|
US3783349A
(en)
*
|
1971-05-25 |
1974-01-01 |
Harris Intertype Corp |
Field effect transistor
|
|
US4152714A
(en)
|
1978-01-16 |
1979-05-01 |
Honeywell Inc. |
Semiconductor apparatus
|
|
JPS55113378A
(en)
*
|
1979-02-23 |
1980-09-01 |
Hitachi Ltd |
Semiconductor device and its manufacturing method
|
|
JPS57106174A
(en)
*
|
1980-12-24 |
1982-07-01 |
Fujitsu Ltd |
Field-effect transistor
|
|
US4819042A
(en)
|
1983-10-31 |
1989-04-04 |
Kaufman Lance R |
Isolated package for multiple semiconductor power components
|
|
US4636825A
(en)
*
|
1985-10-04 |
1987-01-13 |
Fairchild Semiconductor Corporation |
Distributed field effect transistor structure
|
|
JPH07112064B2
(ja)
*
|
1986-02-10 |
1995-11-29 |
株式会社東芝 |
絶縁ゲート電界効果型トランジスタ
|
|
JP2679333B2
(ja)
|
1990-02-26 |
1997-11-19 |
日本電気株式会社 |
ショットキー障壁接合ゲート型電界効果トランジスタ
|
|
US5355008A
(en)
*
|
1993-11-19 |
1994-10-11 |
Micrel, Inc. |
Diamond shaped gate mesh for cellular MOS transistor array
|
|
KR0137975B1
(ko)
|
1994-01-19 |
1998-06-15 |
김주용 |
반도체 장치 및 그 제조방법
|
|
JPH08181307A
(ja)
*
|
1994-12-26 |
1996-07-12 |
Nippondenso Co Ltd |
電界効果型パワ−素子集積回路
|
|
US5767546A
(en)
|
1994-12-30 |
1998-06-16 |
Siliconix Incorporated |
Laternal power mosfet having metal strap layer to reduce distributed resistance
|
|
CN1099713C
(zh)
*
|
1995-04-06 |
2003-01-22 |
工业技术研究院 |
用n边多边形单元布线的mos单元、多单元晶体管及ic芯片
|
|
US5714784A
(en)
|
1995-10-19 |
1998-02-03 |
Winbond Electronics Corporation |
Electrostatic discharge protection device
|
|
US6353290B1
(en)
|
1996-03-06 |
2002-03-05 |
The United States Of America As Represented By The Secretary Of The Army |
Microwave field emitter array limiter
|
|
US5789791A
(en)
|
1996-08-27 |
1998-08-04 |
National Semiconductor Corporation |
Multi-finger MOS transistor with reduced gate resistance
|
|
US6800903B2
(en)
|
1996-11-05 |
2004-10-05 |
Power Integrations, Inc. |
High-voltage transistor with multi-layer conduction region
|
|
US6002156A
(en)
*
|
1997-09-16 |
1999-12-14 |
Winbond Electronics Corp. |
Distributed MOSFET structure with enclosed gate for improved transistor size/layout area ratio and uniform ESD triggering
|
|
US6037822A
(en)
|
1997-09-30 |
2000-03-14 |
Intel Corporation |
Method and apparatus for distributing a clock on the silicon backside of an integrated circuit
|
|
JP3441353B2
(ja)
*
|
1998-01-29 |
2003-09-02 |
京セラ株式会社 |
電界効果型トランジスタ
|
|
US6084266A
(en)
*
|
1998-03-02 |
2000-07-04 |
Vanguard International Semiconductor Corporation |
Layout of semiconductor devices to increase the packing density of a wafer
|
|
JP2000208759A
(ja)
|
1999-01-12 |
2000-07-28 |
Rohm Co Ltd |
半導体装置
|
|
JP3587081B2
(ja)
*
|
1999-05-10 |
2004-11-10 |
豊田合成株式会社 |
Iii族窒化物半導体の製造方法及びiii族窒化物半導体発光素子
|
|
JP2001028425A
(ja)
*
|
1999-07-15 |
2001-01-30 |
Mitsubishi Electric Corp |
半導体装置及びその製造方法
|
|
US6580098B1
(en)
|
1999-07-27 |
2003-06-17 |
Toyoda Gosei Co., Ltd. |
Method for manufacturing gallium nitride compound semiconductor
|
|
GB9919479D0
(en)
|
1999-08-17 |
1999-10-20 |
Imperial College |
Island arrays
|
|
JP4362905B2
(ja)
*
|
1999-09-21 |
2009-11-11 |
富士ゼロックス株式会社 |
自己走査型発光装置、書き込み用光源および光プリンタ
|
|
KR100721139B1
(ko)
|
2000-02-10 |
2007-05-25 |
인터내쇼널 렉티파이어 코포레이션 |
단일면 상에 돌출 접촉부를 갖는 수직 전도성의 플립칩디바이스
|
|
JP4629826B2
(ja)
*
|
2000-02-22 |
2011-02-09 |
パナソニック株式会社 |
半導体集積回路装置
|
|
TW518767B
(en)
|
2000-03-31 |
2003-01-21 |
Toyoda Gosei Kk |
Production method of III nitride compound semiconductor and III nitride compound semiconductor element
|
|
AU2001274810A1
(en)
|
2000-04-17 |
2001-10-30 |
Virginia Commonwealth University |
Defect reduction in gan and related materials
|
|
US6627974B2
(en)
|
2000-06-19 |
2003-09-30 |
Nichia Corporation |
Nitride semiconductor substrate and method for manufacturing the same, and nitride semiconductor device using nitride semiconductor substrate
|
|
US6477023B1
(en)
|
2000-07-12 |
2002-11-05 |
United Microelectronics Corp. |
Electrostatic discharge protection apparatus
|
|
US6737301B2
(en)
*
|
2000-07-13 |
2004-05-18 |
Isothermal Systems Research, Inc. |
Power semiconductor switching devices, power converters, integrated circuit assemblies, integrated circuitry, power current switching methods, methods of forming a power semiconductor switching device, power conversion methods, power semiconductor switching device packaging methods, and methods of forming a power transistor
|
|
US6548333B2
(en)
|
2000-12-01 |
2003-04-15 |
Cree, Inc. |
Aluminum gallium nitride/gallium nitride high electron mobility transistors having a gate contact on a gallium nitride based cap segment
|
|
US7233028B2
(en)
|
2001-02-23 |
2007-06-19 |
Nitronex Corporation |
Gallium nitride material devices and methods of forming the same
|
|
JP3763753B2
(ja)
|
2001-06-05 |
2006-04-05 |
豊田合成株式会社 |
Iii族窒化物系化合物半導体素子及びその製造方法
|
|
CN1241272C
(zh)
|
2001-08-22 |
2006-02-08 |
索尼公司 |
氮化物半导体器件及其制造方法
|
|
US6555873B2
(en)
|
2001-09-07 |
2003-04-29 |
Power Integrations, Inc. |
High-voltage lateral transistor with a multi-layered extended drain structure
|
|
US6894397B2
(en)
*
|
2001-10-03 |
2005-05-17 |
International Rectifier Corporation |
Plural semiconductor devices in monolithic flip chip
|
|
JP3524908B2
(ja)
*
|
2002-01-21 |
2004-05-10 |
株式会社半導体理工学研究センター |
半導体装置
|
|
US6713823B1
(en)
*
|
2002-03-08 |
2004-03-30 |
Volterra Semiconductor Corporation |
Conductive routings in integrated circuits
|
|
JP3968566B2
(ja)
|
2002-03-26 |
2007-08-29 |
日立電線株式会社 |
窒化物半導体結晶の製造方法及び窒化物半導体ウエハ並びに窒化物半導体デバイス
|
|
US7253486B2
(en)
|
2002-07-31 |
2007-08-07 |
Freescale Semiconductor, Inc. |
Field plate transistor with reduced field plate resistance
|
|
TW560120B
(en)
|
2002-09-20 |
2003-11-01 |
Chung Shan Inst Of Science |
Nitride based semiconductor laser diode device including a selective growth mask
|
|
JP4232584B2
(ja)
*
|
2002-10-15 |
2009-03-04 |
株式会社デンソー |
半導体装置
|
|
JP4396200B2
(ja)
*
|
2002-10-30 |
2010-01-13 |
株式会社デンソー |
半導体装置
|
|
US6969909B2
(en)
*
|
2002-12-20 |
2005-11-29 |
Vlt, Inc. |
Flip chip FET device
|
|
JP4510370B2
(ja)
*
|
2002-12-25 |
2010-07-21 |
パナソニック株式会社 |
半導体集積回路装置
|
|
KR100493059B1
(ko)
|
2003-04-18 |
2005-06-02 |
삼성전자주식회사 |
게이트 캐패시턴스를 감소시킬 수 있는 트랜지스터
|
|
US6897561B2
(en)
*
|
2003-06-06 |
2005-05-24 |
Semiconductor Components Industries, Llc |
Semiconductor power device having a diamond shaped metal interconnect scheme
|
|
US7135720B2
(en)
|
2003-08-05 |
2006-11-14 |
Nitronex Corporation |
Gallium nitride material transistors and methods associated with the same
|
|
JP2005117020A
(ja)
|
2003-09-16 |
2005-04-28 |
Stanley Electric Co Ltd |
窒化ガリウム系化合物半導体素子とその製造方法
|
|
KR100799857B1
(ko)
|
2003-10-27 |
2008-01-31 |
삼성전기주식회사 |
전극 구조체 및 이를 구비하는 반도체 발광 소자
|
|
JP4667756B2
(ja)
|
2004-03-03 |
2011-04-13 |
三菱電機株式会社 |
半導体装置
|
|
US7622318B2
(en)
|
2004-03-30 |
2009-11-24 |
Sony Corporation |
Method for producing structured substrate, structured substrate, method for producing semiconductor light emitting device, semiconductor light emitting device, method for producing semiconductor device, semiconductor device, method for producing device, and device
|
|
JP4662198B2
(ja)
*
|
2004-04-14 |
2011-03-30 |
住友電気工業株式会社 |
横型半導体デバイスの配線構造
|
|
JP4810072B2
(ja)
*
|
2004-06-15 |
2011-11-09 |
株式会社東芝 |
窒素化合物含有半導体装置
|
|
US7943949B2
(en)
|
2004-09-09 |
2011-05-17 |
Bridgelux, Inc. |
III-nitride based on semiconductor device with low-resistance ohmic contacts
|
|
JP2006173595A
(ja)
*
|
2004-11-22 |
2006-06-29 |
Matsushita Electric Ind Co Ltd |
半導体集積回路装置及びそれを用いた車載レーダシステム
|
|
JP4272142B2
(ja)
*
|
2004-12-07 |
2009-06-03 |
株式会社ルネサステクノロジ |
スイッチング素子並びにそれを用いたアンテナスイッチ回路及び高周波モジュール
|
|
TWI374553B
(en)
*
|
2004-12-22 |
2012-10-11 |
Panasonic Corp |
Semiconductor light emitting device, illumination module, illumination apparatus, method for manufacturing semiconductor light emitting device, and method for manufacturing semiconductor light emitting element
|
|
TWI261891B
(en)
|
2004-12-24 |
2006-09-11 |
Richtek Technology Corp |
Power metal oxide semiconductor transistor layout with lower output resistance and high current limit
|
|
JP5280611B2
(ja)
*
|
2005-01-31 |
2013-09-04 |
アイメック |
半導体デバイスの製造方法、および得られるデバイス
|
|
JP5076278B2
(ja)
|
2005-03-14 |
2012-11-21 |
日亜化学工業株式会社 |
電界効果トランジスタ
|
|
US7294892B2
(en)
*
|
2005-05-27 |
2007-11-13 |
Faraday Technology Corp. |
Multi-transistor layout capable of saving area
|
|
JP5140962B2
(ja)
|
2005-10-28 |
2013-02-13 |
日亜化学工業株式会社 |
窒化物半導体基板の製造方法
|
|
EP1801855B1
(en)
|
2005-12-22 |
2009-01-14 |
Freiberger Compound Materials GmbH |
Processes for selective masking of III-N layers and for the preparation of free-standing III-N layers or of devices
|
|
US7449762B1
(en)
|
2006-04-07 |
2008-11-11 |
Wide Bandgap Llc |
Lateral epitaxial GaN metal insulator semiconductor field effect transistor
|
|
KR100782430B1
(ko)
|
2006-09-22 |
2007-12-05 |
한국과학기술원 |
고전력을 위한 내부전계전극을 갖는 갈륨나이트라이드기반의 고전자 이동도 트랜지스터 구조
|
|
JP5186096B2
(ja)
*
|
2006-10-12 |
2013-04-17 |
パナソニック株式会社 |
窒化物半導体トランジスタ及びその製造方法
|
|
JP2008108794A
(ja)
*
|
2006-10-23 |
2008-05-08 |
Sanyo Electric Co Ltd |
半導体装置
|
|
JP5105160B2
(ja)
|
2006-11-13 |
2012-12-19 |
クリー インコーポレイテッド |
トランジスタ
|
|
JP4296195B2
(ja)
*
|
2006-11-15 |
2009-07-15 |
シャープ株式会社 |
電界効果トランジスタ
|
|
JP5300238B2
(ja)
*
|
2006-12-19 |
2013-09-25 |
パナソニック株式会社 |
窒化物半導体装置
|
|
JP4712683B2
(ja)
*
|
2006-12-21 |
2011-06-29 |
パナソニック株式会社 |
トランジスタおよびその製造方法
|
|
JP5082752B2
(ja)
|
2006-12-21 |
2012-11-28 |
日亜化学工業株式会社 |
半導体発光素子用基板の製造方法及びそれを用いた半導体発光素子
|
|
JP2008198731A
(ja)
*
|
2007-02-09 |
2008-08-28 |
Toshiba Corp |
半導体装置
|
|
US8212290B2
(en)
|
2007-03-23 |
2012-07-03 |
Cree, Inc. |
High temperature performance capable gallium nitride transistor
|
|
JP2008311355A
(ja)
|
2007-06-13 |
2008-12-25 |
Rohm Co Ltd |
窒化物半導体素子
|
|
CN101730926B
(zh)
|
2007-07-26 |
2012-09-19 |
硅绝缘体技术有限公司 |
改进的外延材料的制造方法
|
|
JP5307991B2
(ja)
*
|
2007-07-27 |
2013-10-02 |
セミコンダクター・コンポーネンツ・インダストリーズ・リミテッド・ライアビリティ・カンパニー |
半導体装置
|
|
GB2451884A
(en)
|
2007-08-16 |
2009-02-18 |
Sharp Kk |
A Semiconductor Device and a Method of Manufacture Thereof
|
|
JP4762217B2
(ja)
|
2007-09-28 |
2011-08-31 |
富士フイルム株式会社 |
導光板、導光板ユニットおよび面状照明装置
|
|
JP5271562B2
(ja)
*
|
2008-02-15 |
2013-08-21 |
本田技研工業株式会社 |
半導体装置および半導体装置の製造方法
|
|
US20090242961A1
(en)
|
2008-03-31 |
2009-10-01 |
Sanh Tang |
Recessed channel select gate for a memory device
|
|
WO2010013195A1
(en)
*
|
2008-07-28 |
2010-02-04 |
Nxp B.V. |
Integrated circuit and method for manufacturing an integrated circuit
|
|
EP2151852B1
(en)
|
2008-08-06 |
2020-01-15 |
Soitec |
Relaxation and transfer of strained layers
|
|
US8367520B2
(en)
|
2008-09-22 |
2013-02-05 |
Soitec |
Methods and structures for altering strain in III-nitride materials
|
|
US9117944B2
(en)
|
2008-09-24 |
2015-08-25 |
Koninklijke Philips N.V. |
Semiconductor light emitting devices grown on composite substrates
|
|
JP2010080877A
(ja)
|
2008-09-29 |
2010-04-08 |
Oki Electric Ind Co Ltd |
半導体装置
|
|
KR101167651B1
(ko)
*
|
2008-10-29 |
2012-07-20 |
후지쯔 가부시끼가이샤 |
화합물 반도체 장치 및 그 제조 방법
|
|
US7851856B2
(en)
|
2008-12-29 |
2010-12-14 |
Alpha & Omega Semiconductor, Ltd |
True CSP power MOSFET based on bottom-source LDMOS
|
|
JP5487631B2
(ja)
*
|
2009-02-04 |
2014-05-07 |
富士通株式会社 |
化合物半導体装置及びその製造方法
|
|
DE112010001555B4
(de)
|
2009-04-08 |
2021-10-07 |
Efficient Power Conversion Corporation |
GaN-HEMT vom Anreicherungstyp und Verfahren zu seiner Herstellung
|
|
WO2010131195A1
(en)
|
2009-05-12 |
2010-11-18 |
Koninklijke Philips Electronics N.V. |
Phosphodiesterase 4d7 as prostate cancer marker
|
|
US9029866B2
(en)
*
|
2009-08-04 |
2015-05-12 |
Gan Systems Inc. |
Gallium nitride power devices using island topography
|
|
JP5985393B2
(ja)
|
2009-08-04 |
2016-09-06 |
ジーエーエヌ システムズ インコーポレイテッド |
アイランドマトリックス化窒化ガリウムマイクロ波トランジスタおよびパワースイッチングトランジスタ
|
|
JP5414415B2
(ja)
|
2009-08-06 |
2014-02-12 |
株式会社日立製作所 |
半導体受光素子及びその製造方法
|
|
US8134205B2
(en)
*
|
2010-01-06 |
2012-03-13 |
Ptek Technology Co., Ltd. |
Layout structure of power MOS transistor
|
|
DE102010001788A1
(de)
*
|
2010-02-10 |
2011-08-11 |
Forschungsverbund Berlin e.V., 12489 |
Skalierbarer Aufbau für laterale Halbleiterbauelemente mit hoher Stromtragfähigkeit
|