JP2014031865A - エアベアリング装置及び塗布装置 - Google Patents

エアベアリング装置及び塗布装置 Download PDF

Info

Publication number
JP2014031865A
JP2014031865A JP2012174198A JP2012174198A JP2014031865A JP 2014031865 A JP2014031865 A JP 2014031865A JP 2012174198 A JP2012174198 A JP 2012174198A JP 2012174198 A JP2012174198 A JP 2012174198A JP 2014031865 A JP2014031865 A JP 2014031865A
Authority
JP
Japan
Prior art keywords
air bearing
coating
bearing device
gas
exhaust
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2012174198A
Other languages
English (en)
Japanese (ja)
Other versions
JP2014031865A5 (enExample
Inventor
Toshiyuki Ikeda
俊之 池田
Satoshi Ueda
智士 上田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Oiles Industry Co Ltd
Original Assignee
Oiles Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oiles Industry Co Ltd filed Critical Oiles Industry Co Ltd
Priority to JP2012174198A priority Critical patent/JP2014031865A/ja
Priority to KR20157003630A priority patent/KR20150040924A/ko
Priority to CN201380041409.1A priority patent/CN104583618A/zh
Priority to PCT/JP2013/067076 priority patent/WO2014024583A1/ja
Priority to TW102127675A priority patent/TW201412409A/zh
Publication of JP2014031865A publication Critical patent/JP2014031865A/ja
Publication of JP2014031865A5 publication Critical patent/JP2014031865A5/ja
Pending legal-status Critical Current

Links

Images

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16C—SHAFTS; FLEXIBLE SHAFTS; ELEMENTS OR CRANKSHAFT MECHANISMS; ROTARY BODIES OTHER THAN GEARING ELEMENTS; BEARINGS
    • F16C32/00—Bearings not otherwise provided for
    • F16C32/06—Bearings not otherwise provided for with moving member supported by a fluid cushion formed, at least to a large extent, otherwise than by movement of the shaft, e.g. hydrostatic air-cushion bearings
    • F16C32/0603—Bearings not otherwise provided for with moving member supported by a fluid cushion formed, at least to a large extent, otherwise than by movement of the shaft, e.g. hydrostatic air-cushion bearings supported by a gas cushion, e.g. an air cushion
    • F16C32/0614—Bearings not otherwise provided for with moving member supported by a fluid cushion formed, at least to a large extent, otherwise than by movement of the shaft, e.g. hydrostatic air-cushion bearings supported by a gas cushion, e.g. an air cushion the gas being supplied under pressure, e.g. aerostatic bearings
    • F16C32/0622—Bearings not otherwise provided for with moving member supported by a fluid cushion formed, at least to a large extent, otherwise than by movement of the shaft, e.g. hydrostatic air-cushion bearings supported by a gas cushion, e.g. an air cushion the gas being supplied under pressure, e.g. aerostatic bearings via nozzles, restrictors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67784—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations using air tracks

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Magnetic Bearings And Hydrostatic Bearings (AREA)
  • Coating Apparatus (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Spray Control Apparatus (AREA)
  • Details Or Accessories Of Spraying Plant Or Apparatus (AREA)
JP2012174198A 2012-08-06 2012-08-06 エアベアリング装置及び塗布装置 Pending JP2014031865A (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2012174198A JP2014031865A (ja) 2012-08-06 2012-08-06 エアベアリング装置及び塗布装置
KR20157003630A KR20150040924A (ko) 2012-08-06 2013-06-21 에어 베어링 장치 및 도포 장치
CN201380041409.1A CN104583618A (zh) 2012-08-06 2013-06-21 空气轴承装置及涂布装置
PCT/JP2013/067076 WO2014024583A1 (ja) 2012-08-06 2013-06-21 エアベアリング装置及び塗布装置
TW102127675A TW201412409A (zh) 2012-08-06 2013-08-01 空氣軸承裝置及塗布裝置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012174198A JP2014031865A (ja) 2012-08-06 2012-08-06 エアベアリング装置及び塗布装置

Publications (2)

Publication Number Publication Date
JP2014031865A true JP2014031865A (ja) 2014-02-20
JP2014031865A5 JP2014031865A5 (enExample) 2015-09-17

Family

ID=50067824

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012174198A Pending JP2014031865A (ja) 2012-08-06 2012-08-06 エアベアリング装置及び塗布装置

Country Status (5)

Country Link
JP (1) JP2014031865A (enExample)
KR (1) KR20150040924A (enExample)
CN (1) CN104583618A (enExample)
TW (1) TW201412409A (enExample)
WO (1) WO2014024583A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR3139869A1 (fr) * 2022-09-16 2024-03-22 Micro-Contrôle - Spectra-Physics Appareil pour la réduction des vibrations dans un système de régulation de mouvement à coussin d’air

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201539620A (zh) * 2014-02-18 2015-10-16 Oiles Industry Co Ltd 空氣軸承裝置及測定裝置
US11097974B2 (en) 2014-07-31 2021-08-24 Corning Incorporated Thermally strengthened consumer electronic glass and related systems and methods
US12338159B2 (en) 2015-07-30 2025-06-24 Corning Incorporated Thermally strengthened consumer electronic glass and related systems and methods
JP6923555B2 (ja) 2016-01-12 2021-08-18 コーニング インコーポレイテッド 薄厚熱強化及び化学強化ガラス系物品
US11795102B2 (en) 2016-01-26 2023-10-24 Corning Incorporated Non-contact coated glass and related coating system and method
TWI785156B (zh) 2017-11-30 2022-12-01 美商康寧公司 具有高熱膨脹係數及對於熱回火之優先破裂行為的非離子交換玻璃
EP3719443B1 (en) 2019-04-03 2021-06-09 Hexagon Technology Center GmbH Coordinate-measuring machine with self-cleaning air bearing
KR20210154825A (ko) 2019-04-23 2021-12-21 코닝 인코포레이티드 확정 응력 프로파일을 갖는 유리 라미네이트 및 그 제조방법
US11697617B2 (en) 2019-08-06 2023-07-11 Corning Incorporated Glass laminate with buried stress spikes to arrest cracks and methods of making the same
CN111894983A (zh) * 2020-07-30 2020-11-06 西安工业大学 微孔节流的静压气体止推轴承
CN114251362A (zh) * 2020-09-24 2022-03-29 武汉科技大学 一种微纳多孔节流气浮球面轴承

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60113816A (ja) * 1983-11-22 1985-06-20 Miyoutoku:Kk エア−スライド装置
JPS62180114A (ja) * 1986-01-31 1987-08-07 Kyocera Corp 静圧気体直線案内装置
JPH09222124A (ja) * 1996-02-19 1997-08-26 Nippon Seiko Kk 静圧気体軸受
JP2001200843A (ja) * 1999-11-22 2001-07-27 Nikon Corp 真空中で動作する流体ベアリング
JP2004019760A (ja) * 2002-06-14 2004-01-22 Nsk Ltd 静圧軸受
JP2005308146A (ja) * 2004-04-23 2005-11-04 Taiheiyo Cement Corp 静圧軸受装置およびその製造方法
US20060054774A1 (en) * 2001-12-27 2006-03-16 Yuval Yassour High-performance non-contact support platforms
JP2008149238A (ja) * 2006-12-15 2008-07-03 Chugai Ro Co Ltd 塗布装置
JP2010522431A (ja) * 2007-03-20 2010-07-01 ケーエルエー−テンカー・コーポレーション 真空予圧空気軸受チャックを使用する基板の安定
JP2011133724A (ja) * 2009-12-25 2011-07-07 Nikon Corp 流体静圧軸受、移動体装置、露光装置、デバイス製造方法、及び清掃装置

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60113816A (ja) * 1983-11-22 1985-06-20 Miyoutoku:Kk エア−スライド装置
JPS62180114A (ja) * 1986-01-31 1987-08-07 Kyocera Corp 静圧気体直線案内装置
JPH09222124A (ja) * 1996-02-19 1997-08-26 Nippon Seiko Kk 静圧気体軸受
JP2001200843A (ja) * 1999-11-22 2001-07-27 Nikon Corp 真空中で動作する流体ベアリング
US20060054774A1 (en) * 2001-12-27 2006-03-16 Yuval Yassour High-performance non-contact support platforms
JP2004019760A (ja) * 2002-06-14 2004-01-22 Nsk Ltd 静圧軸受
JP2005308146A (ja) * 2004-04-23 2005-11-04 Taiheiyo Cement Corp 静圧軸受装置およびその製造方法
JP2008149238A (ja) * 2006-12-15 2008-07-03 Chugai Ro Co Ltd 塗布装置
JP2010522431A (ja) * 2007-03-20 2010-07-01 ケーエルエー−テンカー・コーポレーション 真空予圧空気軸受チャックを使用する基板の安定
JP2011133724A (ja) * 2009-12-25 2011-07-07 Nikon Corp 流体静圧軸受、移動体装置、露光装置、デバイス製造方法、及び清掃装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR3139869A1 (fr) * 2022-09-16 2024-03-22 Micro-Contrôle - Spectra-Physics Appareil pour la réduction des vibrations dans un système de régulation de mouvement à coussin d’air

Also Published As

Publication number Publication date
CN104583618A (zh) 2015-04-29
WO2014024583A1 (ja) 2014-02-13
TW201412409A (zh) 2014-04-01
KR20150040924A (ko) 2015-04-15

Similar Documents

Publication Publication Date Title
JP2014031865A (ja) エアベアリング装置及び塗布装置
JP4884871B2 (ja) 塗布方法及び塗布装置
KR101546395B1 (ko) 이동 스테이지
JP4183525B2 (ja) 薄板の搬送用支持装置
JP5406852B2 (ja) 非接触搬送装置
JP2011213435A (ja) 搬送装置及び塗布システム
JP2014031865A5 (enExample)
JP2016121015A (ja) 非接触搬送装置、および非接触吸着盤
JP2023054081A (ja) 基板を保持するための研磨ヘッドおよび基板処理装置
JP6605871B2 (ja) 基板浮上搬送装置
JP2023041150A (ja) ロボットハンド
JP2010254453A (ja) 浮上装置
KR20140144236A (ko) 반송 장치
KR102782195B1 (ko) 기판 처리 장치 및 방법
JP2004172321A (ja) ワーク搬送テーブル、ワーク搬送装置、液滴吐出装置、電気光学装置、電気光学装置の製造方法および電子機器
KR102390540B1 (ko) 디스플레이 패널용 비접촉 이송장치
JP2014107318A (ja) 基板保持装置、液滴吐出装置
WO2011129152A1 (ja) 旋回流形成体及び非接触搬送装置
JP2019084471A (ja) 塗布装置
JP6685894B2 (ja) エアベアリング装置及び測定装置
JP4768577B2 (ja) 非接触支持装置
JP5848812B1 (ja) 吸着装置、及び、吸着装置の制御方法
JP2010189106A (ja) 浮上搬送装置
JP2022025589A (ja) 塗布装置
JP2010000487A (ja) 塗布装置

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20150731

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20150731

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20160614

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20160815

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20160814

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20170228

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20170429

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20170912

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20190402