DE112009001229B4 - Thermisch und dimensional stabile Polyimidfolien und Verfahren, die sich darauf beziehen - Google Patents

Thermisch und dimensional stabile Polyimidfolien und Verfahren, die sich darauf beziehen Download PDF

Info

Publication number
DE112009001229B4
DE112009001229B4 DE112009001229.9T DE112009001229T DE112009001229B4 DE 112009001229 B4 DE112009001229 B4 DE 112009001229B4 DE 112009001229 T DE112009001229 T DE 112009001229T DE 112009001229 B4 DE112009001229 B4 DE 112009001229B4
Authority
DE
Germany
Prior art keywords
film
less
mpa
film according
filler
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE112009001229.9T
Other languages
German (de)
English (en)
Other versions
DE112009001229T5 (de
Inventor
Brian C. Aumann
Salah Boussaad
Thomas Edward Carney
Kostantinos Kourtakis
John W. Simmons
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DuPont Electronics Inc
Original Assignee
EI Du Pont de Nemours and Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by EI Du Pont de Nemours and Co filed Critical EI Du Pont de Nemours and Co
Publication of DE112009001229T5 publication Critical patent/DE112009001229T5/de
Application granted granted Critical
Publication of DE112009001229B4 publication Critical patent/DE112009001229B4/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1003—Preparatory processes
    • C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
    • C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Laminated Bodies (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Photovoltaic Devices (AREA)
DE112009001229.9T 2008-05-20 2009-05-11 Thermisch und dimensional stabile Polyimidfolien und Verfahren, die sich darauf beziehen Active DE112009001229B4 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US5450908P 2008-05-20 2008-05-20
US61/054,509 2008-05-20
PCT/US2009/043439 WO2009142938A1 (en) 2008-05-20 2009-05-11 Thermally and dimensionally stable polyimide films and methods relating thereto

Publications (2)

Publication Number Publication Date
DE112009001229T5 DE112009001229T5 (de) 2011-05-12
DE112009001229B4 true DE112009001229B4 (de) 2015-10-29

Family

ID=40786468

Family Applications (2)

Application Number Title Priority Date Filing Date
DE112009001229.9T Active DE112009001229B4 (de) 2008-05-20 2009-05-11 Thermisch und dimensional stabile Polyimidfolien und Verfahren, die sich darauf beziehen
DE112009001228T Withdrawn DE112009001228T5 (de) 2008-05-20 2009-05-18 Baugruppen mit einem hitze- und formbeständigen Polyimidfilm, einer Elektrode und einer Absorberschicht, und damit verbundene Verfahren

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE112009001228T Withdrawn DE112009001228T5 (de) 2008-05-20 2009-05-18 Baugruppen mit einem hitze- und formbeständigen Polyimidfilm, einer Elektrode und einer Absorberschicht, und damit verbundene Verfahren

Country Status (4)

Country Link
US (2) US20120009406A1 (enExample)
JP (2) JP5346078B2 (enExample)
DE (2) DE112009001229B4 (enExample)
WO (3) WO2009142938A1 (enExample)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8176564B2 (en) * 2004-11-15 2012-05-08 Microsoft Corporation Special PC mode entered upon detection of undesired state
US8319299B2 (en) * 2009-11-20 2012-11-27 Auman Brian C Thin film transistor compositions, and methods relating thereto
WO2011063204A1 (en) * 2009-11-20 2011-05-26 E. I. Du Pont De Nemours And Company Thermally and dimensionally stable polyimide films and methods relating thereto
KR101125567B1 (ko) * 2009-12-24 2012-03-22 삼성모바일디스플레이주식회사 고분자 기판 및 그 제조 방법과 상기 고분자 기판을 포함하는 표시 장치 및 그 제조 방법
US8853723B2 (en) * 2010-08-18 2014-10-07 E. I. Du Pont De Nemours And Company Light emitting diode assembly and thermal control blanket and methods relating thereto
US8969909B2 (en) 2010-08-18 2015-03-03 E I Du Pont De Nemours And Company Light emitting diode assembly and thermal control blanket and methods relating thereto
JP5655206B2 (ja) * 2010-09-21 2015-01-21 株式会社ピーアイ技術研究所 太陽電池の裏面反射層形成用ポリイミド樹脂組成物及びそれを用いた太陽電池の裏面反射層形成方法
CN103154139B (zh) * 2010-09-29 2016-09-07 纳幕尔杜邦公司 用于高温应用的聚酰亚胺树脂
CN102532521B (zh) * 2010-12-15 2014-03-12 慧濠光电科技股份有限公司 含光吸收功能的纳米晶粒的高分子复合材料的制作方法
CN103137239B (zh) * 2011-11-25 2015-11-25 比亚迪股份有限公司 一种太阳能电池正面电极银浆及其制备方法、以及一种太阳能电池片
CN103897391B (zh) * 2012-12-31 2017-04-12 中原工学院 薄膜太阳能电池用光固化聚酰亚胺膜及其制备方法
CN107206755A (zh) * 2015-01-22 2017-09-26 尤尼吉可株式会社 层叠体和其制造方法和使用方法以及玻璃基板层叠用聚酰亚胺前体溶液
US20190136054A1 (en) * 2016-05-12 2019-05-09 E I Du Pont De Nemours And Company Polyimide compositions and a polyimide test socket housing
DE102020108932A1 (de) 2020-03-31 2021-09-30 Kerafol Holding Gmbh Folienbauteil sowie Verfahren zu dessen Herstellung

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6217996B1 (en) * 1998-02-27 2001-04-17 Ube Industries, Ltd. Aromatic polyimide film and its composite sheet
US20040151928A1 (en) * 2001-06-15 2004-08-05 Hisayasu Kaneshiro Semiconductive polyimide film and process for production thereof
EP1672009A1 (en) * 2004-12-15 2006-06-21 E.I.Du pont de nemours and company Thermally conductive polyimide film composites having high thermal conductivity useful in an electronic device

Family Cites Families (48)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58218127A (ja) * 1982-06-11 1983-12-19 Hitachi Chem Co Ltd 半導体装置の保護被膜材料用組成物
US4522958A (en) * 1983-09-06 1985-06-11 Ppg Industries, Inc. High-solids coating composition for improved rheology control containing chemically modified inorganic microparticles
JPH0618068B2 (ja) * 1985-09-12 1994-03-09 キヤノン株式会社 磁気記録媒体およびベ−スフイルム
JPH0665708B2 (ja) * 1985-11-29 1994-08-24 鐘淵化学工業株式会社 新規ポリイミドフィルム及びその製造法
US4927874A (en) * 1987-01-14 1990-05-22 Cyprus Mines Corporation Beneficiated talcs
US5324766A (en) * 1989-07-07 1994-06-28 Mitsui Petrochemical Industries, Ltd. Resin composition for forming plated layer and use thereof
US5166308A (en) * 1990-04-30 1992-11-24 E. I. Du Pont De Nemours And Company Copolyimide film with improved properties
US5148266A (en) * 1990-09-24 1992-09-15 Ist Associates, Inc. Semiconductor chip assemblies having interposer and flexible lead
US5148265A (en) * 1990-09-24 1992-09-15 Ist Associates, Inc. Semiconductor chip assemblies with fan-in leads
AU4782293A (en) * 1992-07-24 1994-02-14 Tessera, Inc. Semiconductor connection components and methods with releasable lead support
US5441897A (en) * 1993-04-12 1995-08-15 Midwest Research Institute Method of fabricating high-efficiency Cu(In,Ga)(SeS)2 thin films for solar cells
US5436204A (en) * 1993-04-12 1995-07-25 Midwest Research Institute Recrystallization method to selenization of thin-film Cu(In,Ga)Se2 for semiconductor device applications
US5510174A (en) * 1993-07-14 1996-04-23 Chomerics, Inc. Thermally conductive materials containing titanium diboride filler
US5837767A (en) * 1994-10-31 1998-11-17 Ntn Corporation Stripping fingers
JPH08134232A (ja) * 1994-11-11 1996-05-28 Ube Ind Ltd ポリイミドフィルム、積層体およびフレキシブル回路用基板
US5648407A (en) * 1995-05-16 1997-07-15 Minnesota Mining And Manufacturing Company Curable resin sols and fiber-reinforced composites derived therefrom
US6120588A (en) * 1996-07-19 2000-09-19 E Ink Corporation Electronically addressable microencapsulated ink and display thereof
US6118426A (en) * 1995-07-20 2000-09-12 E Ink Corporation Transducers and indicators having printed displays
US6017584A (en) * 1995-07-20 2000-01-25 E Ink Corporation Multi-color electrophoretic displays and materials for making the same
US6120839A (en) * 1995-07-20 2000-09-19 E Ink Corporation Electro-osmotic displays and materials for making the same
US6124851A (en) * 1995-07-20 2000-09-26 E Ink Corporation Electronic book with multiple page displays
US5821608A (en) * 1995-09-08 1998-10-13 Tessera, Inc. Laterally situated stress/strain relieving lead for a semiconductor chip package
US5930026A (en) * 1996-10-25 1999-07-27 Massachusetts Institute Of Technology Nonemissive displays and piezoelectric power supplies therefor
US5961804A (en) * 1997-03-18 1999-10-05 Massachusetts Institute Of Technology Microencapsulated electrophoretic display
JPH11333376A (ja) * 1997-06-23 1999-12-07 Unitika Ltd ポリイミド前駆体溶液並びにそれから得られる塗膜及びその製造方法
JP3346228B2 (ja) * 1997-07-11 2002-11-18 宇部興産株式会社 芳香族ポリイミドフィルム、積層体および太陽電池
US6067185A (en) * 1997-08-28 2000-05-23 E Ink Corporation Process for creating an encapsulated electrophoretic display
WO1999056171A1 (en) * 1998-04-27 1999-11-04 E-Ink Corporation Shutter mode microencapsulated electrophoretic display
US6372538B1 (en) * 2000-03-16 2002-04-16 University Of Delaware Fabrication of thin-film, flexible photovoltaic module
DE60139463D1 (de) * 2000-04-18 2009-09-17 E Ink Corp Prozess zur herstellung von dünnfilmtransistoren
US6710456B1 (en) * 2000-08-31 2004-03-23 Micron Technology, Inc. Composite interposer for BGA packages
JP2002173640A (ja) * 2000-11-30 2002-06-21 Three M Innovative Properties Co ポリイミド含有コーティング組成物及びそれから形成されたフィルム
US7271333B2 (en) 2001-07-20 2007-09-18 Ascent Solar Technologies, Inc. Apparatus and method of production of thin film photovoltaic modules
JP2003306553A (ja) * 2002-04-15 2003-10-31 Kanegafuchi Chem Ind Co Ltd ポリイミド成形体
JP2004035825A (ja) * 2002-07-05 2004-02-05 Kanegafuchi Chem Ind Co Ltd 半導電性ポリイミドフィルムおよびその製造方法
AU2003289846A1 (en) * 2002-08-16 2004-03-11 Daimlerchrysler Ag Body part of a vehicle provided with a thin-film solar cell and the production thereof
JP4867130B2 (ja) * 2003-02-17 2012-02-01 三菱瓦斯化学株式会社 絶縁化超微粉末とその製造方法、およびそれを用いた高誘電率樹脂複合材料
JP4889190B2 (ja) * 2003-04-16 2012-03-07 スリーエム イノベイティブ プロパティズ カンパニー アクリル系熱伝導性組成物及び熱伝導性シート
WO2005006393A2 (en) 2003-05-27 2005-01-20 Triton Systems, Inc. Pinhold porosity free insulating films on flexible metallic substrates for thin film applications
US7259201B2 (en) * 2003-08-28 2007-08-21 General Electric Company Flame retardant thermoplastic films and methods of making the same
US20050163968A1 (en) * 2004-01-20 2005-07-28 Hanket Gregory M. Microfiller-reinforced polymer film
KR100591068B1 (ko) * 2004-09-03 2006-06-19 주식회사 코오롱 플렉시블 동박 폴리이미드 적층판 및 그 제조방법
WO2007002110A2 (en) * 2005-06-20 2007-01-04 Solyndra, Inc. Bifacial elonagated solar cell devices
WO2007011742A2 (en) * 2005-07-14 2007-01-25 Konarka Technologies, Inc. Cigs photovoltaic cells
US7790276B2 (en) * 2006-03-31 2010-09-07 E. I. Du Pont De Nemours And Company Aramid filled polyimides having advantageous thermal expansion properties, and methods relating thereto
JP2007317834A (ja) * 2006-05-25 2007-12-06 Toyobo Co Ltd フィルム状太陽電池
US9161440B2 (en) * 2006-06-26 2015-10-13 Sabic Global Technologies B.V. Articles comprising a polyimide solvent cast film having a low coefficient of thermal expansion and method of manufacture thereof
WO2008044643A1 (en) * 2006-10-11 2008-04-17 Sumitomo Electric Industries, Ltd. Polyimide tube, method for production thereof, method for production of polyimide varnish, and fixing belt

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6217996B1 (en) * 1998-02-27 2001-04-17 Ube Industries, Ltd. Aromatic polyimide film and its composite sheet
US20040151928A1 (en) * 2001-06-15 2004-08-05 Hisayasu Kaneshiro Semiconductive polyimide film and process for production thereof
EP1672009A1 (en) * 2004-12-15 2006-06-21 E.I.Du pont de nemours and company Thermally conductive polyimide film composites having high thermal conductivity useful in an electronic device

Also Published As

Publication number Publication date
US20110056539A1 (en) 2011-03-10
DE112009001229T5 (de) 2011-05-12
JP2011521076A (ja) 2011-07-21
WO2009142940A1 (en) 2009-11-26
JP5346078B2 (ja) 2013-11-20
WO2009142938A1 (en) 2009-11-26
WO2009143034A1 (en) 2009-11-26
JP2011525698A (ja) 2011-09-22
DE112009001228T5 (de) 2011-06-22
US20120009406A1 (en) 2012-01-12

Similar Documents

Publication Publication Date Title
DE112009001229B4 (de) Thermisch und dimensional stabile Polyimidfolien und Verfahren, die sich darauf beziehen
DE102010051850A1 (de) In Halbleiter-Packung-Anwendungen nützliche Interposerfilme und dazu in Beziehung stehende Verfahren
EP2501740B1 (en) Thin film transistor compositions, and methods relating thereto
EP2867276B1 (en) Polyimide and polyimide film comprising the same
DE3586948T2 (de) Polyamidsaeure-loesung und daraus hergestellter film.
EP2487196B1 (en) Process for the production of a colored polyimide molded article
DE69913969T2 (de) Verfahren zur herstellung von porösem kalziniertem polyimid
US20090288699A1 (en) Laminate structures for high temperature photovoltaic applications, and methods relating thereto
DE69733045T2 (de) Antistatischer aromatischer Polyimid-Film
DE69023187T2 (de) Leitfähiges Polyimid enthaltend Russ und Graphit sowie dessen Herstellung.
DE102020123617A1 (de) Polyimidfilme und elektronische vorrichtungen
DE112008003185T5 (de) Mit Metall laminierter Gegenstand, mit LED versehenes Substrat und weisse Folie
KR20160090153A (ko) 기공을 갖는 입자를 이용한 폴리이미드 필름의 제조방법 및 저유전율의 폴리이미드 필름
DE102010051851A1 (de) Dünnschichttransistor-Zusammensetzungen und damit verbundene Verfahren
DE102022109497A1 (de) Polyimidfilme und elektronische vorrichtungen
DE102005030391A1 (de) Folien
DE69631745T2 (de) Polyimid-Metallfolie-Verbundfilm
DE102010051815A1 (de) Photovoltaische Zusammensetzungen oder Präkursoren dazu, und dazu in Beziehung stehende Verfahren
DE102024128431A1 (de) Kaschierungen mit polymerfolien und metallschichten
HK1177216A (en) Thin film transistor compositions, and methods relating thereto
HK1159310A (en) Photovoltaic compositions or precursors thereto, and methods relating thereto

Legal Events

Date Code Title Description
R012 Request for examination validly filed

Effective date: 20110615

R016 Response to examination communication
R018 Grant decision by examination section/examining division
R020 Patent grant now final
R081 Change of applicant/patentee

Owner name: DUPONT ELECTRONICS, INC., WILMINGTON, US

Free format text: FORMER OWNER: E.I. DU PONT DE NEMOURS AND CO., WILMINGTON, DEL., US