JP2012520375A5 - - Google Patents
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- Publication number
- JP2012520375A5 JP2012520375A5 JP2011554032A JP2011554032A JP2012520375A5 JP 2012520375 A5 JP2012520375 A5 JP 2012520375A5 JP 2011554032 A JP2011554032 A JP 2011554032A JP 2011554032 A JP2011554032 A JP 2011554032A JP 2012520375 A5 JP2012520375 A5 JP 2012520375A5
- Authority
- JP
- Japan
- Prior art keywords
- composition
- ethylhexyl
- bis
- heat source
- interface material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- CDWUGUNUUPYAFB-UHFFFAOYSA-N CC(C1)(C1(C)C(CNC)=O)C=[IH] Chemical compound CC(C1)(C1(C)C(CNC)=O)C=[IH] CDWUGUNUUPYAFB-UHFFFAOYSA-N 0.000 description 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US15956909P | 2009-03-12 | 2009-03-12 | |
| US61/159,569 | 2009-03-12 | ||
| PCT/US2009/066204 WO2010104534A1 (en) | 2009-03-12 | 2009-12-01 | Thermal interface materials and mehtods for their preparation and use |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2012520375A JP2012520375A (ja) | 2012-09-06 |
| JP2012520375A5 true JP2012520375A5 (enExample) | 2012-10-18 |
| JP5640021B2 JP5640021B2 (ja) | 2014-12-10 |
Family
ID=41490482
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011554032A Expired - Fee Related JP5640021B2 (ja) | 2009-03-12 | 2009-12-01 | 熱界面材料、並びに、その調製及び使用方法 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US8440312B2 (enExample) |
| EP (1) | EP2406321A1 (enExample) |
| JP (1) | JP5640021B2 (enExample) |
| KR (1) | KR20110133608A (enExample) |
| CN (1) | CN102341459B (enExample) |
| TW (1) | TW201035247A (enExample) |
| WO (1) | WO2010104534A1 (enExample) |
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| US7147367B2 (en) * | 2002-06-11 | 2006-12-12 | Saint-Gobain Performance Plastics Corporation | Thermal interface material with low melting alloy |
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| AU2004278075B2 (en) * | 2003-10-03 | 2008-02-14 | Hempel A/S | A tie-coat composition comprising at least two types of functional polysiloxane compounds and a method for using the same for establishing a coating on a substrate |
| JP4939221B2 (ja) | 2003-10-10 | 2012-05-23 | ダウ・コーニング・コーポレイション | カルビノール官能性シリコーン樹脂を含有するウレタン形成組成物またはウレタン組成物 |
| JP4557136B2 (ja) * | 2004-05-13 | 2010-10-06 | 信越化学工業株式会社 | 熱伝導性シリコーンゴム組成物及び成型品 |
| WO2005121267A1 (en) | 2004-06-11 | 2005-12-22 | Lg Chem. Ltd. | Adhesive sheet comprising hollow parts and method for preparing the same |
| EP1769033A1 (en) | 2004-06-30 | 2007-04-04 | Dow Corning Corporation | Fluorocarbon elastomer silicone vulcanizates |
| DE102004041379A1 (de) | 2004-08-26 | 2006-03-02 | Wacker-Chemie Gmbh | Vernetzbare Siloxan-Harnstoff-Copolymere |
| US7754800B2 (en) * | 2005-04-06 | 2010-07-13 | Dow Corning Europe Sa | Organosiloxane compositions |
| JP5154010B2 (ja) * | 2005-10-27 | 2013-02-27 | モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 | 熱伝導性シリコーンゴム組成物 |
| DE102005057460A1 (de) | 2005-12-01 | 2007-06-06 | Wacker Chemie Ag | Zu hochfesten Elastomeren vernetzbare ionisch und/oder organometallisch funktionalisierte Siliconpolymere |
| DE102005061248B4 (de) | 2005-12-20 | 2007-09-20 | Infineon Technologies Ag | Systemträger mit in Kunststoffmasse einzubettenden Oberflächen, Verfahren zur Herstellung eines Systemträgers und Verwendung einer Schicht als Haftvermittlerschicht |
| WO2007086443A1 (ja) * | 2006-01-26 | 2007-08-02 | Momentive Performance Materials Japan Llc | 放熱材及びそれを用いた半導体装置 |
| US20070228331A1 (en) | 2006-03-28 | 2007-10-04 | Haitko Deborah A | Q silicone-containing composition, optoelectronic encapsulant thereof and device thereof |
| US20080001140A1 (en) | 2006-06-28 | 2008-01-03 | Gelcore Llc | Optoelectronic device |
| US20080160317A1 (en) | 2006-12-29 | 2008-07-03 | Deborah Ann Haitko | Optoelectronic device |
| JP5197631B2 (ja) | 2007-02-20 | 2013-05-15 | ダウ コーニング コーポレーション | 水素結合性ポリオルガノシロキサンベースの充填材処理剤 |
| JP2008239719A (ja) * | 2007-03-26 | 2008-10-09 | Dow Corning Toray Co Ltd | シリコーンエラストマー組成物およびシリコーンエラストマー |
| JP5233325B2 (ja) * | 2008-02-29 | 2013-07-10 | 信越化学工業株式会社 | 熱伝導性硬化物及びその製造方法 |
| EP2305755B1 (en) * | 2008-07-22 | 2014-11-26 | Denki Kagaku Kogyo Kabushiki Kaisha | Resin composition |
-
2009
- 2009-12-01 WO PCT/US2009/066204 patent/WO2010104534A1/en not_active Ceased
- 2009-12-01 US US13/144,096 patent/US8440312B2/en not_active Expired - Fee Related
- 2009-12-01 KR KR1020117023991A patent/KR20110133608A/ko not_active Withdrawn
- 2009-12-01 CN CN200980157904.2A patent/CN102341459B/zh not_active Expired - Fee Related
- 2009-12-01 JP JP2011554032A patent/JP5640021B2/ja not_active Expired - Fee Related
- 2009-12-01 EP EP09768271A patent/EP2406321A1/en not_active Withdrawn
- 2009-12-11 TW TW98142597A patent/TW201035247A/zh unknown
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