KR101581992B1 - 취성 재료의 시트 분리 방법 - Google Patents

취성 재료의 시트 분리 방법 Download PDF

Info

Publication number
KR101581992B1
KR101581992B1 KR1020117029957A KR20117029957A KR101581992B1 KR 101581992 B1 KR101581992 B1 KR 101581992B1 KR 1020117029957 A KR1020117029957 A KR 1020117029957A KR 20117029957 A KR20117029957 A KR 20117029957A KR 101581992 B1 KR101581992 B1 KR 101581992B1
Authority
KR
South Korea
Prior art keywords
sheet
brittle material
glass
predetermined path
laser
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020117029957A
Other languages
English (en)
Korean (ko)
Other versions
KR20120018798A (ko
Inventor
시안 엠 가너
싱후아 리
Original Assignee
코닝 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 코닝 인코포레이티드 filed Critical 코닝 인코포레이티드
Publication of KR20120018798A publication Critical patent/KR20120018798A/ko
Application granted granted Critical
Publication of KR101581992B1 publication Critical patent/KR101581992B1/ko
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/38Removing material by boring or cutting
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/09Severing cooled glass by thermal shock
    • C03B33/091Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/40Removing material taking account of the properties of the material involved
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/02Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/0215Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the ribbon being in a substantially vertical plane
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/02Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/0235Ribbons
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/02Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/04Cutting or splitting in curves, especially for making spectacle lenses
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/09Severing cooled glass by thermal shock
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00Materials to be soldered, welded or cut
    • B23K2103/50Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00Materials to be soldered, welded or cut
    • B23K2103/50Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B23K2103/52Ceramics
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T225/00Severing by tearing or breaking
    • Y10T225/30Breaking or tearing apparatus
    • Y10T225/304Including means to apply thermal shock to work

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Laser Beam Processing (AREA)
KR1020117029957A 2009-05-21 2010-05-21 취성 재료의 시트 분리 방법 Expired - Fee Related KR101581992B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12/469,794 2009-05-21
US12/469,794 US8269138B2 (en) 2009-05-21 2009-05-21 Method for separating a sheet of brittle material

Publications (2)

Publication Number Publication Date
KR20120018798A KR20120018798A (ko) 2012-03-05
KR101581992B1 true KR101581992B1 (ko) 2015-12-31

Family

ID=43123886

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020117029957A Expired - Fee Related KR101581992B1 (ko) 2009-05-21 2010-05-21 취성 재료의 시트 분리 방법

Country Status (7)

Country Link
US (1) US8269138B2 (enExample)
EP (1) EP2432616B1 (enExample)
JP (1) JP6018503B2 (enExample)
KR (1) KR101581992B1 (enExample)
CN (1) CN102458754B (enExample)
TW (1) TWI415811B (enExample)
WO (1) WO2010135616A2 (enExample)

Families Citing this family (80)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8932510B2 (en) 2009-08-28 2015-01-13 Corning Incorporated Methods for laser cutting glass substrates
US8946590B2 (en) 2009-11-30 2015-02-03 Corning Incorporated Methods for laser scribing and separating glass substrates
JP5709032B2 (ja) * 2010-02-12 2015-04-30 日本電気硝子株式会社 ガラスフィルムの製造方法
TWI513670B (zh) * 2010-08-31 2015-12-21 Corning Inc 分離強化玻璃基板之方法
US8607590B2 (en) * 2010-11-30 2013-12-17 Corning Incorporated Methods for separating glass articles from strengthened glass substrate sheets
TWI548598B (zh) * 2011-02-28 2016-09-11 康寧公司 熔融抽拉裝置及方法
WO2012169025A1 (ja) * 2011-06-08 2012-12-13 日本電気硝子株式会社 板状ガラスの切断方法及びその切断装置
US8635887B2 (en) * 2011-08-10 2014-01-28 Corning Incorporated Methods for separating glass substrate sheets by laser-formed grooves
DE102011084128A1 (de) * 2011-10-07 2013-04-11 Schott Ag Verfahren zum Schneiden eines Dünnglases mit spezieller Ausbildung der Kante
US8677783B2 (en) * 2011-11-28 2014-03-25 Corning Incorporated Method for low energy separation of a glass ribbon
JP2013119510A (ja) * 2011-12-08 2013-06-17 Asahi Glass Co Ltd レーザを用いてガラス基板を加工する方法
KR101258403B1 (ko) * 2011-12-09 2013-04-30 로체 시스템즈(주) 강화유리 기판 절단방법
CN103635438B (zh) * 2011-12-12 2016-08-17 日本电气硝子株式会社 平板玻璃的切割分离方法
US9938180B2 (en) 2012-06-05 2018-04-10 Corning Incorporated Methods of cutting glass using a laser
WO2014010490A1 (ja) * 2012-07-09 2014-01-16 旭硝子株式会社 強化ガラス板の切断方法
CN104854046B (zh) * 2012-07-10 2017-06-23 旭硝子株式会社 玻璃板的加工方法
KR101355807B1 (ko) * 2012-09-11 2014-02-03 로체 시스템즈(주) 비금속 재료의 곡선 절단방법
US9610653B2 (en) 2012-09-21 2017-04-04 Electro Scientific Industries, Inc. Method and apparatus for separation of workpieces and articles produced thereby
US20140084039A1 (en) * 2012-09-24 2014-03-27 Electro Scientific Industries, Inc. Method and apparatus for separating workpieces
US9216924B2 (en) 2012-11-09 2015-12-22 Corning Incorporated Methods of processing a glass ribbon
DE102012110971B4 (de) * 2012-11-14 2025-03-20 Schott Ag Verfahren zur Herstellung von linienförmig aufgereihten Schädigungsstellen in einem transparenten Werkstück sowie Verfahren und Vorrichtung zum Trennen eines Werkstücks
US9126857B2 (en) 2012-11-15 2015-09-08 Corning Incorporated Separation apparatuses for separating sheets of brittle material and methods for separating sheets of brittle material
WO2014079478A1 (en) 2012-11-20 2014-05-30 Light In Light Srl High speed laser processing of transparent materials
KR102002959B1 (ko) 2012-11-20 2019-07-24 삼성디스플레이 주식회사 표시 장치의 제조 방법
US9212081B2 (en) * 2012-11-21 2015-12-15 Corning Incorporated Methods of cutting a laminate strengthened glass substrate
EP2754524B1 (de) 2013-01-15 2015-11-25 Corning Laser Technologies GmbH Verfahren und Vorrichtung zum laserbasierten Bearbeiten von flächigen Substraten, d.h. Wafer oder Glaselement, unter Verwendung einer Laserstrahlbrennlinie
KR102144324B1 (ko) * 2013-02-04 2020-08-13 에이지씨 가부시키가이샤 유리 기판의 절단 방법, 유리 기판, 근적외선 커트 필터 유리, 유리 기판의 제조 방법
CN105339316B (zh) * 2013-02-25 2018-11-09 康宁股份有限公司 制造薄玻璃块的方法
EP2781296B1 (de) 2013-03-21 2020-10-21 Corning Laser Technologies GmbH Vorrichtung und verfahren zum ausschneiden von konturen aus flächigen substraten mittels laser
JP2016117593A (ja) * 2013-04-15 2016-06-30 旭硝子株式会社 ガラス板の切断方法
CN105939973B (zh) * 2013-12-03 2019-08-20 康宁股份有限公司 用于切断玻璃板的设备和方法
US10442719B2 (en) 2013-12-17 2019-10-15 Corning Incorporated Edge chamfering methods
US9815730B2 (en) 2013-12-17 2017-11-14 Corning Incorporated Processing 3D shaped transparent brittle substrate
US20150165560A1 (en) 2013-12-17 2015-06-18 Corning Incorporated Laser processing of slots and holes
US11556039B2 (en) 2013-12-17 2023-01-17 Corning Incorporated Electrochromic coated glass articles and methods for laser processing the same
US9517963B2 (en) 2013-12-17 2016-12-13 Corning Incorporated Method for rapid laser drilling of holes in glass and products made therefrom
US9676167B2 (en) 2013-12-17 2017-06-13 Corning Incorporated Laser processing of sapphire substrate and related applications
US9701563B2 (en) 2013-12-17 2017-07-11 Corning Incorporated Laser cut composite glass article and method of cutting
US9850160B2 (en) 2013-12-17 2017-12-26 Corning Incorporated Laser cutting of display glass compositions
US9260337B2 (en) * 2014-01-09 2016-02-16 Corning Incorporated Methods and apparatus for free-shape cutting of flexible thin glass
KR101616952B1 (ko) * 2014-01-14 2016-04-29 전상욱 취성 소재의 임의 형상 절단 방법
WO2015115604A1 (ja) * 2014-02-03 2015-08-06 日本電気硝子株式会社 レーザー溶断方法及び溶断面を有する板状ガラス製品
KR102421381B1 (ko) * 2014-02-20 2022-07-18 코닝 인코포레이티드 얇은 가요성 유리에 반경을 절단하기 위한 방법 및 장치
WO2015178358A1 (ja) * 2014-05-23 2015-11-26 日本電気硝子株式会社 パネルの製造方法
KR102445217B1 (ko) 2014-07-08 2022-09-20 코닝 인코포레이티드 재료를 레이저 가공하는 방법 및 장치
WO2016010943A2 (en) 2014-07-14 2016-01-21 Corning Incorporated Method and system for arresting crack propagation
TWI659793B (zh) * 2014-07-14 2019-05-21 美商康寧公司 用於使用可調整雷射束焦線來處理透明材料的系統及方法
WO2016010991A1 (en) 2014-07-14 2016-01-21 Corning Incorporated Interface block; system for and method of cutting a substrate being transparent within a range of wavelengths using such interface block
US10611667B2 (en) 2014-07-14 2020-04-07 Corning Incorporated Method and system for forming perforations
EP3183222B1 (en) 2014-08-20 2019-12-25 Corning Incorporated Method for yielding high edge strength in cutting of flexible thin glass
TW201628751A (zh) * 2014-11-20 2016-08-16 康寧公司 彈性玻璃基板之回饋控制的雷射切割
US10047001B2 (en) 2014-12-04 2018-08-14 Corning Incorporated Glass cutting systems and methods using non-diffracting laser beams
EP3245166B1 (en) 2015-01-12 2020-05-27 Corning Incorporated Laser cutting of thermally tempered substrates using the multi photon absorption method
EP3848334A1 (en) 2015-03-24 2021-07-14 Corning Incorporated Alkaline earth boro-aluminosilicate glass article with laser cut edge
WO2016160391A1 (en) 2015-03-27 2016-10-06 Corning Incorporated Gas permeable window and method of fabricating the same
US11186060B2 (en) 2015-07-10 2021-11-30 Corning Incorporated Methods of continuous fabrication of holes in flexible substrate sheets and products relating to the same
WO2017180116A1 (en) * 2016-04-13 2017-10-19 Gkn Aerospace North America Inc. System and method of additive manufacturing
MY194570A (en) 2016-05-06 2022-12-02 Corning Inc Laser cutting and removal of contoured shapes from transparent substrates
US10410883B2 (en) 2016-06-01 2019-09-10 Corning Incorporated Articles and methods of forming vias in substrates
US10794679B2 (en) 2016-06-29 2020-10-06 Corning Incorporated Method and system for measuring geometric parameters of through holes
CN109803934A (zh) 2016-07-29 2019-05-24 康宁股份有限公司 用于激光处理的装置和方法
WO2018044843A1 (en) 2016-08-30 2018-03-08 Corning Incorporated Laser processing of transparent materials
US11203183B2 (en) 2016-09-27 2021-12-21 Vaon, Llc Single and multi-layer, flat glass-sensor structures
US11243192B2 (en) 2016-09-27 2022-02-08 Vaon, Llc 3-D glass printable hand-held gas chromatograph for biomedical and environmental applications
US10821707B2 (en) * 2018-05-17 2020-11-03 Vaon, Llc Multi-layer, flat glass structures
CN109803786B (zh) 2016-09-30 2021-05-07 康宁股份有限公司 使用非轴对称束斑对透明工件进行激光加工的设备和方法
JP7066701B2 (ja) 2016-10-24 2022-05-13 コーニング インコーポレイテッド シート状ガラス基体のレーザに基づく加工のための基体処理ステーション
US10752534B2 (en) 2016-11-01 2020-08-25 Corning Incorporated Apparatuses and methods for laser processing laminate workpiece stacks
US10688599B2 (en) 2017-02-09 2020-06-23 Corning Incorporated Apparatus and methods for laser processing transparent workpieces using phase shifted focal lines
KR102479589B1 (ko) * 2017-03-22 2022-12-20 코닝 인코포레이티드 유리 웹의 분리 방법들
US11078112B2 (en) 2017-05-25 2021-08-03 Corning Incorporated Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the same
US10580725B2 (en) 2017-05-25 2020-03-03 Corning Incorporated Articles having vias with geometry attributes and methods for fabricating the same
US10626040B2 (en) 2017-06-15 2020-04-21 Corning Incorporated Articles capable of individual singulation
TWI753183B (zh) 2017-07-12 2022-01-21 美商康寧公司 製造玻璃基板的設備及方法
WO2019026586A1 (ja) * 2017-08-01 2019-02-07 坂東機工株式会社 ガラス板の折割機械
US12180108B2 (en) 2017-12-19 2024-12-31 Corning Incorporated Methods for etching vias in glass-based articles employing positive charge organic molecules
US11554984B2 (en) 2018-02-22 2023-01-17 Corning Incorporated Alkali-free borosilicate glasses with low post-HF etch roughness
US11524366B2 (en) * 2018-07-26 2022-12-13 Coherent Munich GmbH & Co. KG Separation and release of laser-processed brittle material
CN110091072B (zh) * 2019-05-28 2020-10-13 中国人民解放军国防科技大学 一种聚合物材料的瞬态激光烧蚀模拟方法
JP7515777B2 (ja) * 2020-02-05 2024-07-16 日本電気硝子株式会社 ガラス板の製造方法

Family Cites Families (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3629545A (en) 1967-12-19 1971-12-21 Western Electric Co Laser substrate parting
US4580336A (en) * 1984-01-26 1986-04-08 General Electric Company Apparatus for slitting amorphous metal and method of producing a magnetic core therefrom
JPS61229487A (ja) * 1985-04-03 1986-10-13 Sasaki Glass Kk レ−ザビ−ムによるガラス切断方法
US5132505A (en) * 1990-03-21 1992-07-21 U.S. Philips Corporation Method of cleaving a brittle plate and device for carrying out the method
KR920010885A (ko) * 1990-11-30 1992-06-27 카나이 쯔또무 박막반도체와 그 제조방법 및 제조장치 및 화상처리장치
JPH04349133A (ja) * 1991-05-28 1992-12-03 Seiko Epson Corp ガラス部品の切断加工方法
JP3036906B2 (ja) * 1991-07-30 2000-04-24 ホーヤ株式会社 ガラス加工方法及びその装置
RU2024441C1 (ru) 1992-04-02 1994-12-15 Владимир Степанович Кондратенко Способ резки неметаллических материалов
JP3077462B2 (ja) 1993-09-01 2000-08-14 日立電線株式会社 ガラスの切断方法
US5776220A (en) 1994-09-19 1998-07-07 Corning Incorporated Method and apparatus for breaking brittle materials
US5622540A (en) 1994-09-19 1997-04-22 Corning Incorporated Method for breaking a glass sheet
US5585020A (en) * 1994-11-03 1996-12-17 Becker; Michael F. Process for the production of nanoparticles
KR970008386A (ko) * 1995-07-07 1997-02-24 하라 세이지 기판의 할단(割斷)방법 및 그 할단장치
DE69629704T2 (de) * 1995-08-31 2004-07-08 Corning Inc. Verfahren und vorrichtung zum zerbrechen von sprödem material
US6306510B1 (en) * 1998-07-15 2001-10-23 Agfa-Gevaert Laminate comprising a glass layer having crack lines
JP2000281373A (ja) * 1999-03-26 2000-10-10 Mitsubishi Electric Corp 脆性材料の分割方法
JP2000323441A (ja) * 1999-05-10 2000-11-24 Hitachi Cable Ltd セラミックス基板上に形成した光導波回路チップの切断方法
DE19963939B4 (de) 1999-12-31 2004-11-04 Schott Spezialglas Gmbh Verfahren und Vorrichtung zum Durchtrennen von flachen Werkstücken aus sprödbrüchigem Material
JP4786783B2 (ja) * 2000-08-18 2011-10-05 日本板硝子株式会社 ガラス板の切断方法及び記録媒体用ガラス円盤
JP4659300B2 (ja) * 2000-09-13 2011-03-30 浜松ホトニクス株式会社 レーザ加工方法及び半導体チップの製造方法
US6657723B2 (en) * 2000-12-13 2003-12-02 International Business Machines Corporation Multimode planar spectrographs for wavelength demultiplexing and methods of fabrication
KR100561763B1 (ko) 2000-12-15 2006-03-16 엘체파우 라제르첸트룸 하노버 에.파우. 절단영역을 따라 구성요소위에 열팽창틈새를 발생시켜서 유리, 세라믹, 유리세라믹 등의 구성요소을 절단하기 위한 방법
US6770544B2 (en) * 2001-02-21 2004-08-03 Nec Machinery Corporation Substrate cutting method
JP2003002676A (ja) 2001-06-19 2003-01-08 Seiko Epson Corp 基板の分割方法及び液晶装置の製造方法
JP2003002675A (ja) * 2001-06-21 2003-01-08 Nakamura Tome Precision Ind Co Ltd ガラス板の割断方法及び装置
JP2003019587A (ja) * 2001-07-04 2003-01-21 Inst Of Physical & Chemical Res レーザー加工方法およびレーザー加工装置
JP4474108B2 (ja) * 2002-09-02 2010-06-02 株式会社 日立ディスプレイズ 表示装置とその製造方法および製造装置
US7294224B2 (en) 2003-12-01 2007-11-13 Applied Materials, Inc. Magnet assembly for plasma containment
DE102004014277A1 (de) 2004-03-22 2005-10-20 Fraunhofer Ges Forschung Verfahren zum laserthermischen Trennen von Flachgläsern
JP3873098B2 (ja) * 2004-03-31 2007-01-24 国立大学法人 北海道大学 レーザ加工方法および装置
DE102004020737A1 (de) 2004-04-27 2005-11-24 Lzh Laserzentrum Hannover E.V. Vorrichtung zum Durchtrennen von Bauteilen aus sprödbrüchigen Materialien mit spannungsfreier Bauteillagerung
DE102004024475A1 (de) * 2004-05-14 2005-12-01 Lzh Laserzentrum Hannover E.V. Verfahren und Vorrichtung zum Trennen von Halbleitermaterialien
JP2006159747A (ja) * 2004-12-09 2006-06-22 Japan Steel Works Ltd:The レーザ加工方法及びその装置
KR101152141B1 (ko) * 2005-06-08 2012-06-15 삼성전자주식회사 액정표시패널과 액정표시패널의 제조방법
KR101081613B1 (ko) 2005-09-13 2011-11-09 가부시키가이샤 레미 취성재료의 할단방법 및 장치
DE102006018622B3 (de) 2005-12-29 2007-08-09 H2B Photonics Gmbh Vorrichtung zum durchtrennenden Bearbeiten von Bauteilen aus sprödbrüchigem Material
JP2007319888A (ja) 2006-05-31 2007-12-13 Sharp Corp 被加工脆性部材のレーザー溶断方法
US8168514B2 (en) 2006-08-24 2012-05-01 Corning Incorporated Laser separation of thin laminated glass substrates for flexible display applications
US20090040640A1 (en) * 2007-08-07 2009-02-12 Jinnam Kim Glass cutting method, glass for flat panel display thereof and flat panel display device using it

Also Published As

Publication number Publication date
WO2010135616A3 (en) 2011-02-24
WO2010135616A2 (en) 2010-11-25
US20100294748A1 (en) 2010-11-25
JP6018503B2 (ja) 2016-11-02
TWI415811B (zh) 2013-11-21
EP2432616A4 (en) 2015-02-11
US8269138B2 (en) 2012-09-18
KR20120018798A (ko) 2012-03-05
CN102458754B (zh) 2016-04-06
CN102458754A (zh) 2012-05-16
JP2012527400A (ja) 2012-11-08
EP2432616B1 (en) 2018-02-28
EP2432616A2 (en) 2012-03-28
TW201103875A (en) 2011-02-01

Similar Documents

Publication Publication Date Title
KR101581992B1 (ko) 취성 재료의 시트 분리 방법
US20120211923A1 (en) Laser cutting method
JP5702785B2 (ja) ガラス基板のレーザ切断方法
TWI794959B (zh) 從透明基板雷射切割及移除輪廓形狀
KR101804585B1 (ko) 박막 유리의 레이저 스크라이빙 및 절단 방법
JP6591894B2 (ja) 積層強化ガラス基板の切断方法
US8720228B2 (en) Methods of separating strengthened glass substrates
US8943855B2 (en) Methods for laser cutting articles from ion exchanged glass substrates
US20130221053A1 (en) Method and apparatus for separation of strengthened glass and articles produced thereby
KR102421381B1 (ko) 얇은 가요성 유리에 반경을 절단하기 위한 방법 및 장치
US20080202167A1 (en) Thermal edge finishing
KR20160101068A (ko) 디스플레이 유리 조성물의 레이저 절단
EP2507182A2 (en) Methods for laser scribing and separating glass substrates
WO2014010488A1 (ja) ガラス板の加工方法
JP4831003B2 (ja) レーザ照射によるガラス基板表面の表面傷部の修復法
Seong et al. Comparison of laser glass cutting process using ps and fs lasers
WO2012075097A1 (en) Methods for separating a sheet of brittle material

Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000

R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

A201 Request for examination
A302 Request for accelerated examination
AMND Amendment
E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

PA0302 Request for accelerated examination

St.27 status event code: A-1-2-D10-D17-exm-PA0302

St.27 status event code: A-1-2-D10-D16-exm-PA0302

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

AMND Amendment
P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E601 Decision to refuse application
PE0601 Decision on rejection of patent

St.27 status event code: N-2-6-B10-B15-exm-PE0601

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

AMND Amendment
P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PX0901 Re-examination

St.27 status event code: A-2-3-E10-E12-rex-PX0901

PX0701 Decision of registration after re-examination

St.27 status event code: A-3-4-F10-F13-rex-PX0701

X701 Decision to grant (after re-examination)
GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U12-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

FPAY Annual fee payment

Payment date: 20180928

Year of fee payment: 4

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 6

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 7

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 8

PC1903 Unpaid annual fee

St.27 status event code: A-4-4-U10-U13-oth-PC1903

Not in force date: 20231225

Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

PC1903 Unpaid annual fee

St.27 status event code: N-4-6-H10-H13-oth-PC1903

Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

Not in force date: 20231225