JP2013051389A - 回路基板、半導体パワーモジュール、製造方法 - Google Patents
回路基板、半導体パワーモジュール、製造方法 Download PDFInfo
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- JP2013051389A JP2013051389A JP2012061859A JP2012061859A JP2013051389A JP 2013051389 A JP2013051389 A JP 2013051389A JP 2012061859 A JP2012061859 A JP 2012061859A JP 2012061859 A JP2012061859 A JP 2012061859A JP 2013051389 A JP2013051389 A JP 2013051389A
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Images
Landscapes
- Wire Bonding (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012061859A JP2013051389A (ja) | 2011-08-01 | 2012-03-19 | 回路基板、半導体パワーモジュール、製造方法 |
| KR1020147002291A KR20140047097A (ko) | 2011-08-01 | 2012-07-31 | 반도체 파워 모듈, 반도체 파워 모듈의 제조 방법, 회로 기판 |
| CN201280037978.4A CN103733330A (zh) | 2011-08-01 | 2012-07-31 | 半导体功率模块、半导体功率模块的制造方法、电路板 |
| US14/234,323 US20140138850A1 (en) | 2011-08-01 | 2012-07-31 | Semiconductor power module, production method of semiconductor power module and circuit board |
| PCT/JP2012/004865 WO2013018357A1 (ja) | 2011-08-01 | 2012-07-31 | 半導体パワーモジュール、半導体パワーモジュールの製造方法、回路基板 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011168295 | 2011-08-01 | ||
| JP2011168295 | 2011-08-01 | ||
| JP2012061859A JP2013051389A (ja) | 2011-08-01 | 2012-03-19 | 回路基板、半導体パワーモジュール、製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2013051389A true JP2013051389A (ja) | 2013-03-14 |
| JP2013051389A5 JP2013051389A5 (enExample) | 2015-04-09 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012061859A Pending JP2013051389A (ja) | 2011-08-01 | 2012-03-19 | 回路基板、半導体パワーモジュール、製造方法 |
Country Status (1)
| Country | Link |
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| JP (1) | JP2013051389A (enExample) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2018093100A (ja) * | 2016-12-06 | 2018-06-14 | 西村陶業株式会社 | セラミックス基板の製造方法 |
| JP2018093163A (ja) * | 2017-06-15 | 2018-06-14 | 西村陶業株式会社 | セラミックス基板及び半導体モジュール |
| JP2020506559A (ja) * | 2017-04-04 | 2020-02-27 | ヘレウス ドイチェラント ゲーエムベーハー ウント カンパニー カーゲー | 少なくとも1つの電子部材上の少なくとも1つの接触表面の接触領域拡大のためのアダプタシステムおよび接触領域拡大のための方法 |
| JP2020155728A (ja) * | 2019-03-22 | 2020-09-24 | 三菱マテリアル株式会社 | 接合構造体 |
| JPWO2019082373A1 (ja) * | 2017-10-27 | 2020-12-17 | 日産自動車株式会社 | 半導体装置 |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04345041A (ja) * | 1991-05-22 | 1992-12-01 | Nitto Denko Corp | 半導体素子の実装構造 |
| JPH10209205A (ja) * | 1997-01-27 | 1998-08-07 | Matsushita Electric Ind Co Ltd | チップの実装構造 |
| JPH11214571A (ja) * | 1998-01-28 | 1999-08-06 | Kyocera Corp | 半導体素子実装用シート |
| JP2000082723A (ja) * | 1998-07-01 | 2000-03-21 | Nec Corp | 機能素子及び機能素子搭載用基板並びにそれらの接続方法 |
| JP2001030419A (ja) * | 1999-07-27 | 2001-02-06 | Murata Mfg Co Ltd | 複合積層体およびその製造方法 |
| JP2003224163A (ja) * | 2002-01-28 | 2003-08-08 | Mitsubishi Electric Corp | フリップチップの実装構造 |
| JP2006066582A (ja) * | 2004-08-26 | 2006-03-09 | Sumitomo Electric Ind Ltd | 半導体装置、半導体モジュール及び半導体装置の製造方法 |
| JP2007115904A (ja) * | 2005-10-20 | 2007-05-10 | Renesas Technology Corp | 半導体装置の製造方法 |
| WO2008126661A1 (ja) * | 2007-04-11 | 2008-10-23 | Murata Manufacturing Co., Ltd. | 多層セラミック基板およびその製造方法 |
| JP2011124398A (ja) * | 2009-12-11 | 2011-06-23 | Hitachi Ltd | 接合構造及びその製造方法 |
-
2012
- 2012-03-19 JP JP2012061859A patent/JP2013051389A/ja active Pending
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04345041A (ja) * | 1991-05-22 | 1992-12-01 | Nitto Denko Corp | 半導体素子の実装構造 |
| JPH10209205A (ja) * | 1997-01-27 | 1998-08-07 | Matsushita Electric Ind Co Ltd | チップの実装構造 |
| JPH11214571A (ja) * | 1998-01-28 | 1999-08-06 | Kyocera Corp | 半導体素子実装用シート |
| JP2000082723A (ja) * | 1998-07-01 | 2000-03-21 | Nec Corp | 機能素子及び機能素子搭載用基板並びにそれらの接続方法 |
| JP2001030419A (ja) * | 1999-07-27 | 2001-02-06 | Murata Mfg Co Ltd | 複合積層体およびその製造方法 |
| JP2003224163A (ja) * | 2002-01-28 | 2003-08-08 | Mitsubishi Electric Corp | フリップチップの実装構造 |
| JP2006066582A (ja) * | 2004-08-26 | 2006-03-09 | Sumitomo Electric Ind Ltd | 半導体装置、半導体モジュール及び半導体装置の製造方法 |
| JP2007115904A (ja) * | 2005-10-20 | 2007-05-10 | Renesas Technology Corp | 半導体装置の製造方法 |
| WO2008126661A1 (ja) * | 2007-04-11 | 2008-10-23 | Murata Manufacturing Co., Ltd. | 多層セラミック基板およびその製造方法 |
| JP2011124398A (ja) * | 2009-12-11 | 2011-06-23 | Hitachi Ltd | 接合構造及びその製造方法 |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2018093100A (ja) * | 2016-12-06 | 2018-06-14 | 西村陶業株式会社 | セラミックス基板の製造方法 |
| JP2020506559A (ja) * | 2017-04-04 | 2020-02-27 | ヘレウス ドイチェラント ゲーエムベーハー ウント カンパニー カーゲー | 少なくとも1つの電子部材上の少なくとも1つの接触表面の接触領域拡大のためのアダプタシステムおよび接触領域拡大のための方法 |
| JP2018093163A (ja) * | 2017-06-15 | 2018-06-14 | 西村陶業株式会社 | セラミックス基板及び半導体モジュール |
| JPWO2019082373A1 (ja) * | 2017-10-27 | 2020-12-17 | 日産自動車株式会社 | 半導体装置 |
| US11251162B2 (en) | 2017-10-27 | 2022-02-15 | Nissan Motor Co., Ltd. | Semiconductor device with reduced thermal resistance |
| JP2020155728A (ja) * | 2019-03-22 | 2020-09-24 | 三菱マテリアル株式会社 | 接合構造体 |
| WO2020196132A1 (ja) * | 2019-03-22 | 2020-10-01 | 三菱マテリアル株式会社 | 接合構造体 |
| JP7215273B2 (ja) | 2019-03-22 | 2023-01-31 | 三菱マテリアル株式会社 | 接合構造体 |
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