents

Publication Publication Date Title
JP2011066342A5 (enExample)
TWI456643B (zh) 晶圓之研磨方法及研磨裝置
JP5541770B2 (ja) ウェーハ研磨装置およびウェーハの製造方法
JP2016171107A5 (enExample)
TWI368112B (en) Inspection method and apparatus, lithographic apparatus, lithographic processing cell and device manufacturing method
TWI368319B (en) Solid-state image pickup device and a method of manufacturing the same, and image pickup apparatus
MY192104A (en) Method of detecting clogging of chuck table and processing apparatus
JP2008502134A5 (enExample)
TWI368289B (en) Inspection method and apparatus, lithographic apparatus, lithographic processing cell and device manufacturing method
IL194839A0 (en) Inspection method and apparatus, lithographic apparatus, lithographic processing cell and device manufacturing method
IL213627A0 (en) Inspection method and apparatus, lithographic apparatus, lithographic processing cell and device manufacturing method
JP2014107313A5 (enExample)
EP1868377A4 (en) LIGHT SENSOR, SEMICONDUCTOR IMAGE RECOVERY DEVICE AND METHOD FOR OPERATING A SEMICONDUCTOR IMAGE RECIPROCATOR
JP2006507837A5 (enExample)
SG171633A1 (en) Radiation system and lithographic apparatus comprising the same
SG148971A1 (en) Substrates and methods of using those substrates
IL188768A0 (en) Inspection method and apparatus, lithographic apparatus, lithographic processing cell and device manufacturing method
IL189034A0 (en) Inspection method and apparatus, lithographic apparatus, lithographic processing cell and device manufacturing method
IL207505A (en) Device and method for testing, lithographic device, lithographic processing cell and method for producing the device
IL187546A0 (en) Inspection method and apparatus, lithographic apparatus, lithographic processing cell and device manufacturing method
JP2011235406A5 (enExample)
WO2011122354A3 (en) Exposure apparatus, exchange method of object, exposure method, and device manufacturing method
TW200729375A (en) System and method for detecting wafer failure in wet bench application
EP2107132A4 (en) METHOD AND DEVICE FOR PRODUCING A VACUUM WRAPPING FOIL
DE502006004202D1 (de) Vorrichtung und Verfahren zum Be- und Entladen einer Bearbeitungsmaschine zum Bearbeiten von Platten