JP2013512535A5 - - Google Patents

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Publication number
JP2013512535A5
JP2013512535A5 JP2012540092A JP2012540092A JP2013512535A5 JP 2013512535 A5 JP2013512535 A5 JP 2013512535A5 JP 2012540092 A JP2012540092 A JP 2012540092A JP 2012540092 A JP2012540092 A JP 2012540092A JP 2013512535 A5 JP2013512535 A5 JP 2013512535A5
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JP
Japan
Prior art keywords
polyimide
wire wrap
layer
wrap composition
dianhydride
Prior art date
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Pending
Application number
JP2012540092A
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English (en)
Japanese (ja)
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JP2013512535A (ja
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Priority claimed from PCT/US2010/057434 external-priority patent/WO2011063238A1/en
Publication of JP2013512535A publication Critical patent/JP2013512535A/ja
Publication of JP2013512535A5 publication Critical patent/JP2013512535A5/ja
Pending legal-status Critical Current

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JP2012540092A 2009-11-20 2010-11-19 ワイヤーラップ組成物、およびそれに関連する方法 Pending JP2013512535A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US26326609P 2009-11-20 2009-11-20
US61/263,266 2009-11-20
PCT/US2010/057434 WO2011063238A1 (en) 2009-11-20 2010-11-19 Wire wrap compositions and methods relating thereto

Publications (2)

Publication Number Publication Date
JP2013512535A JP2013512535A (ja) 2013-04-11
JP2013512535A5 true JP2013512535A5 (enExample) 2013-11-28

Family

ID=43458223

Family Applications (6)

Application Number Title Priority Date Filing Date
JP2012540088A Pending JP2013511412A (ja) 2009-11-20 2010-11-19 カバーレイ組成物、およびそれに関連する方法
JP2012540079A Pending JP2013511599A (ja) 2009-11-20 2010-11-19 熱安定性および寸法安定性ポリイミドフィルム、ならびにそれに関連する方法
JP2012540096A Pending JP2013511603A (ja) 2009-11-20 2010-11-19 半導体パッケージング用途において有用なインターポーザーフィルム、およびそれに関連する方法
JP2012540080A Pending JP2013511600A (ja) 2009-11-20 2010-11-19 薄膜トランジスタ組成物、およびそれに関連する方法
JP2012540092A Pending JP2013512535A (ja) 2009-11-20 2010-11-19 ワイヤーラップ組成物、およびそれに関連する方法
JP2012540083A Pending JP2013511601A (ja) 2009-11-20 2010-11-19 ポリイミドフィルムおよび電極を備えるアセンブリ、ならびにそれに関連する方法

Family Applications Before (4)

Application Number Title Priority Date Filing Date
JP2012540088A Pending JP2013511412A (ja) 2009-11-20 2010-11-19 カバーレイ組成物、およびそれに関連する方法
JP2012540079A Pending JP2013511599A (ja) 2009-11-20 2010-11-19 熱安定性および寸法安定性ポリイミドフィルム、ならびにそれに関連する方法
JP2012540096A Pending JP2013511603A (ja) 2009-11-20 2010-11-19 半導体パッケージング用途において有用なインターポーザーフィルム、およびそれに関連する方法
JP2012540080A Pending JP2013511600A (ja) 2009-11-20 2010-11-19 薄膜トランジスタ組成物、およびそれに関連する方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2012540083A Pending JP2013511601A (ja) 2009-11-20 2010-11-19 ポリイミドフィルムおよび電極を備えるアセンブリ、ならびにそれに関連する方法

Country Status (6)

Country Link
US (6) US20120231263A1 (enExample)
EP (6) EP2501743B1 (enExample)
JP (6) JP2013511412A (enExample)
KR (6) KR20120096000A (enExample)
CN (6) CN102712754A (enExample)
WO (6) WO2011063204A1 (enExample)

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