TWI455822B - 高導熱性聚醯亞胺薄膜、高導熱性貼金屬層合體及其之製造方法 - Google Patents

高導熱性聚醯亞胺薄膜、高導熱性貼金屬層合體及其之製造方法 Download PDF

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TWI455822B
TWI455822B TW098130076A TW98130076A TWI455822B TW I455822 B TWI455822 B TW I455822B TW 098130076 A TW098130076 A TW 098130076A TW 98130076 A TW98130076 A TW 98130076A TW I455822 B TWI455822 B TW I455822B
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filler
thermal conductivity
spherical
plate
polyimide film
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TW201014707A (en
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Eijiro Aoyagi
Hongyuan Wang
Noriyuki Kirikae
Katsufumi Hiraishi
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Nippon Steel & Sumikin Chem Co
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/16—Layered products comprising a layer of metal next to a particulate layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2227—Oxides; Hydroxides of metals of aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/38—Boron-containing compounds
    • C08K2003/382—Boron-containing compounds and nitrogen
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0242—Shape of an individual particle
    • H05K2201/0245—Flakes, flat particles or lamellar particles
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y10T428/252—Glass or ceramic [i.e., fired or glazed clay, cement, etc.] [porcelain, quartz, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y10T428/256—Heavy metal or aluminum or compound thereof
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y10T428/256—Heavy metal or aluminum or compound thereof
    • Y10T428/257—Iron oxide or aluminum oxide

Claims (9)

  1. 一種高導熱性貼金屬層合體，係在絕緣層之單面或兩面上具有金屬層之層合體中，且該絕緣層係在聚醯亞胺樹脂中至少具有一層含有導熱性填充劑之含填充劑聚醯亞胺樹脂層者；其特徵為：該含填充劑聚醯亞胺樹脂層中之導熱性填充劑之含有比例係20~80wt%，該導熱性填充劑，其含有平均長徑DL 係0.1~15μm之板狀填充劑，以及平均粒徑DR 係0.05~10μm之球狀填充劑，該板狀填充劑係選自氧化鋁及氮化硼所成群之至少一種，且該球狀填充劑係選自氧化鋁、熔融二氧化矽及氮化鋁所成群之至少一種，該平均長徑DL 及平均粒徑DR 之關係則滿足DL >DR /2，其不含30μm以上之導熱性填充劑，該導熱性填充劑中，其板狀填充劑中之長徑為9μm以上之板狀填充劑及球狀填充劑中之粒徑為9μm以上之球狀填充劑之合計，係全體之導熱性填充劑量之50wt%以下，且絕緣層之熱膨脹係數為10~30ppm/K之範圍。
  2. 如申請專利範圍第1項之高導熱性貼金屬層合體，其中絕緣層之厚度係10~50μm之範圍，且導熱率在絕緣層之厚度方向為0.5W/mK以上，而在平面方向為1.0W/mK以上者。
  3. 如申請專利範圍第1項之高導熱性貼金屬層合體，其中構成絕緣層之聚醯亞胺樹脂之玻璃態化溫度係300℃以上者。
  4. 一種高導熱性貼金屬層合體之製造方法，其特徵 為：其係具有在金屬層上或塗佈於金屬層上之聚醯亞胺樹脂或其前驅體樹脂上，將含有20~80wt%之導熱性填充劑之聚醯胺酸溶液進行塗佈、乾燥及硬化所得到之至少一層之含填充劑聚醯亞胺樹脂層，且絕緣層之熱膨脹係數為10~30ppm/K範圍之層合體之製造方法；該導熱性填充劑，其含有平均長徑DL 係0.1~15μm之板狀填充劑，以及平均粒徑DR 係0.05~10μm之球狀填充劑，該板狀填充劑係選自氧化鋁及氮化硼所成群之至少一種，且該球狀填充劑係選自氧化鋁、熔融二氧化矽及氮化鋁所成群之至少一種，該平均長徑DL 及平均粒徑DR 之關係則滿足DL >DR /2，該導熱性填充劑中，其板狀填充劑中之長徑為9μm以上之板狀填充劑及球狀填充劑中之粒徑為9μm以上之球狀填充劑之合計，係全體之導熱性填充劑量之50wt%以下，且不含30μm以上之導熱性填充劑。
  5. 一種高導熱性聚醯亞胺薄膜，係在聚醯亞胺樹脂中至少具有一層含有導熱性填充劑之含填充劑聚醯亞胺樹脂層之聚醯亞胺薄膜中，其特徵為：該含填充劑聚醯亞胺樹脂層中之導熱性填充劑之含有比例係20~80wt%，該導熱性填充劑，其含有平均長徑DL 係0.1~15μm之板狀填充劑，以及平均粒徑DR 係0.05~10μm之球狀填充劑，該板狀填充劑係選自氧化鋁及氮化硼所成群之至少一種，且該球狀填充劑係選自氧化鋁、熔融二氧化矽及氮化鋁所成群之至少一種，該平均長徑DL 及平均粒徑DR 之關係則滿足DL >DR /2，該導熱性填充劑中，其板狀填充劑中之 長徑為9μm以上之板狀填充劑及球狀填充劑中之粒徑為9μm以上之球狀填充劑之合計，係全體之導熱性填充劑量之50wt%以下，其不含30μm以上之導熱性填充劑，且聚醯亞胺薄膜之熱膨脹係數為10~30ppm/K之範圍。
  6. 如申請專利範圍第5項之高導熱性聚醯亞胺薄膜，其中聚醯亞胺薄膜之厚度係10~50μm之範圍，且導熱率在聚醯亞胺薄膜之厚度方向為0.5W/mK以上，而在平面方向為1.0W/mK以上者。
  7. 如申請專利範圍第5項之高導熱性聚醯亞胺薄膜，其中構成聚醯亞胺薄膜之聚醯亞胺樹脂之玻璃態化溫度係300℃以上者。
  8. 如申請專利範圍第1項之高導熱性貼金屬層合體，其中導熱性填充劑中，球狀填充劑之含有比例在25~70wt%之範圍。
  9. 如申請專利範圍第5項之高導熱性聚醯亞胺薄膜，其中導熱性填充劑中，球狀填充劑之含有比例在25~70wt%之範圍。
TW098130076A 2008-09-08 2009-09-07 高導熱性聚醯亞胺薄膜、高導熱性貼金屬層合體及其之製造方法 TWI455822B (zh)

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