JP2011109108A5 - - Google Patents
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- Publication number
- JP2011109108A5 JP2011109108A5 JP2010259876A JP2010259876A JP2011109108A5 JP 2011109108 A5 JP2011109108 A5 JP 2011109108A5 JP 2010259876 A JP2010259876 A JP 2010259876A JP 2010259876 A JP2010259876 A JP 2010259876A JP 2011109108 A5 JP2011109108 A5 JP 2011109108A5
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor material
- layer
- deposited
- substrate
- deposition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 claims description 29
- 239000000463 material Substances 0.000 claims description 21
- 239000004065 semiconductor Substances 0.000 claims description 21
- 239000000758 substrate Substances 0.000 claims description 16
- 238000000151 deposition Methods 0.000 claims description 10
- 229910052751 metal Inorganic materials 0.000 claims description 10
- 239000002184 metal Substances 0.000 claims description 10
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 9
- 229910021417 amorphous silicon Inorganic materials 0.000 claims description 9
- 229910052710 silicon Inorganic materials 0.000 claims description 9
- 239000010703 silicon Substances 0.000 claims description 9
- 230000008021 deposition Effects 0.000 claims description 8
- 239000000945 filler Substances 0.000 claims description 8
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 claims description 6
- 238000002161 passivation Methods 0.000 claims description 6
- VLDPXPPHXDGHEW-UHFFFAOYSA-N 1-chloro-2-dichlorophosphoryloxybenzene Chemical compound ClC1=CC=CC=C1OP(Cl)(Cl)=O VLDPXPPHXDGHEW-UHFFFAOYSA-N 0.000 claims description 4
- 239000004642 Polyimide Substances 0.000 claims description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 4
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 4
- 150000004984 aromatic diamines Chemical class 0.000 claims description 4
- 150000004985 diamines Chemical class 0.000 claims description 4
- 229920001721 polyimide Polymers 0.000 claims description 4
- 125000003118 aryl group Chemical group 0.000 claims description 3
- 239000000203 mixture Substances 0.000 claims description 3
- KQSABULTKYLFEV-UHFFFAOYSA-N naphthalene-1,5-diamine Chemical compound C1=CC=C2C(N)=CC=CC2=C1N KQSABULTKYLFEV-UHFFFAOYSA-N 0.000 claims description 3
- CBCKQZAAMUWICA-UHFFFAOYSA-N 1,4-phenylenediamine Chemical group NC1=CC=C(N)C=C1 CBCKQZAAMUWICA-UHFFFAOYSA-N 0.000 claims description 2
- NVKGJHAQGWCWDI-UHFFFAOYSA-N 4-[4-amino-2-(trifluoromethyl)phenyl]-3-(trifluoromethyl)aniline Chemical compound FC(F)(F)C1=CC(N)=CC=C1C1=CC=C(N)C=C1C(F)(F)F NVKGJHAQGWCWDI-UHFFFAOYSA-N 0.000 claims description 2
- HFACYLZERDEVSX-UHFFFAOYSA-N benzidine Chemical group C1=CC(N)=CC=C1C1=CC=C(N)C=C1 HFACYLZERDEVSX-UHFFFAOYSA-N 0.000 claims description 2
- WKDNYTOXBCRNPV-UHFFFAOYSA-N bpda Chemical compound C1=C2C(=O)OC(=O)C2=CC(C=2C=C3C(=O)OC(C3=CC=2)=O)=C1 WKDNYTOXBCRNPV-UHFFFAOYSA-N 0.000 claims description 2
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims description 2
- 239000003989 dielectric material Substances 0.000 claims description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 2
- 235000012239 silicon dioxide Nutrition 0.000 claims description 2
- 239000000377 silicon dioxide Substances 0.000 claims description 2
- 239000004408 titanium dioxide Substances 0.000 claims description 2
- 125000002023 trifluoromethyl group Chemical group FC(F)(F)* 0.000 claims description 2
- OKBVMLGZPNDWJK-UHFFFAOYSA-N naphthalene-1,4-diamine Chemical compound C1=CC=C2C(N)=CC=C(N)C2=C1 OKBVMLGZPNDWJK-UHFFFAOYSA-N 0.000 claims 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US12/622,789 US8319299B2 (en) | 2009-11-20 | 2009-11-20 | Thin film transistor compositions, and methods relating thereto |
| US12/622,789 | 2009-11-20 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2011109108A JP2011109108A (ja) | 2011-06-02 |
| JP2011109108A5 true JP2011109108A5 (enExample) | 2014-01-16 |
| JP5731171B2 JP5731171B2 (ja) | 2015-06-10 |
Family
ID=43902287
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010259876A Expired - Fee Related JP5731171B2 (ja) | 2009-11-20 | 2010-11-22 | 薄膜トランジスタ組成物およびこれに関する方法 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US8319299B2 (enExample) |
| JP (1) | JP5731171B2 (enExample) |
| KR (1) | KR20110056241A (enExample) |
| CN (1) | CN102074480B (enExample) |
| DE (1) | DE102010051851A1 (enExample) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101125567B1 (ko) * | 2009-12-24 | 2012-03-22 | 삼성모바일디스플레이주식회사 | 고분자 기판 및 그 제조 방법과 상기 고분자 기판을 포함하는 표시 장치 및 그 제조 방법 |
| KR101728486B1 (ko) * | 2010-03-31 | 2017-04-20 | 삼성디스플레이 주식회사 | 박막 트랜지스터, 그 제조 방법 및 이를 포함하는 플렉시블 디스플레이 장치 |
| CN103354243B (zh) * | 2013-06-28 | 2016-01-06 | 京东方科技集团股份有限公司 | 一种薄膜晶体管、其制备方法及相关装置 |
| CN106893121B (zh) * | 2015-12-17 | 2020-07-03 | 深圳瑞华泰薄膜科技股份有限公司 | 一种高尺寸稳定型聚酰亚胺薄膜及其制备方法 |
| US10424670B2 (en) | 2016-12-30 | 2019-09-24 | Intel Corporation | Display panel with reduced power consumption |
| CN119212488A (zh) * | 2020-03-31 | 2024-12-27 | 华为技术有限公司 | 一种显示组件、显示装置和指纹识别方法 |
| CN116067241B (zh) * | 2023-03-02 | 2023-08-29 | 中国工程物理研究院激光聚变研究中心 | 一种纤维改性的三明治飞片结构及其制备方法 |
Family Cites Families (39)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS603430B2 (ja) * | 1980-08-13 | 1985-01-28 | 石原産業株式会社 | 重合体組成物用二酸化チタン顔料 |
| JPS63312328A (ja) | 1987-06-15 | 1988-12-20 | Tokai Carbon Co Ltd | ＳｉＣウイスカ−強化ポリイミド樹脂の製造方法 |
| US5837767A (en) | 1994-10-31 | 1998-11-17 | Ntn Corporation | Stripping fingers |
| US6120588A (en) | 1996-07-19 | 2000-09-19 | E Ink Corporation | Electronically addressable microencapsulated ink and display thereof |
| US6120839A (en) | 1995-07-20 | 2000-09-19 | E Ink Corporation | Electro-osmotic displays and materials for making the same |
| US6124851A (en) | 1995-07-20 | 2000-09-26 | E Ink Corporation | Electronic book with multiple page displays |
| US6017584A (en) | 1995-07-20 | 2000-01-25 | E Ink Corporation | Multi-color electrophoretic displays and materials for making the same |
| US6118426A (en) | 1995-07-20 | 2000-09-12 | E Ink Corporation | Transducers and indicators having printed displays |
| JP3679224B2 (ja) | 1996-05-10 | 2005-08-03 | Ｎｔｎ株式会社 | 分離爪 |
| US5930026A (en) | 1996-10-25 | 1999-07-27 | Massachusetts Institute Of Technology | Nonemissive displays and piezoelectric power supplies therefor |
| US5961804A (en) | 1997-03-18 | 1999-10-05 | Massachusetts Institute Of Technology | Microencapsulated electrophoretic display |
| US6067185A (en) | 1997-08-28 | 2000-05-23 | E Ink Corporation | Process for creating an encapsulated electrophoretic display |
| CN1085707C (zh) | 1997-10-23 | 2002-05-29 | 上海市合成树脂研究所 | 钛酸钾晶须增强聚酰亚胺复合材料的制备方法 |
| WO1999056171A1 (en) | 1998-04-27 | 1999-11-04 | E-Ink Corporation | Shutter mode microencapsulated electrophoretic display |
| KR100519366B1 (ko) * | 1999-04-03 | 2005-10-07 | 엘지.필립스 엘시디 주식회사 | 멀티도메인 액정표시소자 |
| US6372538B1 (en) | 2000-03-16 | 2002-04-16 | University Of Delaware | Fabrication of thin-film, flexible photovoltaic module |
| US6825068B2 (en) | 2000-04-18 | 2004-11-30 | E Ink Corporation | Process for fabricating thin film transistors |
| US6710456B1 (en) * | 2000-08-31 | 2004-03-23 | Micron Technology, Inc. | Composite interposer for BGA packages |
| US7416695B2 (en) | 2001-06-15 | 2008-08-26 | Kaneka Corporation | Semiconductive polymide film and process for production thereof |
| CN100580014C (zh) * | 2001-06-15 | 2010-01-13 | 株式会社钟化 | 半导电性聚酰亚胺膜及其制造方法 |
| US7271333B2 (en) | 2001-07-20 | 2007-09-18 | Ascent Solar Technologies, Inc. | Apparatus and method of production of thin film photovoltaic modules |
| JP2003082231A (ja) | 2001-09-17 | 2003-03-19 | Kanegafuchi Chem Ind Co Ltd | ポリイミド樹脂組成物、ポリイミドフィルムおよびポリイミド管状物 |
| JP2003306553A (ja) * | 2002-04-15 | 2003-10-31 | Kanegafuchi Chem Ind Co Ltd | ポリイミド成形体 |
| JP2004035825A (ja) | 2002-07-05 | 2004-02-05 | Kanegafuchi Chem Ind Co Ltd | 半導電性ポリイミドフィルムおよびその製造方法 |
| JP4119700B2 (ja) | 2002-07-26 | 2008-07-16 | 株式会社カネカ | 樹脂添加用無機粉体分散液の製造方法、並びに、ポリイミドフィルムおよびポリアミドイミドフィルム |
| AU2003289846A1 (en) | 2002-08-16 | 2004-03-11 | Daimlerchrysler Ag | Body part of a vehicle provided with a thin-film solar cell and the production thereof |
| WO2005006393A2 (en) | 2003-05-27 | 2005-01-20 | Triton Systems, Inc. | Pinhold porosity free insulating films on flexible metallic substrates for thin film applications |
| JP2005105035A (ja) * | 2003-09-29 | 2005-04-21 | Asahi Schwebel Co Ltd | プリプレグとその製造方法、及び積層板 |
| US20050163968A1 (en) | 2004-01-20 | 2005-07-28 | Hanket Gregory M. | Microfiller-reinforced polymer film |
| CN1320060C (zh) | 2004-04-01 | 2007-06-06 | 中国科学院化学研究所 | 一种短纤维增强聚酰亚胺复合材料及制备方法和用途 |
| JP2006028216A (ja) | 2004-07-12 | 2006-02-02 | Kaneka Corp | ポリイミドフィルム及び該ポリイミドフィルムの製造方法 |
| JP2007046045A (ja) * | 2005-07-13 | 2007-02-22 | Teijin Ltd | ポリイミドフィルム基材 |
| WO2007011742A2 (en) | 2005-07-14 | 2007-01-25 | Konarka Technologies, Inc. | Cigs photovoltaic cells |
| US7466377B2 (en) * | 2005-08-26 | 2008-12-16 | Konica Minolta Opto, Inc. | Retardation film, manufacturing method thereof, polarizing plate and liquid crystal display apparatus |
| DE102006016307B4 (de) | 2006-04-06 | 2011-07-28 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V., 80686 | Thermisch stabile Matrixmikropartikel und Mikrokapseln für die Kunststoffadditivierung und Verfahren zu ihrer Herstellung und ihre Verwendung |
| TWI342323B (en) * | 2007-01-22 | 2011-05-21 | Chang Chun Plastics Co Ltd | Thermoset resin modified polyimide resin composition |
| US8476735B2 (en) * | 2007-05-29 | 2013-07-02 | Taiwan Semiconductor Manufacturing Company, Ltd. | Programmable semiconductor interposer for electronic package and method of forming |
| JP5489410B2 (ja) * | 2008-02-18 | 2014-05-14 | 富士フイルム株式会社 | 薄膜電界効果型トランジスタおよびそれを用いた表示装置 |
| DE112009001229B4 (de) * | 2008-05-20 | 2015-10-29 | E.I. Du Pont De Nemours And Co. | Thermisch und dimensional stabile Polyimidfolien und Verfahren, die sich darauf beziehen |
-
2009
- 2009-11-20 US US12/622,789 patent/US8319299B2/en not_active Expired - Fee Related
-
2010
- 2010-09-25 CN CN201010500645.3A patent/CN102074480B/zh not_active Expired - Fee Related
- 2010-11-18 DE DE102010051851A patent/DE102010051851A1/de not_active Withdrawn
- 2010-11-19 KR KR1020100115336A patent/KR20110056241A/ko not_active Withdrawn
- 2010-11-22 JP JP2010259876A patent/JP5731171B2/ja not_active Expired - Fee Related
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