JP2014011462A5 - - Google Patents
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- Publication number
- JP2014011462A5 JP2014011462A5 JP2013132779A JP2013132779A JP2014011462A5 JP 2014011462 A5 JP2014011462 A5 JP 2014011462A5 JP 2013132779 A JP2013132779 A JP 2013132779A JP 2013132779 A JP2013132779 A JP 2013132779A JP 2014011462 A5 JP2014011462 A5 JP 2014011462A5
- Authority
- JP
- Japan
- Prior art keywords
- barrier layer
- layer
- aluminum
- gate terminal
- resistive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000010410 layer Substances 0.000 claims 70
- 230000004888 barrier function Effects 0.000 claims 35
- 239000000463 material Substances 0.000 claims 15
- 238000000034 method Methods 0.000 claims 13
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims 12
- 238000000151 deposition Methods 0.000 claims 9
- 229910002601 GaN Inorganic materials 0.000 claims 8
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 claims 8
- 229910052733 gallium Inorganic materials 0.000 claims 8
- RNQKDQAVIXDKAG-UHFFFAOYSA-N aluminum gallium Chemical compound [Al].[Ga] RNQKDQAVIXDKAG-UHFFFAOYSA-N 0.000 claims 6
- 229910052738 indium Inorganic materials 0.000 claims 6
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims 6
- 229910052757 nitrogen Inorganic materials 0.000 claims 6
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 claims 5
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 claims 5
- AUCDRFABNLOFRE-UHFFFAOYSA-N alumane;indium Chemical compound [AlH3].[In] AUCDRFABNLOFRE-UHFFFAOYSA-N 0.000 claims 4
- 229910052782 aluminium Inorganic materials 0.000 claims 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 4
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims 4
- 239000003989 dielectric material Substances 0.000 claims 4
- 239000000758 substrate Substances 0.000 claims 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims 3
- 239000012212 insulator Substances 0.000 claims 3
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims 3
- 230000015572 biosynthetic process Effects 0.000 claims 2
- 239000010931 gold Substances 0.000 claims 2
- 239000004065 semiconductor Substances 0.000 claims 2
- 239000002356 single layer Substances 0.000 claims 2
- 230000005533 two-dimensional electron gas Effects 0.000 claims 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 1
- 125000005501 benzalkonium group Chemical group 0.000 claims 1
- 239000003990 capacitor Substances 0.000 claims 1
- 239000007772 electrode material Substances 0.000 claims 1
- 238000005530 etching Methods 0.000 claims 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- 229910052741 iridium Inorganic materials 0.000 claims 1
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 claims 1
- 229910052751 metal Inorganic materials 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 229910052750 molybdenum Inorganic materials 0.000 claims 1
- 239000011733 molybdenum Substances 0.000 claims 1
- 229910052759 nickel Inorganic materials 0.000 claims 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims 1
- 229910052697 platinum Inorganic materials 0.000 claims 1
- 229910052710 silicon Inorganic materials 0.000 claims 1
- 239000010703 silicon Substances 0.000 claims 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US13/535,127 US8975664B2 (en) | 2012-06-27 | 2012-06-27 | Group III-nitride transistor using a regrown structure |
| US13/535,127 | 2012-06-27 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2017243108A Division JP6554530B2 (ja) | 2012-06-27 | 2017-12-19 | 再成長構造を用いたiii族窒化物トランジスタ |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2014011462A JP2014011462A (ja) | 2014-01-20 |
| JP2014011462A5 true JP2014011462A5 (enExample) | 2016-07-14 |
| JP6335444B2 JP6335444B2 (ja) | 2018-05-30 |
Family
ID=49754231
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013132779A Expired - Fee Related JP6335444B2 (ja) | 2012-06-27 | 2013-06-25 | 再成長構造を用いたiii族窒化物トランジスタ |
| JP2017243108A Expired - Fee Related JP6554530B2 (ja) | 2012-06-27 | 2017-12-19 | 再成長構造を用いたiii族窒化物トランジスタ |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2017243108A Expired - Fee Related JP6554530B2 (ja) | 2012-06-27 | 2017-12-19 | 再成長構造を用いたiii族窒化物トランジスタ |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US8975664B2 (enExample) |
| JP (2) | JP6335444B2 (enExample) |
| DE (1) | DE102013010487A1 (enExample) |
| TW (1) | TWI610438B (enExample) |
Families Citing this family (47)
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| JP2924064B2 (ja) | 1990-03-31 | 1999-07-26 | スズキ株式会社 | パワートレイン |
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| CN104037212B (zh) * | 2013-03-05 | 2019-03-22 | 首尔半导体株式会社 | 氮化物半导体元件及其制造方法 |
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| CN106922200B (zh) * | 2014-12-18 | 2021-11-09 | 英特尔公司 | N沟道氮化镓晶体管 |
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| TWI661555B (zh) * | 2017-12-28 | 2019-06-01 | Nuvoton Technology Corporation | 增強型高電子遷移率電晶體元件 |
| TWI726282B (zh) * | 2019-02-19 | 2021-05-01 | 世界先進積體電路股份有限公司 | 半導體裝置及其製造方法 |
| CN111668302B (zh) * | 2019-03-08 | 2023-03-14 | 世界先进积体电路股份有限公司 | 半导体装置及其制造方法 |
| US11335797B2 (en) | 2019-04-17 | 2022-05-17 | Vanguard International Semiconductor Corporation | Semiconductor devices and methods for fabricating the same |
| CN110676316B (zh) * | 2019-09-20 | 2023-04-11 | 中国电子科技集团公司第十三研究所 | 增强型场效应晶体管 |
| US11658233B2 (en) | 2019-11-19 | 2023-05-23 | Wolfspeed, Inc. | Semiconductors with improved thermal budget and process of making semiconductors with improved thermal budget |
| JP7262379B2 (ja) * | 2019-12-16 | 2023-04-21 | 株式会社東芝 | 半導体装置 |
| CN111463259B (zh) * | 2020-03-10 | 2022-09-13 | 安徽长飞先进半导体有限公司 | 高电子迁移率场效应晶体管及其制备方法 |
| CN111668101B (zh) * | 2020-06-03 | 2022-07-01 | 西安电子科技大学 | 一种增强型氮化镓高电子迁移率晶体管及其制备方法 |
| WO2021246202A1 (ja) * | 2020-06-04 | 2021-12-09 | 三菱電機株式会社 | 半導体装置 |
| CN116034485B (zh) * | 2020-08-28 | 2025-10-03 | 华为技术有限公司 | 一种衬底及功率放大器件 |
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| US11502178B2 (en) | 2020-10-27 | 2022-11-15 | Wolfspeed, Inc. | Field effect transistor with at least partially recessed field plate |
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| US12261168B2 (en) | 2021-02-16 | 2025-03-25 | Efficient Power Conversion Corporation | Gate metal-insulator-field plate metal integrated circuit capacitor and method of forming the same |
| CN113113478B (zh) * | 2021-03-01 | 2022-10-04 | 西安电子科技大学 | 基于欧姆再生长的GaN基射频功率器件及其制备方法 |
| US11581448B2 (en) * | 2021-04-01 | 2023-02-14 | Raytheon Company | Photoconductive semiconductor switch laterally fabricated alongside GaN on Si field effect transistors |
| KR20230000718A (ko) * | 2021-06-25 | 2023-01-03 | 삼성전자주식회사 | 고전자이동도 트랜지스터 및 그 제조 방법 |
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| JP7739982B2 (ja) | 2021-11-30 | 2025-09-17 | 富士通株式会社 | 半導体装置 |
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| WO2023239942A1 (en) * | 2022-06-10 | 2023-12-14 | The Board Of Trustees Of The Leland Stanford Junior University | Passivation and high temperature oxidation of iridium oxide schottky contacts for iii-nitride devices |
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| US5915164A (en) | 1995-12-28 | 1999-06-22 | U.S. Philips Corporation | Methods of making high voltage GaN-A1N based semiconductor devices |
| WO2003015174A2 (en) * | 2001-08-07 | 2003-02-20 | Jan Kuzmik | High electron mobility devices |
| JP2006032552A (ja) | 2004-07-14 | 2006-02-02 | Toshiba Corp | 窒化物含有半導体装置 |
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| JP2008270794A (ja) | 2007-03-29 | 2008-11-06 | Matsushita Electric Ind Co Ltd | 半導体装置及びその製造方法 |
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| TWI512831B (zh) * | 2007-06-01 | 2015-12-11 | Univ California | 氮化鎵p型/氮化鋁鎵/氮化鋁/氮化鎵增強型場效電晶體 |
| JP2008306130A (ja) * | 2007-06-11 | 2008-12-18 | Sanken Electric Co Ltd | 電界効果型半導体装置及びその製造方法 |
| US7795642B2 (en) | 2007-09-14 | 2010-09-14 | Transphorm, Inc. | III-nitride devices with recessed gates |
| US20090072269A1 (en) * | 2007-09-17 | 2009-03-19 | Chang Soo Suh | Gallium nitride diodes and integrated components |
| JP2009231396A (ja) * | 2008-03-19 | 2009-10-08 | Sumitomo Chemical Co Ltd | 半導体装置および半導体装置の製造方法 |
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| JP2010103478A (ja) * | 2008-09-25 | 2010-05-06 | Panasonic Corp | 窒化物半導体装置及びその製造方法 |
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| WO2010151721A1 (en) | 2009-06-25 | 2010-12-29 | The Government Of The United States Of America, As Represented By The Secretary Of The Navy | Transistor with enhanced channel charge inducing material layer and threshold voltage control |
| JP2011082216A (ja) * | 2009-10-02 | 2011-04-21 | Fujitsu Ltd | 化合物半導体装置及びその製造方法 |
| US8748244B1 (en) * | 2010-01-13 | 2014-06-10 | Hrl Laboratories, Llc | Enhancement and depletion mode GaN HMETs on the same substrate |
| JP2011187623A (ja) * | 2010-03-08 | 2011-09-22 | Furukawa Electric Co Ltd:The | 半導体素子、および半導体素子の製造方法 |
| US20110241020A1 (en) | 2010-03-31 | 2011-10-06 | Triquint Semiconductor, Inc. | High electron mobility transistor with recessed barrier layer |
| KR102065115B1 (ko) * | 2010-11-05 | 2020-01-13 | 삼성전자주식회사 | E-모드를 갖는 고 전자 이동도 트랜지스터 및 그 제조방법 |
| KR20130004760A (ko) * | 2011-07-04 | 2013-01-14 | 삼성전자주식회사 | 파워소자 및 이의 제조방법 |
| WO2013095643A1 (en) | 2011-12-23 | 2013-06-27 | Intel Corporation | Iii-n material structure for gate-recessed transistors |
-
2012
- 2012-06-27 US US13/535,127 patent/US8975664B2/en active Active
-
2013
- 2013-06-24 TW TW102122338A patent/TWI610438B/zh not_active IP Right Cessation
- 2013-06-24 DE DE102013010487.4A patent/DE102013010487A1/de not_active Withdrawn
- 2013-06-25 JP JP2013132779A patent/JP6335444B2/ja not_active Expired - Fee Related
-
2017
- 2017-12-19 JP JP2017243108A patent/JP6554530B2/ja not_active Expired - Fee Related
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