|
US8932510B2
(en)
|
2009-08-28 |
2015-01-13 |
Corning Incorporated |
Methods for laser cutting glass substrates
|
|
US8946590B2
(en)
|
2009-11-30 |
2015-02-03 |
Corning Incorporated |
Methods for laser scribing and separating glass substrates
|
|
JP5709032B2
(ja)
*
|
2010-02-12 |
2015-04-30 |
日本電気硝子株式会社 |
ガラスフィルムの製造方法
|
|
TWI513670B
(zh)
*
|
2010-08-31 |
2015-12-21 |
Corning Inc |
分離強化玻璃基板之方法
|
|
US8607590B2
(en)
*
|
2010-11-30 |
2013-12-17 |
Corning Incorporated |
Methods for separating glass articles from strengthened glass substrate sheets
|
|
TWI548598B
(zh)
*
|
2011-02-28 |
2016-09-11 |
康寧公司 |
熔融抽拉裝置及方法
|
|
WO2012169025A1
(ja)
*
|
2011-06-08 |
2012-12-13 |
日本電気硝子株式会社 |
板状ガラスの切断方法及びその切断装置
|
|
US8635887B2
(en)
*
|
2011-08-10 |
2014-01-28 |
Corning Incorporated |
Methods for separating glass substrate sheets by laser-formed grooves
|
|
DE102011084128A1
(de)
*
|
2011-10-07 |
2013-04-11 |
Schott Ag |
Verfahren zum Schneiden eines Dünnglases mit spezieller Ausbildung der Kante
|
|
US8677783B2
(en)
*
|
2011-11-28 |
2014-03-25 |
Corning Incorporated |
Method for low energy separation of a glass ribbon
|
|
JP2013119510A
(ja)
*
|
2011-12-08 |
2013-06-17 |
Asahi Glass Co Ltd |
レーザを用いてガラス基板を加工する方法
|
|
KR101258403B1
(ko)
*
|
2011-12-09 |
2013-04-30 |
로체 시스템즈(주) |
강화유리 기판 절단방법
|
|
CN103635438B
(zh)
*
|
2011-12-12 |
2016-08-17 |
日本电气硝子株式会社 |
平板玻璃的切割分离方法
|
|
US9938180B2
(en)
|
2012-06-05 |
2018-04-10 |
Corning Incorporated |
Methods of cutting glass using a laser
|
|
WO2014010490A1
(ja)
*
|
2012-07-09 |
2014-01-16 |
旭硝子株式会社 |
強化ガラス板の切断方法
|
|
CN104854046B
(zh)
*
|
2012-07-10 |
2017-06-23 |
旭硝子株式会社 |
玻璃板的加工方法
|
|
KR101355807B1
(ko)
*
|
2012-09-11 |
2014-02-03 |
로체 시스템즈(주) |
비금속 재료의 곡선 절단방법
|
|
US9610653B2
(en)
|
2012-09-21 |
2017-04-04 |
Electro Scientific Industries, Inc. |
Method and apparatus for separation of workpieces and articles produced thereby
|
|
US20140084039A1
(en)
*
|
2012-09-24 |
2014-03-27 |
Electro Scientific Industries, Inc. |
Method and apparatus for separating workpieces
|
|
US9216924B2
(en)
|
2012-11-09 |
2015-12-22 |
Corning Incorporated |
Methods of processing a glass ribbon
|
|
DE102012110971B4
(de)
*
|
2012-11-14 |
2025-03-20 |
Schott Ag |
Verfahren zur Herstellung von linienförmig aufgereihten Schädigungsstellen in einem transparenten Werkstück sowie Verfahren und Vorrichtung zum Trennen eines Werkstücks
|
|
US9126857B2
(en)
|
2012-11-15 |
2015-09-08 |
Corning Incorporated |
Separation apparatuses for separating sheets of brittle material and methods for separating sheets of brittle material
|
|
WO2014079478A1
(en)
|
2012-11-20 |
2014-05-30 |
Light In Light Srl |
High speed laser processing of transparent materials
|
|
KR102002959B1
(ko)
|
2012-11-20 |
2019-07-24 |
삼성디스플레이 주식회사 |
표시 장치의 제조 방법
|
|
US9212081B2
(en)
*
|
2012-11-21 |
2015-12-15 |
Corning Incorporated |
Methods of cutting a laminate strengthened glass substrate
|
|
EP2754524B1
(de)
|
2013-01-15 |
2015-11-25 |
Corning Laser Technologies GmbH |
Verfahren und Vorrichtung zum laserbasierten Bearbeiten von flächigen Substraten, d.h. Wafer oder Glaselement, unter Verwendung einer Laserstrahlbrennlinie
|
|
KR102144324B1
(ko)
*
|
2013-02-04 |
2020-08-13 |
에이지씨 가부시키가이샤 |
유리 기판의 절단 방법, 유리 기판, 근적외선 커트 필터 유리, 유리 기판의 제조 방법
|
|
CN105339316B
(zh)
*
|
2013-02-25 |
2018-11-09 |
康宁股份有限公司 |
制造薄玻璃块的方法
|
|
EP2781296B1
(de)
|
2013-03-21 |
2020-10-21 |
Corning Laser Technologies GmbH |
Vorrichtung und verfahren zum ausschneiden von konturen aus flächigen substraten mittels laser
|
|
JP2016117593A
(ja)
*
|
2013-04-15 |
2016-06-30 |
旭硝子株式会社 |
ガラス板の切断方法
|
|
CN105939973B
(zh)
*
|
2013-12-03 |
2019-08-20 |
康宁股份有限公司 |
用于切断玻璃板的设备和方法
|
|
US10442719B2
(en)
|
2013-12-17 |
2019-10-15 |
Corning Incorporated |
Edge chamfering methods
|
|
US9815730B2
(en)
|
2013-12-17 |
2017-11-14 |
Corning Incorporated |
Processing 3D shaped transparent brittle substrate
|
|
US20150165560A1
(en)
|
2013-12-17 |
2015-06-18 |
Corning Incorporated |
Laser processing of slots and holes
|
|
US11556039B2
(en)
|
2013-12-17 |
2023-01-17 |
Corning Incorporated |
Electrochromic coated glass articles and methods for laser processing the same
|
|
US9517963B2
(en)
|
2013-12-17 |
2016-12-13 |
Corning Incorporated |
Method for rapid laser drilling of holes in glass and products made therefrom
|
|
US9676167B2
(en)
|
2013-12-17 |
2017-06-13 |
Corning Incorporated |
Laser processing of sapphire substrate and related applications
|
|
US9701563B2
(en)
|
2013-12-17 |
2017-07-11 |
Corning Incorporated |
Laser cut composite glass article and method of cutting
|
|
US9850160B2
(en)
|
2013-12-17 |
2017-12-26 |
Corning Incorporated |
Laser cutting of display glass compositions
|
|
US9260337B2
(en)
*
|
2014-01-09 |
2016-02-16 |
Corning Incorporated |
Methods and apparatus for free-shape cutting of flexible thin glass
|
|
KR101616952B1
(ko)
*
|
2014-01-14 |
2016-04-29 |
전상욱 |
취성 소재의 임의 형상 절단 방법
|
|
WO2015115604A1
(ja)
*
|
2014-02-03 |
2015-08-06 |
日本電気硝子株式会社 |
レーザー溶断方法及び溶断面を有する板状ガラス製品
|
|
KR102421381B1
(ko)
*
|
2014-02-20 |
2022-07-18 |
코닝 인코포레이티드 |
얇은 가요성 유리에 반경을 절단하기 위한 방법 및 장치
|
|
WO2015178358A1
(ja)
*
|
2014-05-23 |
2015-11-26 |
日本電気硝子株式会社 |
パネルの製造方法
|
|
KR102445217B1
(ko)
|
2014-07-08 |
2022-09-20 |
코닝 인코포레이티드 |
재료를 레이저 가공하는 방법 및 장치
|
|
WO2016010943A2
(en)
|
2014-07-14 |
2016-01-21 |
Corning Incorporated |
Method and system for arresting crack propagation
|
|
TWI659793B
(zh)
*
|
2014-07-14 |
2019-05-21 |
美商康寧公司 |
用於使用可調整雷射束焦線來處理透明材料的系統及方法
|
|
WO2016010991A1
(en)
|
2014-07-14 |
2016-01-21 |
Corning Incorporated |
Interface block; system for and method of cutting a substrate being transparent within a range of wavelengths using such interface block
|
|
US10611667B2
(en)
|
2014-07-14 |
2020-04-07 |
Corning Incorporated |
Method and system for forming perforations
|
|
EP3183222B1
(en)
|
2014-08-20 |
2019-12-25 |
Corning Incorporated |
Method for yielding high edge strength in cutting of flexible thin glass
|
|
TW201628751A
(zh)
*
|
2014-11-20 |
2016-08-16 |
康寧公司 |
彈性玻璃基板之回饋控制的雷射切割
|
|
US10047001B2
(en)
|
2014-12-04 |
2018-08-14 |
Corning Incorporated |
Glass cutting systems and methods using non-diffracting laser beams
|
|
EP3245166B1
(en)
|
2015-01-12 |
2020-05-27 |
Corning Incorporated |
Laser cutting of thermally tempered substrates using the multi photon absorption method
|
|
EP3848334A1
(en)
|
2015-03-24 |
2021-07-14 |
Corning Incorporated |
Alkaline earth boro-aluminosilicate glass article with laser cut edge
|
|
WO2016160391A1
(en)
|
2015-03-27 |
2016-10-06 |
Corning Incorporated |
Gas permeable window and method of fabricating the same
|
|
US11186060B2
(en)
|
2015-07-10 |
2021-11-30 |
Corning Incorporated |
Methods of continuous fabrication of holes in flexible substrate sheets and products relating to the same
|
|
WO2017180116A1
(en)
*
|
2016-04-13 |
2017-10-19 |
Gkn Aerospace North America Inc. |
System and method of additive manufacturing
|
|
MY194570A
(en)
|
2016-05-06 |
2022-12-02 |
Corning Inc |
Laser cutting and removal of contoured shapes from transparent substrates
|
|
US10410883B2
(en)
|
2016-06-01 |
2019-09-10 |
Corning Incorporated |
Articles and methods of forming vias in substrates
|
|
US10794679B2
(en)
|
2016-06-29 |
2020-10-06 |
Corning Incorporated |
Method and system for measuring geometric parameters of through holes
|
|
CN109803934A
(zh)
|
2016-07-29 |
2019-05-24 |
康宁股份有限公司 |
用于激光处理的装置和方法
|
|
WO2018044843A1
(en)
|
2016-08-30 |
2018-03-08 |
Corning Incorporated |
Laser processing of transparent materials
|
|
US11203183B2
(en)
|
2016-09-27 |
2021-12-21 |
Vaon, Llc |
Single and multi-layer, flat glass-sensor structures
|
|
US11243192B2
(en)
|
2016-09-27 |
2022-02-08 |
Vaon, Llc |
3-D glass printable hand-held gas chromatograph for biomedical and environmental applications
|
|
US10821707B2
(en)
*
|
2018-05-17 |
2020-11-03 |
Vaon, Llc |
Multi-layer, flat glass structures
|
|
CN109803786B
(zh)
|
2016-09-30 |
2021-05-07 |
康宁股份有限公司 |
使用非轴对称束斑对透明工件进行激光加工的设备和方法
|
|
JP7066701B2
(ja)
|
2016-10-24 |
2022-05-13 |
コーニング インコーポレイテッド |
シート状ガラス基体のレーザに基づく加工のための基体処理ステーション
|
|
US10752534B2
(en)
|
2016-11-01 |
2020-08-25 |
Corning Incorporated |
Apparatuses and methods for laser processing laminate workpiece stacks
|
|
US10688599B2
(en)
|
2017-02-09 |
2020-06-23 |
Corning Incorporated |
Apparatus and methods for laser processing transparent workpieces using phase shifted focal lines
|
|
KR102479589B1
(ko)
*
|
2017-03-22 |
2022-12-20 |
코닝 인코포레이티드 |
유리 웹의 분리 방법들
|
|
US11078112B2
(en)
|
2017-05-25 |
2021-08-03 |
Corning Incorporated |
Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the same
|
|
US10580725B2
(en)
|
2017-05-25 |
2020-03-03 |
Corning Incorporated |
Articles having vias with geometry attributes and methods for fabricating the same
|
|
US10626040B2
(en)
|
2017-06-15 |
2020-04-21 |
Corning Incorporated |
Articles capable of individual singulation
|
|
TWI753183B
(zh)
|
2017-07-12 |
2022-01-21 |
美商康寧公司 |
製造玻璃基板的設備及方法
|
|
WO2019026586A1
(ja)
*
|
2017-08-01 |
2019-02-07 |
坂東機工株式会社 |
ガラス板の折割機械
|
|
US12180108B2
(en)
|
2017-12-19 |
2024-12-31 |
Corning Incorporated |
Methods for etching vias in glass-based articles employing positive charge organic molecules
|
|
US11554984B2
(en)
|
2018-02-22 |
2023-01-17 |
Corning Incorporated |
Alkali-free borosilicate glasses with low post-HF etch roughness
|
|
US11524366B2
(en)
*
|
2018-07-26 |
2022-12-13 |
Coherent Munich GmbH & Co. KG |
Separation and release of laser-processed brittle material
|
|
CN110091072B
(zh)
*
|
2019-05-28 |
2020-10-13 |
中国人民解放军国防科技大学 |
一种聚合物材料的瞬态激光烧蚀模拟方法
|
|
JP7515777B2
(ja)
*
|
2020-02-05 |
2024-07-16 |
日本電気硝子株式会社 |
ガラス板の製造方法
|