CN102458754B - 分离脆性材料板的方法 - Google Patents

分离脆性材料板的方法 Download PDF

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Publication number
CN102458754B
CN102458754B CN201080027736.8A CN201080027736A CN102458754B CN 102458754 B CN102458754 B CN 102458754B CN 201080027736 A CN201080027736 A CN 201080027736A CN 102458754 B CN102458754 B CN 102458754B
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CN
China
Prior art keywords
laser beam
brittle material
glass
plate
predetermined path
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201080027736.8A
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English (en)
Chinese (zh)
Other versions
CN102458754A (zh
Inventor
S·M·加纳
李兴华
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Corning Inc
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Corning Inc
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Filing date
Publication date
Application filed by Corning Inc filed Critical Corning Inc
Publication of CN102458754A publication Critical patent/CN102458754A/zh
Application granted granted Critical
Publication of CN102458754B publication Critical patent/CN102458754B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/0215—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the ribbon being in a substantially vertical plane
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/0235—Ribbons
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/04—Cutting or splitting in curves, especially for making spectacle lenses
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B23K2103/52—Ceramics
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T225/00—Severing by tearing or breaking
    • Y10T225/30—Breaking or tearing apparatus
    • Y10T225/304—Including means to apply thermal shock to work

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • Toxicology (AREA)
  • Health & Medical Sciences (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Laser Beam Processing (AREA)
CN201080027736.8A 2009-05-21 2010-05-21 分离脆性材料板的方法 Expired - Fee Related CN102458754B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/469,794 2009-05-21
US12/469,794 US8269138B2 (en) 2009-05-21 2009-05-21 Method for separating a sheet of brittle material
PCT/US2010/035715 WO2010135616A2 (en) 2009-05-21 2010-05-21 Method for separating a sheet of brittle material

Publications (2)

Publication Number Publication Date
CN102458754A CN102458754A (zh) 2012-05-16
CN102458754B true CN102458754B (zh) 2016-04-06

Family

ID=43123886

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201080027736.8A Expired - Fee Related CN102458754B (zh) 2009-05-21 2010-05-21 分离脆性材料板的方法

Country Status (7)

Country Link
US (1) US8269138B2 (enExample)
EP (1) EP2432616B1 (enExample)
JP (1) JP6018503B2 (enExample)
KR (1) KR101581992B1 (enExample)
CN (1) CN102458754B (enExample)
TW (1) TWI415811B (enExample)
WO (1) WO2010135616A2 (enExample)

Families Citing this family (80)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8932510B2 (en) 2009-08-28 2015-01-13 Corning Incorporated Methods for laser cutting glass substrates
US8946590B2 (en) * 2009-11-30 2015-02-03 Corning Incorporated Methods for laser scribing and separating glass substrates
JP5709032B2 (ja) * 2010-02-12 2015-04-30 日本電気硝子株式会社 ガラスフィルムの製造方法
US8720228B2 (en) * 2010-08-31 2014-05-13 Corning Incorporated Methods of separating strengthened glass substrates
US8607590B2 (en) * 2010-11-30 2013-12-17 Corning Incorporated Methods for separating glass articles from strengthened glass substrate sheets
TWI548598B (zh) * 2011-02-28 2016-09-11 康寧公司 熔融抽拉裝置及方法
CN103313946B (zh) * 2011-06-08 2016-11-23 日本电气硝子株式会社 板状玻璃的切断方法
US8635887B2 (en) * 2011-08-10 2014-01-28 Corning Incorporated Methods for separating glass substrate sheets by laser-formed grooves
DE102011084128A1 (de) * 2011-10-07 2013-04-11 Schott Ag Verfahren zum Schneiden eines Dünnglases mit spezieller Ausbildung der Kante
US8677783B2 (en) 2011-11-28 2014-03-25 Corning Incorporated Method for low energy separation of a glass ribbon
JP2013119510A (ja) * 2011-12-08 2013-06-17 Asahi Glass Co Ltd レーザを用いてガラス基板を加工する方法
KR101258403B1 (ko) * 2011-12-09 2013-04-30 로체 시스템즈(주) 강화유리 기판 절단방법
TWI545095B (zh) * 2011-12-12 2016-08-11 日本電氣硝子股份有限公司 板玻璃的割斷分離方法
US9938180B2 (en) 2012-06-05 2018-04-10 Corning Incorporated Methods of cutting glass using a laser
WO2014010490A1 (ja) * 2012-07-09 2014-01-16 旭硝子株式会社 強化ガラス板の切断方法
JPWO2014010488A1 (ja) * 2012-07-10 2016-06-23 旭硝子株式会社 ガラス板の加工方法
KR101355807B1 (ko) * 2012-09-11 2014-02-03 로체 시스템즈(주) 비금속 재료의 곡선 절단방법
US9610653B2 (en) 2012-09-21 2017-04-04 Electro Scientific Industries, Inc. Method and apparatus for separation of workpieces and articles produced thereby
US20140084039A1 (en) * 2012-09-24 2014-03-27 Electro Scientific Industries, Inc. Method and apparatus for separating workpieces
US9216924B2 (en) * 2012-11-09 2015-12-22 Corning Incorporated Methods of processing a glass ribbon
DE102012110971B4 (de) * 2012-11-14 2025-03-20 Schott Ag Verfahren zur Herstellung von linienförmig aufgereihten Schädigungsstellen in einem transparenten Werkstück sowie Verfahren und Vorrichtung zum Trennen eines Werkstücks
US9126857B2 (en) 2012-11-15 2015-09-08 Corning Incorporated Separation apparatuses for separating sheets of brittle material and methods for separating sheets of brittle material
KR102002959B1 (ko) 2012-11-20 2019-07-24 삼성디스플레이 주식회사 표시 장치의 제조 방법
WO2014079478A1 (en) 2012-11-20 2014-05-30 Light In Light Srl High speed laser processing of transparent materials
US9212081B2 (en) * 2012-11-21 2015-12-15 Corning Incorporated Methods of cutting a laminate strengthened glass substrate
EP2754524B1 (de) 2013-01-15 2015-11-25 Corning Laser Technologies GmbH Verfahren und Vorrichtung zum laserbasierten Bearbeiten von flächigen Substraten, d.h. Wafer oder Glaselement, unter Verwendung einer Laserstrahlbrennlinie
JP6137202B2 (ja) * 2013-02-04 2017-05-31 旭硝子株式会社 ガラス基板の切断方法、ガラス基板、近赤外線カットフィルタガラス、ガラス基板の製造方法
KR20150123845A (ko) * 2013-02-25 2015-11-04 코닝 인코포레이티드 얇은 유리 패널 제조 방법
EP2781296B1 (de) 2013-03-21 2020-10-21 Corning Laser Technologies GmbH Vorrichtung und verfahren zum ausschneiden von konturen aus flächigen substraten mittels laser
JP2016117593A (ja) * 2013-04-15 2016-06-30 旭硝子株式会社 ガラス板の切断方法
US10239778B2 (en) * 2013-12-03 2019-03-26 Corning Incorporated Apparatus and method for severing a glass sheet
US20150165560A1 (en) 2013-12-17 2015-06-18 Corning Incorporated Laser processing of slots and holes
US9815730B2 (en) 2013-12-17 2017-11-14 Corning Incorporated Processing 3D shaped transparent brittle substrate
US10442719B2 (en) 2013-12-17 2019-10-15 Corning Incorporated Edge chamfering methods
US9850160B2 (en) 2013-12-17 2017-12-26 Corning Incorporated Laser cutting of display glass compositions
US9701563B2 (en) 2013-12-17 2017-07-11 Corning Incorporated Laser cut composite glass article and method of cutting
US9517963B2 (en) 2013-12-17 2016-12-13 Corning Incorporated Method for rapid laser drilling of holes in glass and products made therefrom
US11556039B2 (en) 2013-12-17 2023-01-17 Corning Incorporated Electrochromic coated glass articles and methods for laser processing the same
US9676167B2 (en) 2013-12-17 2017-06-13 Corning Incorporated Laser processing of sapphire substrate and related applications
US9260337B2 (en) * 2014-01-09 2016-02-16 Corning Incorporated Methods and apparatus for free-shape cutting of flexible thin glass
KR101616952B1 (ko) * 2014-01-14 2016-04-29 전상욱 취성 소재의 임의 형상 절단 방법
JP6350884B2 (ja) * 2014-02-03 2018-07-04 日本電気硝子株式会社 レーザー溶断方法及び溶断面を有する板状ガラス製品
CN106458693B (zh) 2014-02-20 2020-06-16 康宁股份有限公司 用于在柔性薄玻璃中切割多个半径的方法和设备
KR102246031B1 (ko) * 2014-05-23 2021-04-29 니폰 덴키 가라스 가부시키가이샤 패널의 제조 방법
KR102445217B1 (ko) 2014-07-08 2022-09-20 코닝 인코포레이티드 재료를 레이저 가공하는 방법 및 장치
WO2016010943A2 (en) 2014-07-14 2016-01-21 Corning Incorporated Method and system for arresting crack propagation
US10526234B2 (en) 2014-07-14 2020-01-07 Corning Incorporated Interface block; system for and method of cutting a substrate being transparent within a range of wavelengths using such interface block
LT3169477T (lt) * 2014-07-14 2020-05-25 Corning Incorporated Skaidrių medžiagų apdorojimo sistema ir būdas, naudojant lazerio pluošto židinio linijas, kurių ilgis ir skersmuo yra reguliuojami
WO2016010949A1 (en) 2014-07-14 2016-01-21 Corning Incorporated Method and system for forming perforations
KR102448778B1 (ko) 2014-08-20 2022-09-29 코닝 인코포레이티드 얇은 가요성 유리의 절단시 높은 에지 강도를 산출하기 위한 장치 및 방법
TW201628751A (zh) * 2014-11-20 2016-08-16 康寧公司 彈性玻璃基板之回饋控制的雷射切割
US10047001B2 (en) 2014-12-04 2018-08-14 Corning Incorporated Glass cutting systems and methods using non-diffracting laser beams
JP2018507154A (ja) 2015-01-12 2018-03-15 コーニング インコーポレイテッド マルチフォトン吸収方法を用いた熱強化基板のレーザー切断
JP7292006B2 (ja) 2015-03-24 2023-06-16 コーニング インコーポレイテッド ディスプレイガラス組成物のレーザ切断及び加工
CN107666983B (zh) 2015-03-27 2020-10-02 康宁股份有限公司 可透气窗及其制造方法
US11186060B2 (en) 2015-07-10 2021-11-30 Corning Incorporated Methods of continuous fabrication of holes in flexible substrate sheets and products relating to the same
WO2017180116A1 (en) * 2016-04-13 2017-10-19 Gkn Aerospace North America Inc. System and method of additive manufacturing
SG11201809797PA (en) 2016-05-06 2018-12-28 Corning Inc Laser cutting and removal of contoured shapes from transparent substrates
US10410883B2 (en) 2016-06-01 2019-09-10 Corning Incorporated Articles and methods of forming vias in substrates
US10794679B2 (en) 2016-06-29 2020-10-06 Corning Incorporated Method and system for measuring geometric parameters of through holes
KR20190035805A (ko) 2016-07-29 2019-04-03 코닝 인코포레이티드 레이저 처리를 위한 장치 및 방법
US10522963B2 (en) 2016-08-30 2019-12-31 Corning Incorporated Laser cutting of materials with intensity mapping optical system
US10821707B2 (en) * 2018-05-17 2020-11-03 Vaon, Llc Multi-layer, flat glass structures
US11203183B2 (en) 2016-09-27 2021-12-21 Vaon, Llc Single and multi-layer, flat glass-sensor structures
US11243192B2 (en) 2016-09-27 2022-02-08 Vaon, Llc 3-D glass printable hand-held gas chromatograph for biomedical and environmental applications
CN109803786B (zh) 2016-09-30 2021-05-07 康宁股份有限公司 使用非轴对称束斑对透明工件进行激光加工的设备和方法
US11542190B2 (en) 2016-10-24 2023-01-03 Corning Incorporated Substrate processing station for laser-based machining of sheet-like glass substrates
US10752534B2 (en) 2016-11-01 2020-08-25 Corning Incorporated Apparatuses and methods for laser processing laminate workpiece stacks
US10688599B2 (en) 2017-02-09 2020-06-23 Corning Incorporated Apparatus and methods for laser processing transparent workpieces using phase shifted focal lines
CN110678423B (zh) * 2017-03-22 2022-05-13 康宁股份有限公司 分离玻璃板条的方法
US10580725B2 (en) 2017-05-25 2020-03-03 Corning Incorporated Articles having vias with geometry attributes and methods for fabricating the same
US11078112B2 (en) 2017-05-25 2021-08-03 Corning Incorporated Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the same
US10626040B2 (en) 2017-06-15 2020-04-21 Corning Incorporated Articles capable of individual singulation
TWI753183B (zh) 2017-07-12 2022-01-21 美商康寧公司 製造玻璃基板的設備及方法
WO2019026586A1 (ja) * 2017-08-01 2019-02-07 坂東機工株式会社 ガラス板の折割機械
US12180108B2 (en) 2017-12-19 2024-12-31 Corning Incorporated Methods for etching vias in glass-based articles employing positive charge organic molecules
US11554984B2 (en) 2018-02-22 2023-01-17 Corning Incorporated Alkali-free borosilicate glasses with low post-HF etch roughness
US11524366B2 (en) * 2018-07-26 2022-12-13 Coherent Munich GmbH & Co. KG Separation and release of laser-processed brittle material
CN110091072B (zh) * 2019-05-28 2020-10-13 中国人民解放军国防科技大学 一种聚合物材料的瞬态激光烧蚀模拟方法
JP7515777B2 (ja) * 2020-02-05 2024-07-16 日本電気硝子株式会社 ガラス板の製造方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0532428A (ja) * 1991-07-30 1993-02-09 Hoya Corp ガラス加工方法及びその装置
JP2003002675A (ja) * 2001-06-21 2003-01-08 Nakamura Tome Precision Ind Co Ltd ガラス板の割断方法及び装置
JP2003002676A (ja) * 2001-06-19 2003-01-08 Seiko Epson Corp 基板の分割方法及び液晶装置の製造方法
CN1683106A (zh) * 2000-09-13 2005-10-19 浜松光子学株式会社 激光加工方法以及激光加工装置
JP2006159747A (ja) * 2004-12-09 2006-06-22 Japan Steel Works Ltd:The レーザ加工方法及びその装置
JP2007319888A (ja) * 2006-05-31 2007-12-13 Sharp Corp 被加工脆性部材のレーザー溶断方法

Family Cites Families (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3629545A (en) 1967-12-19 1971-12-21 Western Electric Co Laser substrate parting
US4580336A (en) * 1984-01-26 1986-04-08 General Electric Company Apparatus for slitting amorphous metal and method of producing a magnetic core therefrom
JPS61229487A (ja) * 1985-04-03 1986-10-13 Sasaki Glass Kk レ−ザビ−ムによるガラス切断方法
US5132505A (en) 1990-03-21 1992-07-21 U.S. Philips Corporation Method of cleaving a brittle plate and device for carrying out the method
KR920010885A (ko) * 1990-11-30 1992-06-27 카나이 쯔또무 박막반도체와 그 제조방법 및 제조장치 및 화상처리장치
JPH04349133A (ja) * 1991-05-28 1992-12-03 Seiko Epson Corp ガラス部品の切断加工方法
RU2024441C1 (ru) 1992-04-02 1994-12-15 Владимир Степанович Кондратенко Способ резки неметаллических материалов
JP3077462B2 (ja) 1993-09-01 2000-08-14 日立電線株式会社 ガラスの切断方法
US5622540A (en) 1994-09-19 1997-04-22 Corning Incorporated Method for breaking a glass sheet
US5776220A (en) 1994-09-19 1998-07-07 Corning Incorporated Method and apparatus for breaking brittle materials
US5585020A (en) * 1994-11-03 1996-12-17 Becker; Michael F. Process for the production of nanoparticles
KR970008386A (ko) * 1995-07-07 1997-02-24 하라 세이지 기판의 할단(割斷)방법 및 그 할단장치
EP0847317B1 (en) * 1995-08-31 2003-08-27 Corning Incorporated Method and apparatus for breaking brittle materials
US6306510B1 (en) * 1998-07-15 2001-10-23 Agfa-Gevaert Laminate comprising a glass layer having crack lines
JP2000281373A (ja) * 1999-03-26 2000-10-10 Mitsubishi Electric Corp 脆性材料の分割方法
JP2000323441A (ja) 1999-05-10 2000-11-24 Hitachi Cable Ltd セラミックス基板上に形成した光導波回路チップの切断方法
DE19963939B4 (de) 1999-12-31 2004-11-04 Schott Spezialglas Gmbh Verfahren und Vorrichtung zum Durchtrennen von flachen Werkstücken aus sprödbrüchigem Material
JP4786783B2 (ja) * 2000-08-18 2011-10-05 日本板硝子株式会社 ガラス板の切断方法及び記録媒体用ガラス円盤
US6657723B2 (en) * 2000-12-13 2003-12-02 International Business Machines Corporation Multimode planar spectrographs for wavelength demultiplexing and methods of fabrication
ES2247002T3 (es) 2000-12-15 2006-03-01 Lzh Laserzentrum Hannover E.V. Procedimiento para cortar componentes hechos de cristal, de ceramica,de vitroceramica o de un material analogo por realizacion de una fisura termica en el componente a lo largo de una zona de corte.
US6770544B2 (en) * 2001-02-21 2004-08-03 Nec Machinery Corporation Substrate cutting method
JP2003019587A (ja) * 2001-07-04 2003-01-21 Inst Of Physical & Chemical Res レーザー加工方法およびレーザー加工装置
JP4474108B2 (ja) * 2002-09-02 2010-06-02 株式会社 日立ディスプレイズ 表示装置とその製造方法および製造装置
US7294224B2 (en) 2003-12-01 2007-11-13 Applied Materials, Inc. Magnet assembly for plasma containment
DE102004014277A1 (de) 2004-03-22 2005-10-20 Fraunhofer Ges Forschung Verfahren zum laserthermischen Trennen von Flachgläsern
JP3873098B2 (ja) * 2004-03-31 2007-01-24 国立大学法人 北海道大学 レーザ加工方法および装置
DE102004020737A1 (de) 2004-04-27 2005-11-24 Lzh Laserzentrum Hannover E.V. Vorrichtung zum Durchtrennen von Bauteilen aus sprödbrüchigen Materialien mit spannungsfreier Bauteillagerung
DE102004024475A1 (de) 2004-05-14 2005-12-01 Lzh Laserzentrum Hannover E.V. Verfahren und Vorrichtung zum Trennen von Halbleitermaterialien
KR101152141B1 (ko) * 2005-06-08 2012-06-15 삼성전자주식회사 액정표시패널과 액정표시패널의 제조방법
KR101081613B1 (ko) 2005-09-13 2011-11-09 가부시키가이샤 레미 취성재료의 할단방법 및 장치
DE102006018622B3 (de) 2005-12-29 2007-08-09 H2B Photonics Gmbh Vorrichtung zum durchtrennenden Bearbeiten von Bauteilen aus sprödbrüchigem Material
US8168514B2 (en) * 2006-08-24 2012-05-01 Corning Incorporated Laser separation of thin laminated glass substrates for flexible display applications
US20090040640A1 (en) * 2007-08-07 2009-02-12 Jinnam Kim Glass cutting method, glass for flat panel display thereof and flat panel display device using it

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0532428A (ja) * 1991-07-30 1993-02-09 Hoya Corp ガラス加工方法及びその装置
CN1683106A (zh) * 2000-09-13 2005-10-19 浜松光子学株式会社 激光加工方法以及激光加工装置
CN100471609C (zh) * 2000-09-13 2009-03-25 浜松光子学株式会社 加工对象物切割方法
JP2003002676A (ja) * 2001-06-19 2003-01-08 Seiko Epson Corp 基板の分割方法及び液晶装置の製造方法
JP2003002675A (ja) * 2001-06-21 2003-01-08 Nakamura Tome Precision Ind Co Ltd ガラス板の割断方法及び装置
JP2006159747A (ja) * 2004-12-09 2006-06-22 Japan Steel Works Ltd:The レーザ加工方法及びその装置
JP2007319888A (ja) * 2006-05-31 2007-12-13 Sharp Corp 被加工脆性部材のレーザー溶断方法

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TW201103875A (en) 2011-02-01
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US8269138B2 (en) 2012-09-18
WO2010135616A3 (en) 2011-02-24
KR101581992B1 (ko) 2015-12-31
US20100294748A1 (en) 2010-11-25
TWI415811B (zh) 2013-11-21
JP6018503B2 (ja) 2016-11-02
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EP2432616A4 (en) 2015-02-11
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