JP2013231962A - 露光装置及び露光方法 - Google Patents

露光装置及び露光方法 Download PDF

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Publication number
JP2013231962A
JP2013231962A JP2013078998A JP2013078998A JP2013231962A JP 2013231962 A JP2013231962 A JP 2013231962A JP 2013078998 A JP2013078998 A JP 2013078998A JP 2013078998 A JP2013078998 A JP 2013078998A JP 2013231962 A JP2013231962 A JP 2013231962A
Authority
JP
Japan
Prior art keywords
substrate
carry
exposure
substrates
mask
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2013078998A
Other languages
English (en)
Japanese (ja)
Inventor
Mikiiku Suzuki
幹育 鈴木
Takahiro Nishikawa
貴洋 西川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NSK Technology Co Ltd
Original Assignee
NSK Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NSK Technology Co Ltd filed Critical NSK Technology Co Ltd
Priority to JP2013078998A priority Critical patent/JP2013231962A/ja
Priority to TW102112427A priority patent/TWI499871B/zh
Publication of JP2013231962A publication Critical patent/JP2013231962A/ja
Pending legal-status Critical Current

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H01L21/67225—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one lithography chamber

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP2013078998A 2012-04-06 2013-04-04 露光装置及び露光方法 Pending JP2013231962A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2013078998A JP2013231962A (ja) 2012-04-06 2013-04-04 露光装置及び露光方法
TW102112427A TWI499871B (zh) 2012-04-06 2013-04-08 Exposure apparatus and exposure method

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2012087316 2012-04-06
JP2012087316 2012-04-06
JP2013078998A JP2013231962A (ja) 2012-04-06 2013-04-04 露光装置及び露光方法

Publications (1)

Publication Number Publication Date
JP2013231962A true JP2013231962A (ja) 2013-11-14

Family

ID=49300624

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013078998A Pending JP2013231962A (ja) 2012-04-06 2013-04-04 露光装置及び露光方法

Country Status (4)

Country Link
JP (1) JP2013231962A (zh)
KR (1) KR101700019B1 (zh)
TW (1) TWI499871B (zh)
WO (1) WO2013151146A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017211533A (ja) * 2016-05-26 2017-11-30 株式会社サーマプレシジョン 投影露光装置及びその投影露光方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116339082B (zh) * 2023-05-30 2023-08-15 广东科视光学技术股份有限公司 一种全自动双装载台曝光机系统

Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52154370A (en) * 1976-06-18 1977-12-22 Hitachi Ltd Photo resist film treatment apparatus of semiconductor wafers
JPH04367417A (ja) * 1991-06-12 1992-12-18 Ryowa Kk 包装機への物品の自動整列供給方法と装置
JP2000321545A (ja) * 1999-03-05 2000-11-24 Ricoh Co Ltd 液晶パネル検査装置
JP2002114361A (ja) * 2000-10-10 2002-04-16 C Uyemura & Co Ltd 板状ワークの搬送方向変換装置
JP2002277502A (ja) * 2001-01-12 2002-09-25 Nidec-Read Corp 基板検査装置及び基板検査方法
JP2004319889A (ja) * 2003-04-18 2004-11-11 Seiko Epson Corp 製造対象物の受け渡し装置および製造対象物の受け渡し方法
JP2006267802A (ja) * 2005-03-25 2006-10-05 Dainippon Printing Co Ltd 露光装置および露光方法
JP2007322706A (ja) * 2006-05-31 2007-12-13 Nsk Ltd 露光装置及び露光方法
JP2008066661A (ja) * 2006-09-11 2008-03-21 Ihi Corp 基板搬送装置及び基板搬送方法
WO2009037754A1 (ja) * 2007-09-19 2009-03-26 Hirata Corporation 基板搬送システム
JP2009231846A (ja) * 2004-12-30 2009-10-08 Asml Netherlands Bv 基板ハンドラ
JP2011164542A (ja) * 2010-02-15 2011-08-25 Nsk Ltd 近接露光装置及び近接露光方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3203719B2 (ja) 1991-12-26 2001-08-27 株式会社ニコン 露光装置、その露光装置により製造されるデバイス、露光方法、およびその露光方法を用いたデバイス製造方法
JP4538884B2 (ja) 2000-03-08 2010-09-08 凸版印刷株式会社 大型基板の露光装置
JP4915033B2 (ja) * 2000-06-15 2012-04-11 株式会社ニコン 露光装置、基板処理装置及びリソグラフィシステム、並びにデバイス製造方法
JP4300067B2 (ja) 2003-07-02 2009-07-22 株式会社日立ハイテクノロジーズ 基板搬送装置、基板搬送方法、及び半導体デバイスの製造方法
EP2688090B1 (en) * 2004-08-12 2015-04-08 Nikon Corporation Substrate processing system, method of confirmation of its state of use, and method of prevention of illicit use
DE112005001989T5 (de) 2004-08-17 2007-08-02 Mattson Technology Inc., Fremont Kostengünstige Prozessierplattform mit hohem Durchsatz
KR100865051B1 (ko) * 2006-05-31 2008-10-23 닛본 세이고 가부시끼가이샤 노광 장치 및 노광 방법
JP4312247B2 (ja) 2008-02-06 2009-08-12 株式会社日立ハイテクノロジーズ プロキシミティ露光装置及び基板製造方法
JP4312248B2 (ja) 2008-02-06 2009-08-12 株式会社日立ハイテクノロジーズ プロキシミティ露光装置及び基板製造方法

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52154370A (en) * 1976-06-18 1977-12-22 Hitachi Ltd Photo resist film treatment apparatus of semiconductor wafers
JPH04367417A (ja) * 1991-06-12 1992-12-18 Ryowa Kk 包装機への物品の自動整列供給方法と装置
JP2000321545A (ja) * 1999-03-05 2000-11-24 Ricoh Co Ltd 液晶パネル検査装置
JP2002114361A (ja) * 2000-10-10 2002-04-16 C Uyemura & Co Ltd 板状ワークの搬送方向変換装置
JP2002277502A (ja) * 2001-01-12 2002-09-25 Nidec-Read Corp 基板検査装置及び基板検査方法
JP2004319889A (ja) * 2003-04-18 2004-11-11 Seiko Epson Corp 製造対象物の受け渡し装置および製造対象物の受け渡し方法
JP2009231846A (ja) * 2004-12-30 2009-10-08 Asml Netherlands Bv 基板ハンドラ
JP2006267802A (ja) * 2005-03-25 2006-10-05 Dainippon Printing Co Ltd 露光装置および露光方法
JP2007322706A (ja) * 2006-05-31 2007-12-13 Nsk Ltd 露光装置及び露光方法
JP2008066661A (ja) * 2006-09-11 2008-03-21 Ihi Corp 基板搬送装置及び基板搬送方法
WO2009037754A1 (ja) * 2007-09-19 2009-03-26 Hirata Corporation 基板搬送システム
JP2011164542A (ja) * 2010-02-15 2011-08-25 Nsk Ltd 近接露光装置及び近接露光方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017211533A (ja) * 2016-05-26 2017-11-30 株式会社サーマプレシジョン 投影露光装置及びその投影露光方法

Also Published As

Publication number Publication date
TW201346454A (zh) 2013-11-16
TWI499871B (zh) 2015-09-11
WO2013151146A1 (ja) 2013-10-10
KR20140139543A (ko) 2014-12-05
KR101700019B1 (ko) 2017-02-13

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