JP6018503B2 - 脆性材料シートの分割方法 - Google Patents
脆性材料シートの分割方法 Download PDFInfo
- Publication number
- JP6018503B2 JP6018503B2 JP2012512055A JP2012512055A JP6018503B2 JP 6018503 B2 JP6018503 B2 JP 6018503B2 JP 2012512055 A JP2012512055 A JP 2012512055A JP 2012512055 A JP2012512055 A JP 2012512055A JP 6018503 B2 JP6018503 B2 JP 6018503B2
- Authority
- JP
- Japan
- Prior art keywords
- sheet
- brittle material
- glass
- laser beam
- predetermined path
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000463 material Substances 0.000 title claims description 58
- 238000000034 method Methods 0.000 title claims description 45
- 239000011521 glass Substances 0.000 claims description 130
- 238000001816 cooling Methods 0.000 claims description 29
- 239000010409 thin film Substances 0.000 claims description 16
- 239000012530 fluid Substances 0.000 claims description 11
- 230000000644 propagated effect Effects 0.000 claims description 8
- 239000004065 semiconductor Substances 0.000 claims description 6
- 238000003280 down draw process Methods 0.000 claims description 4
- 230000001678 irradiating effect Effects 0.000 claims description 3
- 230000001902 propagating effect Effects 0.000 claims description 3
- 238000000151 deposition Methods 0.000 claims description 2
- 238000013021 overheating Methods 0.000 claims description 2
- 239000000758 substrate Substances 0.000 description 39
- 238000005520 cutting process Methods 0.000 description 37
- 239000010410 layer Substances 0.000 description 13
- 238000003698 laser cutting Methods 0.000 description 11
- 238000010438 heat treatment Methods 0.000 description 9
- 230000008569 process Effects 0.000 description 9
- 239000006060 molten glass Substances 0.000 description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 7
- 230000003287 optical effect Effects 0.000 description 6
- 230000008901 benefit Effects 0.000 description 5
- 238000004093 laser heating Methods 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 238000005452 bending Methods 0.000 description 4
- 239000005357 flat glass Substances 0.000 description 4
- 239000006132 parent glass Substances 0.000 description 4
- 239000011324 bead Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000009826 distribution Methods 0.000 description 3
- 239000001307 helium Substances 0.000 description 3
- 229910052734 helium Inorganic materials 0.000 description 3
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 3
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 238000010791 quenching Methods 0.000 description 3
- 238000013459 approach Methods 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 239000000498 cooling water Substances 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 239000002241 glass-ceramic Substances 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000000171 quenching effect Effects 0.000 description 2
- 239000005368 silicate glass Substances 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 239000005361 soda-lime glass Substances 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000010549 co-Evaporation Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 239000012809 cooling fluid Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- -1 for example Substances 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 238000003286 fusion draw glass process Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- RHZWSUVWRRXEJF-UHFFFAOYSA-N indium tin Chemical compound [In].[Sn] RHZWSUVWRRXEJF-UHFFFAOYSA-N 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 238000007652 sheet-forming process Methods 0.000 description 1
- 238000003283 slot draw process Methods 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/09—Severing cooled glass by thermal shock
- C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/0215—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the ribbon being in a substantially vertical plane
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/0235—Ribbons
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/04—Cutting or splitting in curves, especially for making spectacle lenses
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/09—Severing cooled glass by thermal shock
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/52—Ceramics
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T225/00—Severing by tearing or breaking
- Y10T225/30—Breaking or tearing apparatus
- Y10T225/304—Including means to apply thermal shock to work
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Thermal Sciences (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Laser Beam Processing (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US12/469,794 | 2009-05-21 | ||
| US12/469,794 US8269138B2 (en) | 2009-05-21 | 2009-05-21 | Method for separating a sheet of brittle material |
| PCT/US2010/035715 WO2010135616A2 (en) | 2009-05-21 | 2010-05-21 | Method for separating a sheet of brittle material |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2012527400A JP2012527400A (ja) | 2012-11-08 |
| JP2012527400A5 JP2012527400A5 (enExample) | 2013-05-30 |
| JP6018503B2 true JP6018503B2 (ja) | 2016-11-02 |
Family
ID=43123886
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012512055A Expired - Fee Related JP6018503B2 (ja) | 2009-05-21 | 2010-05-21 | 脆性材料シートの分割方法 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US8269138B2 (enExample) |
| EP (1) | EP2432616B1 (enExample) |
| JP (1) | JP6018503B2 (enExample) |
| KR (1) | KR101581992B1 (enExample) |
| CN (1) | CN102458754B (enExample) |
| TW (1) | TWI415811B (enExample) |
| WO (1) | WO2010135616A2 (enExample) |
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| US8946590B2 (en) | 2009-11-30 | 2015-02-03 | Corning Incorporated | Methods for laser scribing and separating glass substrates |
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| TWI513670B (zh) * | 2010-08-31 | 2015-12-21 | Corning Inc | 分離強化玻璃基板之方法 |
| US8607590B2 (en) * | 2010-11-30 | 2013-12-17 | Corning Incorporated | Methods for separating glass articles from strengthened glass substrate sheets |
| TWI548598B (zh) * | 2011-02-28 | 2016-09-11 | 康寧公司 | 熔融抽拉裝置及方法 |
| WO2012169025A1 (ja) * | 2011-06-08 | 2012-12-13 | 日本電気硝子株式会社 | 板状ガラスの切断方法及びその切断装置 |
| US8635887B2 (en) * | 2011-08-10 | 2014-01-28 | Corning Incorporated | Methods for separating glass substrate sheets by laser-formed grooves |
| DE102011084128A1 (de) * | 2011-10-07 | 2013-04-11 | Schott Ag | Verfahren zum Schneiden eines Dünnglases mit spezieller Ausbildung der Kante |
| US8677783B2 (en) * | 2011-11-28 | 2014-03-25 | Corning Incorporated | Method for low energy separation of a glass ribbon |
| JP2013119510A (ja) * | 2011-12-08 | 2013-06-17 | Asahi Glass Co Ltd | レーザを用いてガラス基板を加工する方法 |
| KR101258403B1 (ko) * | 2011-12-09 | 2013-04-30 | 로체 시스템즈(주) | 강화유리 기판 절단방법 |
| CN103635438B (zh) * | 2011-12-12 | 2016-08-17 | 日本电气硝子株式会社 | 平板玻璃的切割分离方法 |
| US9938180B2 (en) | 2012-06-05 | 2018-04-10 | Corning Incorporated | Methods of cutting glass using a laser |
| WO2014010490A1 (ja) * | 2012-07-09 | 2014-01-16 | 旭硝子株式会社 | 強化ガラス板の切断方法 |
| CN104854046B (zh) * | 2012-07-10 | 2017-06-23 | 旭硝子株式会社 | 玻璃板的加工方法 |
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-
2009
- 2009-05-21 US US12/469,794 patent/US8269138B2/en not_active Expired - Fee Related
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2010
- 2010-05-20 TW TW99116134A patent/TWI415811B/zh not_active IP Right Cessation
- 2010-05-21 CN CN201080027736.8A patent/CN102458754B/zh not_active Expired - Fee Related
- 2010-05-21 WO PCT/US2010/035715 patent/WO2010135616A2/en not_active Ceased
- 2010-05-21 EP EP10778445.6A patent/EP2432616B1/en not_active Not-in-force
- 2010-05-21 KR KR1020117029957A patent/KR101581992B1/ko not_active Expired - Fee Related
- 2010-05-21 JP JP2012512055A patent/JP6018503B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| WO2010135616A3 (en) | 2011-02-24 |
| WO2010135616A2 (en) | 2010-11-25 |
| US20100294748A1 (en) | 2010-11-25 |
| TWI415811B (zh) | 2013-11-21 |
| EP2432616A4 (en) | 2015-02-11 |
| US8269138B2 (en) | 2012-09-18 |
| KR20120018798A (ko) | 2012-03-05 |
| CN102458754B (zh) | 2016-04-06 |
| CN102458754A (zh) | 2012-05-16 |
| KR101581992B1 (ko) | 2015-12-31 |
| JP2012527400A (ja) | 2012-11-08 |
| EP2432616B1 (en) | 2018-02-28 |
| EP2432616A2 (en) | 2012-03-28 |
| TW201103875A (en) | 2011-02-01 |
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