CN102893392B - 采用孤岛拓扑结构的高密度氮化镓器件 - Google Patents
采用孤岛拓扑结构的高密度氮化镓器件 Download PDFInfo
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- CN102893392B CN102893392B CN201180020410.7A CN201180020410A CN102893392B CN 102893392 B CN102893392 B CN 102893392B CN 201180020410 A CN201180020410 A CN 201180020410A CN 102893392 B CN102893392 B CN 102893392B
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- H10D30/475—High electron mobility transistors [HEMT] or high hole mobility transistors [HHMT] having wider bandgap layer formed on top of lower bandgap active layer, e.g. undoped barrier HEMTs such as i-AlGaN/GaN HEMTs
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- H10D84/82—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs of only field-effect components
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Junction Field-Effect Transistors (AREA)
- Electrodes Of Semiconductors (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US32347010P | 2010-04-13 | 2010-04-13 | |
| US61/323,470 | 2010-04-13 | ||
| PCT/CA2011/000396 WO2011127568A1 (en) | 2010-04-13 | 2011-04-13 | High density gallium nitride devices using island topology |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102893392A CN102893392A (zh) | 2013-01-23 |
| CN102893392B true CN102893392B (zh) | 2015-08-05 |
Family
ID=44798204
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201180020410.7A Active CN102893392B (zh) | 2010-04-13 | 2011-04-13 | 采用孤岛拓扑结构的高密度氮化镓器件 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US8791508B2 (enExample) |
| EP (1) | EP2559064A4 (enExample) |
| JP (1) | JP6096109B2 (enExample) |
| KR (1) | KR20130088743A (enExample) |
| CN (1) | CN102893392B (enExample) |
| AU (1) | AU2011241423A1 (enExample) |
| CA (1) | CA2796155C (enExample) |
| WO (1) | WO2011127568A1 (enExample) |
Families Citing this family (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9029866B2 (en) | 2009-08-04 | 2015-05-12 | Gan Systems Inc. | Gallium nitride power devices using island topography |
| US9818857B2 (en) | 2009-08-04 | 2017-11-14 | Gan Systems Inc. | Fault tolerant design for large area nitride semiconductor devices |
| USD701843S1 (en) * | 2010-12-28 | 2014-04-01 | Sumitomo Electric Industries, Ltd. | Semiconductor device |
| KR102052307B1 (ko) * | 2011-11-09 | 2019-12-04 | 스카이워크스 솔루션즈, 인코포레이티드 | 전계 효과 트랜지스터 구조 및 관련된 무선-주파수 스위치 |
| US8921986B2 (en) * | 2013-03-15 | 2014-12-30 | Microchip Technology Incorporated | Insulated bump bonding |
| EP3063792B1 (en) * | 2013-10-29 | 2019-06-12 | Gan Systems Inc. | Fault tolerant design for large area nitride semiconductor devices |
| WO2015096605A1 (zh) * | 2013-12-23 | 2015-07-02 | 梁嘉进 | 分裂栅功率半导体场效应晶体管 |
| GB201418752D0 (en) * | 2014-10-22 | 2014-12-03 | Rolls Royce Plc | Lateral field effect transistor device |
| CN104617092B (zh) * | 2014-11-06 | 2018-06-22 | 苏州捷芯威半导体有限公司 | 一种半导体器件及其制作方法 |
| FR3040539B1 (fr) | 2015-08-28 | 2018-03-09 | Stmicroelectronics (Tours) Sas | Diode schottky haute tension a nitrure de gallium |
| US10403624B2 (en) | 2017-05-26 | 2019-09-03 | Stmicroelectronics Design And Application S.R.O. | Transistors with octagon waffle gate patterns |
| US10147796B1 (en) * | 2017-05-26 | 2018-12-04 | Stmicroelectronics Design And Application S.R.O. | Transistors with dissimilar square waffle gate patterns |
| US10529802B2 (en) | 2017-09-14 | 2020-01-07 | Gan Systems Inc. | Scalable circuit-under-pad device topologies for lateral GaN power transistors |
| US10218346B1 (en) | 2017-09-14 | 2019-02-26 | Gan Systems Inc. | High current lateral GaN transistors with scalable topology and gate drive phase equalization |
| CN109994456A (zh) * | 2017-12-30 | 2019-07-09 | 镓能半导体(佛山)有限公司 | 一种氮化镓器件及氮化镓封装结构 |
| IT201800010195A1 (it) | 2018-11-09 | 2020-05-09 | St Microelectronics Srl | Dispositivo elettronico a conduzione laterale basato su gan con layout degli strati metallici migliorato |
| US11515235B2 (en) | 2020-10-30 | 2022-11-29 | Gan Systems Inc. | Device topology for lateral power transistors with low common source inductance |
| US11527460B2 (en) | 2020-10-30 | 2022-12-13 | Gan Systems Inc. | Device topologies for high current lateral power semiconductor devices |
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| CA2796155C (en) | 2013-11-05 |
| US20130049010A1 (en) | 2013-02-28 |
| CN102893392A (zh) | 2013-01-23 |
| JP2013528930A (ja) | 2013-07-11 |
| KR20130088743A (ko) | 2013-08-08 |
| AU2011241423A1 (en) | 2012-11-08 |
| EP2559064A1 (en) | 2013-02-20 |
| WO2011127568A4 (en) | 2012-01-12 |
| US8791508B2 (en) | 2014-07-29 |
| JP6096109B2 (ja) | 2017-03-15 |
| WO2011127568A1 (en) | 2011-10-20 |
| EP2559064A4 (en) | 2018-07-18 |
| CA2796155A1 (en) | 2011-10-20 |
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