JP2012520375A5 - - Google Patents
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- Publication number
- JP2012520375A5 JP2012520375A5 JP2011554032A JP2011554032A JP2012520375A5 JP 2012520375 A5 JP2012520375 A5 JP 2012520375A5 JP 2011554032 A JP2011554032 A JP 2011554032A JP 2011554032 A JP2011554032 A JP 2011554032A JP 2012520375 A5 JP2012520375 A5 JP 2012520375A5
- Authority
- JP
- Japan
- Prior art keywords
- composition
- ethylhexyl
- bis
- heat source
- interface material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- CDWUGUNUUPYAFB-UHFFFAOYSA-N CC(C1)(C1(C)C(CNC)=O)C=[IH] Chemical compound CC(C1)(C1(C)C(CNC)=O)C=[IH] CDWUGUNUUPYAFB-UHFFFAOYSA-N 0.000 description 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US15956909P | 2009-03-12 | 2009-03-12 | |
| US61/159,569 | 2009-03-12 | ||
| PCT/US2009/066204 WO2010104534A1 (en) | 2009-03-12 | 2009-12-01 | Thermal interface materials and mehtods for their preparation and use |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2012520375A JP2012520375A (ja) | 2012-09-06 |
| JP2012520375A5 true JP2012520375A5 (enExample) | 2012-10-18 |
| JP5640021B2 JP5640021B2 (ja) | 2014-12-10 |
Family
ID=41490482
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011554032A Expired - Fee Related JP5640021B2 (ja) | 2009-03-12 | 2009-12-01 | 熱界面材料、並びに、その調製及び使用方法 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US8440312B2 (enExample) |
| EP (1) | EP2406321A1 (enExample) |
| JP (1) | JP5640021B2 (enExample) |
| KR (1) | KR20110133608A (enExample) |
| CN (1) | CN102341459B (enExample) |
| TW (1) | TW201035247A (enExample) |
| WO (1) | WO2010104534A1 (enExample) |
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| US6791839B2 (en) | 2002-06-25 | 2004-09-14 | Dow Corning Corporation | Thermal interface materials and methods for their preparation and use |
| US8067066B2 (en) * | 2003-10-03 | 2011-11-29 | Hempel A/S | Tie-coat composition comprising at least two types of functional polysiloxane compounds and a method for using the same for establishing a coating on a substrate |
| CN100556929C (zh) | 2003-10-10 | 2009-11-04 | 陶氏康宁公司 | 含有醇官能的有机硅树脂的聚氨酯组合物 |
| JP4557136B2 (ja) * | 2004-05-13 | 2010-10-06 | 信越化学工業株式会社 | 熱伝導性シリコーンゴム組成物及び成型品 |
| WO2005121267A1 (en) | 2004-06-11 | 2005-12-22 | Lg Chem. Ltd. | Adhesive sheet comprising hollow parts and method for preparing the same |
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| DE102004041379A1 (de) | 2004-08-26 | 2006-03-02 | Wacker-Chemie Gmbh | Vernetzbare Siloxan-Harnstoff-Copolymere |
| EP1866376B1 (en) * | 2005-04-06 | 2015-05-20 | Dow Corning Corporation | Organosiloxane compositions |
| JP5154010B2 (ja) * | 2005-10-27 | 2013-02-27 | モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 | 熱伝導性シリコーンゴム組成物 |
| DE102005057460A1 (de) | 2005-12-01 | 2007-06-06 | Wacker Chemie Ag | Zu hochfesten Elastomeren vernetzbare ionisch und/oder organometallisch funktionalisierte Siliconpolymere |
| DE102005061248B4 (de) | 2005-12-20 | 2007-09-20 | Infineon Technologies Ag | Systemträger mit in Kunststoffmasse einzubettenden Oberflächen, Verfahren zur Herstellung eines Systemträgers und Verwendung einer Schicht als Haftvermittlerschicht |
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| US20080160317A1 (en) | 2006-12-29 | 2008-07-03 | Deborah Ann Haitko | Optoelectronic device |
| WO2008103219A1 (en) | 2007-02-20 | 2008-08-28 | Dow Corning Coration | Filler treating agents based on hydrogen bonding polyorganosiloxanes |
| JP2008239719A (ja) * | 2007-03-26 | 2008-10-09 | Dow Corning Toray Co Ltd | シリコーンエラストマー組成物およびシリコーンエラストマー |
| JP5233325B2 (ja) * | 2008-02-29 | 2013-07-10 | 信越化学工業株式会社 | 熱伝導性硬化物及びその製造方法 |
| WO2010010841A1 (ja) * | 2008-07-22 | 2010-01-28 | 電気化学工業株式会社 | 樹脂組成物 |
-
2009
- 2009-12-01 WO PCT/US2009/066204 patent/WO2010104534A1/en not_active Ceased
- 2009-12-01 JP JP2011554032A patent/JP5640021B2/ja not_active Expired - Fee Related
- 2009-12-01 KR KR1020117023991A patent/KR20110133608A/ko not_active Withdrawn
- 2009-12-01 US US13/144,096 patent/US8440312B2/en not_active Expired - Fee Related
- 2009-12-01 EP EP09768271A patent/EP2406321A1/en not_active Withdrawn
- 2009-12-01 CN CN200980157904.2A patent/CN102341459B/zh not_active Expired - Fee Related
- 2009-12-11 TW TW98142597A patent/TW201035247A/zh unknown
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