JP2018536276A5 - - Google Patents
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- Publication number
- JP2018536276A5 JP2018536276A5 JP2018508643A JP2018508643A JP2018536276A5 JP 2018536276 A5 JP2018536276 A5 JP 2018536276A5 JP 2018508643 A JP2018508643 A JP 2018508643A JP 2018508643 A JP2018508643 A JP 2018508643A JP 2018536276 A5 JP2018536276 A5 JP 2018536276A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate web
- spool
- assembly
- etching
- advancing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 239000000758 substrate Substances 0.000 claims 28
- 238000000034 method Methods 0.000 claims 9
- 238000005530 etching Methods 0.000 claims 8
- 239000011521 glass Substances 0.000 claims 5
- 238000004804 winding Methods 0.000 claims 5
- 230000007547 defect Effects 0.000 claims 4
- 239000000463 material Substances 0.000 claims 2
- 230000000712 assembly Effects 0.000 claims 1
- 238000000429 assembly Methods 0.000 claims 1
- 239000000919 ceramic Substances 0.000 claims 1
- 239000002241 glass-ceramic Substances 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 claims 1
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201562208282P | 2015-08-21 | 2015-08-21 | |
| US62/208,282 | 2015-08-21 | ||
| US201562232076P | 2015-09-24 | 2015-09-24 | |
| US62/232,076 | 2015-09-24 | ||
| PCT/US2016/047746 WO2017034969A1 (en) | 2015-08-21 | 2016-08-19 | Methods of continuous fabrication of features in flexible substrate webs and products relating to the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2018536276A JP2018536276A (ja) | 2018-12-06 |
| JP2018536276A5 true JP2018536276A5 (enExample) | 2019-09-26 |
Family
ID=56853833
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2018508643A Abandoned JP2018536276A (ja) | 2015-08-21 | 2016-08-19 | 可撓性基体ウェブに特徴物を連続して作製する方法、および、それに関する生成物 |
| JP2018509741A Pending JP2018525840A (ja) | 2015-08-21 | 2016-08-19 | 低誘電特性を有するガラス基板アセンブリ |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2018509741A Pending JP2018525840A (ja) | 2015-08-21 | 2016-08-19 | 低誘電特性を有するガラス基板アセンブリ |
Country Status (7)
| Country | Link |
|---|---|
| US (2) | US20180166353A1 (enExample) |
| EP (2) | EP3338521A1 (enExample) |
| JP (2) | JP2018536276A (enExample) |
| KR (2) | KR20180048723A (enExample) |
| CN (2) | CN107926110B (enExample) |
| TW (1) | TWI711348B (enExample) |
| WO (2) | WO2017034969A1 (enExample) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10626040B2 (en) * | 2017-06-15 | 2020-04-21 | Corning Incorporated | Articles capable of individual singulation |
| CN107498955A (zh) * | 2017-09-21 | 2017-12-22 | 电子科技大学 | 一种宽带电磁透明复合式玻璃 |
| KR102728430B1 (ko) * | 2019-05-14 | 2024-11-08 | 쇼오트 글라스 테크놀로지스 (쑤저우) 코퍼레이션 리미티드. | 높은 굽힘 강도의 박형 유리 기판 및 이의 제조 방법 |
| CN113950870A (zh) * | 2019-08-01 | 2022-01-18 | 日本电气硝子株式会社 | 玻璃膜以及使用其的玻璃卷 |
| JP7503894B2 (ja) * | 2019-08-05 | 2024-06-21 | 日東電工株式会社 | ガラスフィルムの製造方法 |
| CN112440532A (zh) * | 2019-08-27 | 2021-03-05 | 康宁股份有限公司 | 用于高频印刷电路板应用的有机/无机层叠体 |
| US11342649B2 (en) * | 2019-09-03 | 2022-05-24 | Corning Incorporated | Flexible waveguides having a ceramic core surrounded by a lower dielectric constant cladding for terahertz applications |
| US12352102B2 (en) | 2020-08-07 | 2025-07-08 | Cardinal Cg Company | Aerogel glazing adhesion and IG unit technology |
| EP4193031A1 (en) | 2020-08-07 | 2023-06-14 | Cardinal CG Company | Double-pane insulating glazing units |
| CN114195399A (zh) * | 2020-09-18 | 2022-03-18 | 徐强 | 一种连续法生产柔性玻璃卷材的化学减薄工艺 |
| EP4323318A1 (en) | 2021-04-15 | 2024-02-21 | Cardinal CG Company | Flexible aerogel, flexible glass technology |
| US20220399206A1 (en) * | 2021-06-11 | 2022-12-15 | V-Finity Inc. | Method for building conductive through-hole vias in glass substrates |
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| US3964232A (en) * | 1973-10-04 | 1976-06-22 | Johns-Manville Corporation | Method of packaging fibrous mat structure |
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| US4833104A (en) * | 1987-11-27 | 1989-05-23 | Corning Glass Works | Glass-ceramic substrates for electronic packaging |
| JPH0831972A (ja) * | 1994-07-11 | 1996-02-02 | Nippon Telegr & Teleph Corp <Ntt> | Ic化実装用基板 |
| JP3238064B2 (ja) * | 1996-02-05 | 2001-12-10 | ティーディーケイ株式会社 | 低誘電性高分子材料の使用方法ならびにそれを用いたフィルム、基板および電子部品の使用方法 |
| US5753968A (en) * | 1996-08-05 | 1998-05-19 | Itt Industries, Inc. | Low loss ridged microstrip line for monolithic microwave integrated circuit (MMIC) applications |
| US5922453A (en) * | 1997-02-06 | 1999-07-13 | Rogers Corporation | Ceramic-filled fluoropolymer composite containing polymeric powder for high frequency circuit substrates |
| US6054379A (en) * | 1998-02-11 | 2000-04-25 | Applied Materials, Inc. | Method of depositing a low k dielectric with organo silane |
| JP2002359445A (ja) * | 2001-03-22 | 2002-12-13 | Matsushita Electric Ind Co Ltd | レーザー加工用の誘電体基板およびその加工方法ならび半導体パッケージおよびその製作方法 |
| DE10222958B4 (de) * | 2002-04-15 | 2007-08-16 | Schott Ag | Verfahren zur Herstellung eines organischen elektro-optischen Elements und organisches elektro-optisches Element |
| JP2004169049A (ja) * | 2002-11-15 | 2004-06-17 | Polyplastics Co | 環状オレフィン系樹脂成形品表面への金属複合方法及び金属複合化環状オレフィン系樹脂成形品 |
| TWI234210B (en) * | 2002-12-03 | 2005-06-11 | Sanyo Electric Co | Semiconductor module and manufacturing method thereof as well as wiring member of thin sheet |
| KR20070039151A (ko) * | 2002-12-13 | 2007-04-11 | 가부시키가이샤 가네카 | 열가소성 폴리이미드 수지 필름, 적층체 및 그것을포함하는 인쇄 배선판의 제조 방법 |
| JP2004282412A (ja) * | 2003-03-17 | 2004-10-07 | Renesas Technology Corp | 高周波電子回路部品 |
| US7408258B2 (en) * | 2003-08-20 | 2008-08-05 | Salmon Technologies, Llc | Interconnection circuit and electronic module utilizing same |
| US20050183589A1 (en) * | 2004-02-19 | 2005-08-25 | Salmon Peter C. | Imprinting tools and methods for printed circuit boards and assemblies |
| US7719379B2 (en) * | 2004-03-04 | 2010-05-18 | Banpil Photonics, Inc. | High speed electronics interconnect having a dielectric system with air holes of varying diameters and spans |
| US7663064B2 (en) * | 2004-09-25 | 2010-02-16 | Banpil Photonics, Inc. | High-speed flex printed circuit and method of manufacturing |
| US20090110916A1 (en) * | 2005-07-05 | 2009-04-30 | Valery Ostrovsky | Multi-Layered Product for Printed Circuit Boards, and a Process for Continuous Manufacture of Same |
| JP4827460B2 (ja) * | 2005-08-24 | 2011-11-30 | 三井・デュポンフロロケミカル株式会社 | 含フッ素樹脂積層体 |
| JP4994052B2 (ja) * | 2006-03-28 | 2012-08-08 | 京セラ株式会社 | 基板およびこれを用いた回路基板 |
| JP2007320088A (ja) * | 2006-05-30 | 2007-12-13 | Nof Corp | プリプレグ及びプリント配線板用金属張り基板 |
| DE102006034480A1 (de) * | 2006-07-26 | 2008-01-31 | M.A.S. Systeme Gesellschaft für Kunststoffprodukte mbH | Leiterplattenmaterial und Herstellungsverfahren für dieses |
| US7678721B2 (en) * | 2006-10-26 | 2010-03-16 | Agy Holding Corp. | Low dielectric glass fiber |
| US7829490B2 (en) * | 2006-12-14 | 2010-11-09 | Ppg Industries Ohio, Inc. | Low dielectric glass and fiber glass for electronic applications |
| US8019187B1 (en) * | 2009-08-17 | 2011-09-13 | Banpil Photonics, Inc. | Super high-speed chip to chip interconnects |
| US9656901B2 (en) * | 2010-03-03 | 2017-05-23 | Nippon Electric Glass Co., Ltd. | Method of manufacturing a glass roll |
| CN201783991U (zh) * | 2010-08-17 | 2011-04-06 | 嘉联益科技股份有限公司 | 卷对卷连续水平式钻孔设备 |
| CN201833420U (zh) * | 2010-08-24 | 2011-05-18 | 嘉联益科技股份有限公司 | 卷对卷连续水平式钻孔设备 |
| JP5831096B2 (ja) * | 2011-02-08 | 2015-12-09 | 日立化成株式会社 | 電磁結合構造、多層伝送線路板、電磁結合構造の製造方法、及び多層伝送線路板の製造方法 |
| US9462688B2 (en) * | 2011-09-07 | 2016-10-04 | Lg Chem, Ltd. | Flexible metal laminate containing fluoropolymer |
| JP5821975B2 (ja) * | 2012-02-13 | 2015-11-24 | 株式会社村田製作所 | 複合積層セラミック電子部品 |
| JP2013201344A (ja) * | 2012-03-26 | 2013-10-03 | Sumitomo Electric Fine Polymer Inc | フッ素樹脂基板 |
| US9615453B2 (en) * | 2012-09-26 | 2017-04-04 | Ping-Jung Yang | Method for fabricating glass substrate package |
| US20140116615A1 (en) * | 2012-10-25 | 2014-05-01 | Central Glass Company, Limited | Adhesive Composition, Bonding Method Using Adhesive Composition, and Separation Method After Bonding |
| JP6333282B2 (ja) * | 2012-11-29 | 2018-05-30 | コーニング インコーポレイテッド | レーザー損傷及びエッチングによってガラス物品を製造する方法 |
| KR102226231B1 (ko) * | 2013-02-26 | 2021-03-11 | 코닝 인코포레이티드 | 가요성 유리중합체 라미네이트를 형상 유지하여 형성하는 방법 |
| WO2014161534A2 (de) * | 2013-04-04 | 2014-10-09 | Lpkf Laser & Electronics Ag | Verfahren und vorrichtung zum einbringen von durchbrechungen in ein substrat sowie ein derart hergestelltes substrat |
| US10383215B2 (en) * | 2013-05-31 | 2019-08-13 | Sumitomo Electric Industries, Ltd. | Radio-frequency printed circuit board and wiring material |
| KR20150024093A (ko) * | 2013-08-26 | 2015-03-06 | 삼성전기주식회사 | 인쇄회로기판 및 인쇄회로기판 제조 방법 |
| US9296646B2 (en) * | 2013-08-29 | 2016-03-29 | Corning Incorporated | Methods for forming vias in glass substrates |
| US11364714B2 (en) * | 2013-10-11 | 2022-06-21 | Sumitomo Electric Printed Circuits, Inc. | Fluororesin base material, printed wiring board, and circuit module |
| US20150165563A1 (en) * | 2013-12-17 | 2015-06-18 | Corning Incorporated | Stacked transparent material cutting with ultrafast laser beam optics, disruptive layers and other layers |
| US9687936B2 (en) * | 2013-12-17 | 2017-06-27 | Corning Incorporated | Transparent material cutting with ultrafast laser and beam optics |
| US10293436B2 (en) | 2013-12-17 | 2019-05-21 | Corning Incorporated | Method for rapid laser drilling of holes in glass and products made therefrom |
| US9425125B2 (en) * | 2014-02-20 | 2016-08-23 | Altera Corporation | Silicon-glass hybrid interposer circuitry |
| KR102463613B1 (ko) * | 2015-01-14 | 2022-11-03 | 쇼와덴코머티리얼즈가부시끼가이샤 | 다층 전송 선로판 |
| US9809690B2 (en) * | 2015-06-09 | 2017-11-07 | Rogers Corporation | Circuit materials and articles formed therefrom |
| JP2017031256A (ja) * | 2015-07-29 | 2017-02-09 | 日東電工株式会社 | フッ素樹脂多孔質体、それを用いた金属層付多孔質体及び配線基板 |
-
2016
- 2016-08-19 KR KR1020187007718A patent/KR20180048723A/ko not_active Withdrawn
- 2016-08-19 EP EP16766113.1A patent/EP3338521A1/en not_active Withdrawn
- 2016-08-19 CN CN201680048644.5A patent/CN107926110B/zh not_active Expired - Fee Related
- 2016-08-19 CN CN201680048719.XA patent/CN107926111A/zh active Pending
- 2016-08-19 EP EP16760263.0A patent/EP3338520A1/en not_active Withdrawn
- 2016-08-19 JP JP2018508643A patent/JP2018536276A/ja not_active Abandoned
- 2016-08-19 TW TW105126522A patent/TWI711348B/zh not_active IP Right Cessation
- 2016-08-19 WO PCT/US2016/047746 patent/WO2017034969A1/en not_active Ceased
- 2016-08-19 US US15/753,889 patent/US20180166353A1/en not_active Abandoned
- 2016-08-19 KR KR1020187008111A patent/KR20180052646A/ko not_active Withdrawn
- 2016-08-19 JP JP2018509741A patent/JP2018525840A/ja active Pending
- 2016-08-19 US US15/754,144 patent/US20180249579A1/en not_active Abandoned
- 2016-08-19 WO PCT/US2016/047728 patent/WO2017034958A1/en not_active Ceased
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