KR101581992B1 - 취성 재료의 시트 분리 방법 - Google Patents
취성 재료의 시트 분리 방법 Download PDFInfo
- Publication number
- KR101581992B1 KR101581992B1 KR1020117029957A KR20117029957A KR101581992B1 KR 101581992 B1 KR101581992 B1 KR 101581992B1 KR 1020117029957 A KR1020117029957 A KR 1020117029957A KR 20117029957 A KR20117029957 A KR 20117029957A KR 101581992 B1 KR101581992 B1 KR 101581992B1
- Authority
- KR
- South Korea
- Prior art keywords
- sheet
- brittle material
- glass
- predetermined path
- laser
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/09—Severing cooled glass by thermal shock
- C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/0215—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the ribbon being in a substantially vertical plane
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/0235—Ribbons
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/04—Cutting or splitting in curves, especially for making spectacle lenses
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/09—Severing cooled glass by thermal shock
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/52—Ceramics
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T225/00—Severing by tearing or breaking
- Y10T225/30—Breaking or tearing apparatus
- Y10T225/304—Including means to apply thermal shock to work
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Thermal Sciences (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Laser Beam Processing (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US12/469,794 | 2009-05-21 | ||
| US12/469,794 US8269138B2 (en) | 2009-05-21 | 2009-05-21 | Method for separating a sheet of brittle material |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20120018798A KR20120018798A (ko) | 2012-03-05 |
| KR101581992B1 true KR101581992B1 (ko) | 2015-12-31 |
Family
ID=43123886
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020117029957A Expired - Fee Related KR101581992B1 (ko) | 2009-05-21 | 2010-05-21 | 취성 재료의 시트 분리 방법 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US8269138B2 (enExample) |
| EP (1) | EP2432616B1 (enExample) |
| JP (1) | JP6018503B2 (enExample) |
| KR (1) | KR101581992B1 (enExample) |
| CN (1) | CN102458754B (enExample) |
| TW (1) | TWI415811B (enExample) |
| WO (1) | WO2010135616A2 (enExample) |
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| US8607590B2 (en) * | 2010-11-30 | 2013-12-17 | Corning Incorporated | Methods for separating glass articles from strengthened glass substrate sheets |
| TWI548598B (zh) * | 2011-02-28 | 2016-09-11 | 康寧公司 | 熔融抽拉裝置及方法 |
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| US8635887B2 (en) * | 2011-08-10 | 2014-01-28 | Corning Incorporated | Methods for separating glass substrate sheets by laser-formed grooves |
| DE102011084128A1 (de) * | 2011-10-07 | 2013-04-11 | Schott Ag | Verfahren zum Schneiden eines Dünnglases mit spezieller Ausbildung der Kante |
| US8677783B2 (en) * | 2011-11-28 | 2014-03-25 | Corning Incorporated | Method for low energy separation of a glass ribbon |
| JP2013119510A (ja) * | 2011-12-08 | 2013-06-17 | Asahi Glass Co Ltd | レーザを用いてガラス基板を加工する方法 |
| KR101258403B1 (ko) * | 2011-12-09 | 2013-04-30 | 로체 시스템즈(주) | 강화유리 기판 절단방법 |
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| KR102144324B1 (ko) * | 2013-02-04 | 2020-08-13 | 에이지씨 가부시키가이샤 | 유리 기판의 절단 방법, 유리 기판, 근적외선 커트 필터 유리, 유리 기판의 제조 방법 |
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| JP2003002675A (ja) * | 2001-06-21 | 2003-01-08 | Nakamura Tome Precision Ind Co Ltd | ガラス板の割断方法及び装置 |
| JP2003019587A (ja) * | 2001-07-04 | 2003-01-21 | Inst Of Physical & Chemical Res | レーザー加工方法およびレーザー加工装置 |
| JP4474108B2 (ja) * | 2002-09-02 | 2010-06-02 | 株式会社 日立ディスプレイズ | 表示装置とその製造方法および製造装置 |
| US7294224B2 (en) | 2003-12-01 | 2007-11-13 | Applied Materials, Inc. | Magnet assembly for plasma containment |
| DE102004014277A1 (de) | 2004-03-22 | 2005-10-20 | Fraunhofer Ges Forschung | Verfahren zum laserthermischen Trennen von Flachgläsern |
| JP3873098B2 (ja) * | 2004-03-31 | 2007-01-24 | 国立大学法人 北海道大学 | レーザ加工方法および装置 |
| DE102004020737A1 (de) | 2004-04-27 | 2005-11-24 | Lzh Laserzentrum Hannover E.V. | Vorrichtung zum Durchtrennen von Bauteilen aus sprödbrüchigen Materialien mit spannungsfreier Bauteillagerung |
| DE102004024475A1 (de) * | 2004-05-14 | 2005-12-01 | Lzh Laserzentrum Hannover E.V. | Verfahren und Vorrichtung zum Trennen von Halbleitermaterialien |
| JP2006159747A (ja) * | 2004-12-09 | 2006-06-22 | Japan Steel Works Ltd:The | レーザ加工方法及びその装置 |
| KR101152141B1 (ko) * | 2005-06-08 | 2012-06-15 | 삼성전자주식회사 | 액정표시패널과 액정표시패널의 제조방법 |
| KR101081613B1 (ko) | 2005-09-13 | 2011-11-09 | 가부시키가이샤 레미 | 취성재료의 할단방법 및 장치 |
| DE102006018622B3 (de) | 2005-12-29 | 2007-08-09 | H2B Photonics Gmbh | Vorrichtung zum durchtrennenden Bearbeiten von Bauteilen aus sprödbrüchigem Material |
| JP2007319888A (ja) | 2006-05-31 | 2007-12-13 | Sharp Corp | 被加工脆性部材のレーザー溶断方法 |
| US8168514B2 (en) | 2006-08-24 | 2012-05-01 | Corning Incorporated | Laser separation of thin laminated glass substrates for flexible display applications |
| US20090040640A1 (en) * | 2007-08-07 | 2009-02-12 | Jinnam Kim | Glass cutting method, glass for flat panel display thereof and flat panel display device using it |
-
2009
- 2009-05-21 US US12/469,794 patent/US8269138B2/en not_active Expired - Fee Related
-
2010
- 2010-05-20 TW TW99116134A patent/TWI415811B/zh not_active IP Right Cessation
- 2010-05-21 CN CN201080027736.8A patent/CN102458754B/zh not_active Expired - Fee Related
- 2010-05-21 WO PCT/US2010/035715 patent/WO2010135616A2/en not_active Ceased
- 2010-05-21 EP EP10778445.6A patent/EP2432616B1/en not_active Not-in-force
- 2010-05-21 KR KR1020117029957A patent/KR101581992B1/ko not_active Expired - Fee Related
- 2010-05-21 JP JP2012512055A patent/JP6018503B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| WO2010135616A3 (en) | 2011-02-24 |
| WO2010135616A2 (en) | 2010-11-25 |
| US20100294748A1 (en) | 2010-11-25 |
| JP6018503B2 (ja) | 2016-11-02 |
| TWI415811B (zh) | 2013-11-21 |
| EP2432616A4 (en) | 2015-02-11 |
| US8269138B2 (en) | 2012-09-18 |
| KR20120018798A (ko) | 2012-03-05 |
| CN102458754B (zh) | 2016-04-06 |
| CN102458754A (zh) | 2012-05-16 |
| JP2012527400A (ja) | 2012-11-08 |
| EP2432616B1 (en) | 2018-02-28 |
| EP2432616A2 (en) | 2012-03-28 |
| TW201103875A (en) | 2011-02-01 |
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