MY167646A - Abnormal contact detecting method, electronic component holding apparatus, and electronic component carrying apparatus - Google Patents

Abnormal contact detecting method, electronic component holding apparatus, and electronic component carrying apparatus

Info

Publication number
MY167646A
MY167646A MYPI2014702298A MYPI2014702298A MY167646A MY 167646 A MY167646 A MY 167646A MY PI2014702298 A MYPI2014702298 A MY PI2014702298A MY PI2014702298 A MYPI2014702298 A MY PI2014702298A MY 167646 A MY167646 A MY 167646A
Authority
MY
Malaysia
Prior art keywords
electronic component
rod
detecting method
abnormal contact
force
Prior art date
Application number
MYPI2014702298A
Inventor
Minami Hideo
Original Assignee
Ueno Seiki Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ueno Seiki Co Ltd filed Critical Ueno Seiki Co Ltd
Publication of MY167646A publication Critical patent/MY167646A/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/082—Integration of non-optical monitoring devices, i.e. using non-optical inspection means, e.g. electrical means, mechanical means or X-rays
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/50—Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections
    • G01R31/66—Testing of connections, e.g. of plugs or non-disconnectable joints

Landscapes

  • Engineering & Computer Science (AREA)
  • Operations Research (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Testing Electric Properties And Detecting Electric Faults (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Sorting Of Articles (AREA)

Abstract

ABNORMAL CONTACT DETECTING METHOD, ELECTRONIC COMPONENT HOLDING APPARATUS, AND ELECTRONIC COMPONENT CARRYING APPARATUS An abnormal contact detecting method is provided which can detect an abnormal contact of an electronic component during a transfer of the electronic component. An ascending and descending motor (4) applies descending force (Fr) to a holder unit (2) through a rod (32). A voice coil motor (37) applies, to the rod (32), opposing thrust force (Fopp) equivalent to counteracting force (Fcr) applied to the rod (32) relative to the descending force (Fr). A relative floating of the rod (32) to the voice coil motor (37) in accordance with resistive force (Fd) caused when the electronic component (D) descends while contacting a carrier tape (61) is detected, and a contact to the carrier tape (61) during the descending is detected upon detection of the floating of the rod (32). (Fig. 1)
MYPI2014702298A 2012-02-28 2012-02-28 Abnormal contact detecting method, electronic component holding apparatus, and electronic component carrying apparatus MY167646A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2012/054874 WO2013128560A1 (en) 2012-02-28 2012-02-28 Abnormal contact detecting method, electronic component holding apparatus, and electronic component transfer apparatus

Publications (1)

Publication Number Publication Date
MY167646A true MY167646A (en) 2018-09-21

Family

ID=49081814

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2014702298A MY167646A (en) 2012-02-28 2012-02-28 Abnormal contact detecting method, electronic component holding apparatus, and electronic component carrying apparatus

Country Status (8)

Country Link
JP (1) JP5300111B1 (en)
KR (1) KR101520677B1 (en)
CN (1) CN104136325B (en)
HK (1) HK1202101A1 (en)
MY (1) MY167646A (en)
SG (1) SG11201404990XA (en)
TW (1) TWI583272B (en)
WO (1) WO2013128560A1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6533112B2 (en) * 2015-07-21 2019-06-19 株式会社Ｆｕｊｉ Circuit formation method
JP6164624B1 (en) * 2016-10-18 2017-07-19 上野精機株式会社 Electronic component moving device and electronic component conveying device
JP7188735B2 (en) * 2018-08-01 2022-12-13 Thk株式会社 actuator
TWI778647B (en) * 2021-06-01 2022-09-21 天正國際精密機械股份有限公司 Improved electronic component implantation device and implantation method

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1050384A4 (en) * 1996-12-25 2000-11-08 Matsushita Electric Ind Co Ltd Part holding head, part mounting device and part holding method
JP2000264305A (en) * 1999-03-15 2000-09-26 Shin Etsu Polymer Co Ltd Carrier tape inspection method
JP4462705B2 (en) * 2000-03-30 2010-05-12 三井金属鉱業株式会社 Final defect marking device for film carrier tape for electronic component mounting
JP4202102B2 (en) * 2002-12-03 2008-12-24 上野精機株式会社 Taping device for semiconductor device
JP2004328846A (en) * 2003-04-22 2004-11-18 Olympus Corp Load controller, load control type actuator, and load control method
JP2005096789A (en) * 2003-09-24 2005-04-14 Ricoh Co Ltd Carrier tape, method for manufacturing the same, electronic component mounting method using the carrier tape, and appearance inspection method
JP2005142313A (en) * 2003-11-06 2005-06-02 Tdk Corp Contact detecting apparatus for mounting processing apparatus and mounting processing apparatus comprising the same
JP2007145365A (en) * 2005-11-28 2007-06-14 Ueno Seiki Kk Taping device, and its controlling method
JP2010129718A (en) * 2008-11-27 2010-06-10 Juki Corp Component mounting apparatus
JP2010131680A (en) * 2008-12-02 2010-06-17 Ueno Seiki Kk Holding means driver
JP5294204B2 (en) * 2009-04-23 2013-09-18 株式会社 東京ウエルズ Work insertion mechanism and work insertion method
WO2012073282A1 (en) * 2010-11-30 2012-06-07 上野精機株式会社 Electronic component holding device, electronic component inspecting device provided therewith, and electronic component classification device

Also Published As

Publication number Publication date
TWI583272B (en) 2017-05-11
CN104136325B (en) 2015-09-30
WO2013128560A1 (en) 2013-09-06
KR20140103185A (en) 2014-08-25
HK1202101A1 (en) 2015-09-18
TW201343022A (en) 2013-10-16
JP5300111B1 (en) 2013-09-25
JPWO2013128560A1 (en) 2015-07-30
SG11201404990XA (en) 2014-11-27
CN104136325A (en) 2014-11-05
KR101520677B1 (en) 2015-05-15

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