JP2011521076A5 - - Google Patents

Download PDF

Info

Publication number
JP2011521076A5
JP2011521076A5 JP2011510570A JP2011510570A JP2011521076A5 JP 2011521076 A5 JP2011521076 A5 JP 2011521076A5 JP 2011510570 A JP2011510570 A JP 2011510570A JP 2011510570 A JP2011510570 A JP 2011510570A JP 2011521076 A5 JP2011521076 A5 JP 2011521076A5
Authority
JP
Japan
Prior art keywords
film
less
filler
dianhydride
microns
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2011510570A
Other languages
English (en)
Japanese (ja)
Other versions
JP2011521076A (ja
JP5346078B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/US2009/043439 external-priority patent/WO2009142938A1/en
Publication of JP2011521076A publication Critical patent/JP2011521076A/ja
Publication of JP2011521076A5 publication Critical patent/JP2011521076A5/ja
Application granted granted Critical
Publication of JP5346078B2 publication Critical patent/JP5346078B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2011510570A 2008-05-20 2009-05-11 熱および寸法安定性ポリイミドフィルム、ならびに、これに関する方法 Expired - Fee Related JP5346078B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US5450908P 2008-05-20 2008-05-20
US61/054,509 2008-05-20
PCT/US2009/043439 WO2009142938A1 (en) 2008-05-20 2009-05-11 Thermally and dimensionally stable polyimide films and methods relating thereto

Publications (3)

Publication Number Publication Date
JP2011521076A JP2011521076A (ja) 2011-07-21
JP2011521076A5 true JP2011521076A5 (enExample) 2012-06-28
JP5346078B2 JP5346078B2 (ja) 2013-11-20

Family

ID=40786468

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2011510570A Expired - Fee Related JP5346078B2 (ja) 2008-05-20 2009-05-11 熱および寸法安定性ポリイミドフィルム、ならびに、これに関する方法
JP2011510606A Pending JP2011525698A (ja) 2008-05-20 2009-05-18 熱および寸法安定性ポリイミドフィルム、電極および吸光体層を備えるアセンブリ、ならびに、これに関する方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2011510606A Pending JP2011525698A (ja) 2008-05-20 2009-05-18 熱および寸法安定性ポリイミドフィルム、電極および吸光体層を備えるアセンブリ、ならびに、これに関する方法

Country Status (4)

Country Link
US (2) US20120009406A1 (enExample)
JP (2) JP5346078B2 (enExample)
DE (2) DE112009001229B4 (enExample)
WO (3) WO2009142938A1 (enExample)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8176564B2 (en) * 2004-11-15 2012-05-08 Microsoft Corporation Special PC mode entered upon detection of undesired state
US8319299B2 (en) * 2009-11-20 2012-11-27 Auman Brian C Thin film transistor compositions, and methods relating thereto
CN102712753B (zh) * 2009-11-20 2015-08-26 E·I·内穆尔杜邦公司 热稳定的且尺寸稳定的聚酰亚胺薄膜及与其相关的方法
KR101125567B1 (ko) * 2009-12-24 2012-03-22 삼성모바일디스플레이주식회사 고분자 기판 및 그 제조 방법과 상기 고분자 기판을 포함하는 표시 장치 및 그 제조 방법
CN103081145B (zh) 2010-08-18 2016-11-16 E·I·内穆尔杜邦公司 发光二极管组件和热控制覆盖层以及与其相关的方法
US8853723B2 (en) * 2010-08-18 2014-10-07 E. I. Du Pont De Nemours And Company Light emitting diode assembly and thermal control blanket and methods relating thereto
JP5655206B2 (ja) 2010-09-21 2015-01-21 株式会社ピーアイ技術研究所 太陽電池の裏面反射層形成用ポリイミド樹脂組成物及びそれを用いた太陽電池の裏面反射層形成方法
KR20130097781A (ko) * 2010-09-29 2013-09-03 이 아이 듀폰 디 네모아 앤드 캄파니 고온 용도를 위한 폴리이미드 수지
CN102532521B (zh) * 2010-12-15 2014-03-12 慧濠光电科技股份有限公司 含光吸收功能的纳米晶粒的高分子复合材料的制作方法
CN103137239B (zh) * 2011-11-25 2015-11-25 比亚迪股份有限公司 一种太阳能电池正面电极银浆及其制备方法、以及一种太阳能电池片
CN103897391B (zh) * 2012-12-31 2017-04-12 中原工学院 薄膜太阳能电池用光固化聚酰亚胺膜及其制备方法
TWI735421B (zh) * 2015-01-22 2021-08-11 日商尤尼吉可股份有限公司 積層體、其製造方法及使用方法、暨無鹼玻璃基板積層用聚醯亞胺前驅體溶液
WO2017197077A1 (en) * 2016-05-12 2017-11-16 E I Du Pont De Nemours And Company Polyimide compositions and a polyimide test socket housing
DE102020108932A1 (de) 2020-03-31 2021-09-30 Kerafol Holding Gmbh Folienbauteil sowie Verfahren zu dessen Herstellung

Family Cites Families (51)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58218127A (ja) * 1982-06-11 1983-12-19 Hitachi Chem Co Ltd 半導体装置の保護被膜材料用組成物
US4522958A (en) * 1983-09-06 1985-06-11 Ppg Industries, Inc. High-solids coating composition for improved rheology control containing chemically modified inorganic microparticles
JPH0618068B2 (ja) * 1985-09-12 1994-03-09 キヤノン株式会社 磁気記録媒体およびベ−スフイルム
JPH0665708B2 (ja) * 1985-11-29 1994-08-24 鐘淵化学工業株式会社 新規ポリイミドフィルム及びその製造法
US4927874A (en) * 1987-01-14 1990-05-22 Cyprus Mines Corporation Beneficiated talcs
US5324766A (en) * 1989-07-07 1994-06-28 Mitsui Petrochemical Industries, Ltd. Resin composition for forming plated layer and use thereof
US5166308A (en) * 1990-04-30 1992-11-24 E. I. Du Pont De Nemours And Company Copolyimide film with improved properties
US5148266A (en) * 1990-09-24 1992-09-15 Ist Associates, Inc. Semiconductor chip assemblies having interposer and flexible lead
US5148265A (en) * 1990-09-24 1992-09-15 Ist Associates, Inc. Semiconductor chip assemblies with fan-in leads
JP3151219B2 (ja) * 1992-07-24 2001-04-03 テツセラ,インコーポレイテッド 取り外し自在のリード支持体を備えた半導体接続構成体およびその製造方法
US5441897A (en) 1993-04-12 1995-08-15 Midwest Research Institute Method of fabricating high-efficiency Cu(In,Ga)(SeS)2 thin films for solar cells
US5436204A (en) 1993-04-12 1995-07-25 Midwest Research Institute Recrystallization method to selenization of thin-film Cu(In,Ga)Se2 for semiconductor device applications
US5510174A (en) * 1993-07-14 1996-04-23 Chomerics, Inc. Thermally conductive materials containing titanium diboride filler
US5837767A (en) * 1994-10-31 1998-11-17 Ntn Corporation Stripping fingers
JPH08134232A (ja) * 1994-11-11 1996-05-28 Ube Ind Ltd ポリイミドフィルム、積層体およびフレキシブル回路用基板
US5648407A (en) * 1995-05-16 1997-07-15 Minnesota Mining And Manufacturing Company Curable resin sols and fiber-reinforced composites derived therefrom
US6120588A (en) * 1996-07-19 2000-09-19 E Ink Corporation Electronically addressable microencapsulated ink and display thereof
US6017584A (en) * 1995-07-20 2000-01-25 E Ink Corporation Multi-color electrophoretic displays and materials for making the same
US6118426A (en) * 1995-07-20 2000-09-12 E Ink Corporation Transducers and indicators having printed displays
US6124851A (en) * 1995-07-20 2000-09-26 E Ink Corporation Electronic book with multiple page displays
US6120839A (en) * 1995-07-20 2000-09-19 E Ink Corporation Electro-osmotic displays and materials for making the same
US5821608A (en) * 1995-09-08 1998-10-13 Tessera, Inc. Laterally situated stress/strain relieving lead for a semiconductor chip package
US5930026A (en) * 1996-10-25 1999-07-27 Massachusetts Institute Of Technology Nonemissive displays and piezoelectric power supplies therefor
US5961804A (en) * 1997-03-18 1999-10-05 Massachusetts Institute Of Technology Microencapsulated electrophoretic display
JPH11333376A (ja) * 1997-06-23 1999-12-07 Unitika Ltd ポリイミド前駆体溶液並びにそれから得られる塗膜及びその製造方法
JP3346228B2 (ja) * 1997-07-11 2002-11-18 宇部興産株式会社 芳香族ポリイミドフィルム、積層体および太陽電池
US6067185A (en) * 1997-08-28 2000-05-23 E Ink Corporation Process for creating an encapsulated electrophoretic display
JP3346265B2 (ja) * 1998-02-27 2002-11-18 宇部興産株式会社 芳香族ポリイミドフィルムおよびその積層体
AU3767899A (en) * 1998-04-27 1999-11-16 E-Ink Corporation Shutter mode microencapsulated electrophoretic display
US6372538B1 (en) * 2000-03-16 2002-04-16 University Of Delaware Fabrication of thin-film, flexible photovoltaic module
US6825068B2 (en) * 2000-04-18 2004-11-30 E Ink Corporation Process for fabricating thin film transistors
US6710456B1 (en) * 2000-08-31 2004-03-23 Micron Technology, Inc. Composite interposer for BGA packages
JP2002173640A (ja) * 2000-11-30 2002-06-21 Three M Innovative Properties Co ポリイミド含有コーティング組成物及びそれから形成されたフィルム
WO2002102882A1 (en) * 2001-06-15 2002-12-27 Kaneka Corporation Semiconductive polyimide film and process for production thereof
US7271333B2 (en) 2001-07-20 2007-09-18 Ascent Solar Technologies, Inc. Apparatus and method of production of thin film photovoltaic modules
JP2003306553A (ja) * 2002-04-15 2003-10-31 Kanegafuchi Chem Ind Co Ltd ポリイミド成形体
JP2004035825A (ja) * 2002-07-05 2004-02-05 Kanegafuchi Chem Ind Co Ltd 半導電性ポリイミドフィルムおよびその製造方法
EP1529314A1 (de) * 2002-08-16 2005-05-11 DaimlerChrysler AG KAROSSERIETEIL EINES FAHRZEUGES MIT EINER DüNNSCHICHTSOLARZELLE UND SEIN ERSTELLUNGSVERFAHREN
JP4867130B2 (ja) * 2003-02-17 2012-02-01 三菱瓦斯化学株式会社 絶縁化超微粉末とその製造方法、およびそれを用いた高誘電率樹脂複合材料
JP4889190B2 (ja) * 2003-04-16 2012-03-07 スリーエム イノベイティブ プロパティズ カンパニー アクリル系熱伝導性組成物及び熱伝導性シート
US20050072461A1 (en) 2003-05-27 2005-04-07 Frank Kuchinski Pinhole porosity free insulating films on flexible metallic substrates for thin film applications
US7259201B2 (en) * 2003-08-28 2007-08-21 General Electric Company Flame retardant thermoplastic films and methods of making the same
US20050163968A1 (en) * 2004-01-20 2005-07-28 Hanket Gregory M. Microfiller-reinforced polymer film
KR100591068B1 (ko) * 2004-09-03 2006-06-19 주식회사 코오롱 플렉시블 동박 폴리이미드 적층판 및 그 제조방법
US20060127686A1 (en) * 2004-12-15 2006-06-15 Meloni Paul A Thermally conductive polyimide film composites having high thermal conductivity useful in an electronic device
WO2007002110A2 (en) * 2005-06-20 2007-01-04 Solyndra, Inc. Bifacial elonagated solar cell devices
WO2007011742A2 (en) * 2005-07-14 2007-01-25 Konarka Technologies, Inc. Cigs photovoltaic cells
US7790276B2 (en) * 2006-03-31 2010-09-07 E. I. Du Pont De Nemours And Company Aramid filled polyimides having advantageous thermal expansion properties, and methods relating thereto
JP2007317834A (ja) * 2006-05-25 2007-12-06 Toyobo Co Ltd フィルム状太陽電池
US9161440B2 (en) * 2006-06-26 2015-10-13 Sabic Global Technologies B.V. Articles comprising a polyimide solvent cast film having a low coefficient of thermal expansion and method of manufacture thereof
DE602007013585D1 (de) * 2006-10-11 2011-05-12 Sumitomo Electric Industries Polyimidrohr, herstellungsverfahren dafür, verfahren zur herstellung eines polyimidlacks und fixierband

Similar Documents

Publication Publication Date Title
JP2011521076A5 (enExample)
JP2011525698A5 (enExample)
JP2013511412A5 (enExample)
JP2013511599A5 (enExample)
TWI737724B (zh) 光學膜及使用該光學膜之可撓性裝置
JP6579110B2 (ja) ポリイミド樹脂組成物、ポリイミドフィルム及び積層体
JP6368961B2 (ja) ポリイミド系溶液、及びこれを用いて製造されたポリイミド系フィルム
JP2013511603A5 (enExample)
JP5999014B2 (ja) コンベヤベルト用ゴム組成物およびコンベヤベルト
JP2019014255A (ja) 積層フィルム、および積層フィルムを含む表示装置
JP6702956B2 (ja) ポリエーテルイミドワニス組成物、その製造方法およびそれから製造される物品
JP2013533892A5 (enExample)
MY155513A (en) Multilayer films
JP2017508637A5 (enExample)
JP2016534172A (ja) 耐摩擦性および耐摩耗性物品
NZ599546A (en) Noise dampening film
JP2016110101A (ja) フューザ部材
CN107356990A (zh) 光学膜和使用光学膜的光学构件
JP2018500211A5 (enExample)
TW201202305A (en) Polyimide film, and laminate using the same and flexible thin film-based solar cell
JP2010526898A5 (enExample)
JP2021503514A (ja) 低い熱膨張係数を有するポリイミド組成物
JP2019002001A (ja) ポリイミドまたはポリ(アミド−イミド)コポリマーを含むフィルム、該フィルムを含む表示装置、および該フィルムの製造方法
JP2013508533A5 (enExample)
JP2014500899A5 (enExample)