JP2013508561A5 - - Google Patents

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Publication number
JP2013508561A5
JP2013508561A5 JP2012536874A JP2012536874A JP2013508561A5 JP 2013508561 A5 JP2013508561 A5 JP 2013508561A5 JP 2012536874 A JP2012536874 A JP 2012536874A JP 2012536874 A JP2012536874 A JP 2012536874A JP 2013508561 A5 JP2013508561 A5 JP 2013508561A5
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JP
Japan
Prior art keywords
plate
distribution manifold
fluid distribution
dimension
width dimension
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2012536874A
Other languages
English (en)
Japanese (ja)
Other versions
JP2013508561A (ja
Filing date
Publication date
Priority claimed from US12/606,228 external-priority patent/US20110097490A1/en
Application filed filed Critical
Publication of JP2013508561A publication Critical patent/JP2013508561A/ja
Publication of JP2013508561A5 publication Critical patent/JP2013508561A5/ja
Withdrawn legal-status Critical Current

Links

JP2012536874A 2009-10-27 2010-10-19 曲がりやすいプレートを有する流体分配マニホールド Withdrawn JP2013508561A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/606,228 US20110097490A1 (en) 2009-10-27 2009-10-27 Fluid distribution manifold including compliant plates
US12/606,228 2009-10-27
PCT/US2010/053096 WO2011056405A1 (en) 2009-10-27 2010-10-19 Fluid distribution manifold including compliant plates

Publications (2)

Publication Number Publication Date
JP2013508561A JP2013508561A (ja) 2013-03-07
JP2013508561A5 true JP2013508561A5 (enExample) 2013-11-21

Family

ID=43446891

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012536874A Withdrawn JP2013508561A (ja) 2009-10-27 2010-10-19 曲がりやすいプレートを有する流体分配マニホールド

Country Status (5)

Country Link
US (1) US20110097490A1 (enExample)
EP (1) EP2494092A1 (enExample)
JP (1) JP2013508561A (enExample)
CN (1) CN102686775A (enExample)
WO (1) WO2011056405A1 (enExample)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11136667B2 (en) * 2007-01-08 2021-10-05 Eastman Kodak Company Deposition system and method using a delivery head separated from a substrate by gas pressure
US20110097491A1 (en) * 2009-10-27 2011-04-28 Levy David H Conveyance system including opposed fluid distribution manifolds
DE102012207172A1 (de) * 2012-04-30 2013-10-31 Osram Gmbh Vorrichtung und verfahren zur oberflächenbehandlung eines substrats und verfahren zum herstellen eines optoelektronischen bauelements
DE102015013799A1 (de) * 2015-10-26 2017-04-27 Grenzebach Maschinenbau Gmbh Vorrichtung und Verfahren zum Beschichten überlanger flächenhafter Substrate, insbesondere Glasscheiben, in einer Vakuum-Beschichtungsanlage
US10895011B2 (en) 2017-03-14 2021-01-19 Eastman Kodak Company Modular thin film deposition system
US10435788B2 (en) 2017-03-14 2019-10-08 Eastman Kodak Deposition system with repeating motion profile
US11248292B2 (en) 2017-03-14 2022-02-15 Eastman Kodak Company Deposition system with moveable-position web guides
US10501848B2 (en) 2017-03-14 2019-12-10 Eastman Kodak Company Deposition system with modular deposition heads
US10422038B2 (en) * 2017-03-14 2019-09-24 Eastman Kodak Company Dual gas bearing substrate positioning system
US20180265977A1 (en) 2017-03-14 2018-09-20 Eastman Kodak Company Deposition system with vacuum pre-loaded deposition head
US10584413B2 (en) 2017-03-14 2020-03-10 Eastman Kodak Company Vertical system with vacuum pre-loaded deposition head
US10550476B2 (en) 2017-03-14 2020-02-04 Eastman Kodak Company Heated gas-bearing backer
US10400332B2 (en) * 2017-03-14 2019-09-03 Eastman Kodak Company Deposition system with interlocking deposition heads
CN113196455B (zh) * 2018-11-30 2023-06-13 株式会社明电舍 氧化膜形成装置
CN110058647B (zh) * 2019-03-26 2021-12-28 武汉华星光电半导体显示技术有限公司 承载衬底及柔性显示模组
US11788186B2 (en) 2020-03-16 2023-10-17 Goodrich Corporation Seal plates for chemical vapor infiltration and deposition chambers
CN111424263A (zh) * 2020-04-27 2020-07-17 深圳市原速光电科技有限公司 气体分布台和悬浮传动装置
KR102627477B1 (ko) * 2023-11-01 2024-01-22 (주) 이노윈테크 반도체 제조설비용 디퓨저

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FI57975C (fi) * 1979-02-28 1980-11-10 Lohja Ab Oy Foerfarande och anordning vid uppbyggande av tunna foereningshinnor
JPS6086391A (ja) * 1983-10-17 1985-05-15 Matsushita Electric Ind Co Ltd 熱交換器
US4581624A (en) * 1984-03-01 1986-04-08 Allied Corporation Microminiature semiconductor valve
US5705018A (en) * 1995-12-13 1998-01-06 Hartley; Frank T. Micromachined peristaltic pump
JP2889189B2 (ja) * 1996-07-24 1999-05-10 株式会社クボタ 波状瓦板
US5981970A (en) * 1997-03-25 1999-11-09 International Business Machines Corporation Thin-film field-effect transistor with organic semiconductor requiring low operating voltages
JP3745232B2 (ja) * 2001-01-17 2006-02-15 愛三工業株式会社 流体噴射ノズルとその流体噴射ノズルを備えた流体噴射弁
US20050084610A1 (en) * 2002-08-13 2005-04-21 Selitser Simon I. Atmospheric pressure molecular layer CVD
US6821563B2 (en) * 2002-10-02 2004-11-23 Applied Materials, Inc. Gas distribution system for cyclical layer deposition
US20060214154A1 (en) * 2005-03-24 2006-09-28 Eastman Kodak Company Polymeric gate dielectrics for organic thin film transistors and methods of making the same
US7954730B2 (en) * 2005-05-02 2011-06-07 Hong Kong Piezo Co. Ltd. Piezoelectric fluid atomizer apparatuses and methods
US7456429B2 (en) * 2006-03-29 2008-11-25 Eastman Kodak Company Apparatus for atomic layer deposition
US11136667B2 (en) * 2007-01-08 2021-10-05 Eastman Kodak Company Deposition system and method using a delivery head separated from a substrate by gas pressure
US20080166880A1 (en) * 2007-01-08 2008-07-10 Levy David H Delivery device for deposition
US8211231B2 (en) * 2007-09-26 2012-07-03 Eastman Kodak Company Delivery device for deposition
US8398770B2 (en) * 2007-09-26 2013-03-19 Eastman Kodak Company Deposition system for thin film formation

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