JP2012518722A5 - - Google Patents

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Publication number
JP2012518722A5
JP2012518722A5 JP2011551211A JP2011551211A JP2012518722A5 JP 2012518722 A5 JP2012518722 A5 JP 2012518722A5 JP 2011551211 A JP2011551211 A JP 2011551211A JP 2011551211 A JP2011551211 A JP 2011551211A JP 2012518722 A5 JP2012518722 A5 JP 2012518722A5
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JP
Japan
Prior art keywords
impedance matching
matching network
capacitor
radio frequency
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
JP2011551211A
Other languages
English (en)
Japanese (ja)
Other versions
JP2012518722A (ja
Filing date
Publication date
Priority claimed from US12/389,253 external-priority patent/US8540851B2/en
Application filed filed Critical
Publication of JP2012518722A publication Critical patent/JP2012518722A/ja
Publication of JP2012518722A5 publication Critical patent/JP2012518722A5/ja
Abandoned legal-status Critical Current

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JP2011551211A 2009-02-19 2010-02-18 インピーダンス整合回路網による物理的蒸着 Abandoned JP2012518722A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/389,253 2009-02-19
US12/389,253 US8540851B2 (en) 2009-02-19 2009-02-19 Physical vapor deposition with impedance matching network
PCT/US2010/024549 WO2010096533A1 (en) 2009-02-19 2010-02-18 Physical vapor deposition with impedance matching network

Publications (2)

Publication Number Publication Date
JP2012518722A JP2012518722A (ja) 2012-08-16
JP2012518722A5 true JP2012518722A5 (enExample) 2013-03-28

Family

ID=42558973

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011551211A Abandoned JP2012518722A (ja) 2009-02-19 2010-02-18 インピーダンス整合回路網による物理的蒸着

Country Status (5)

Country Link
US (1) US8540851B2 (enExample)
EP (1) EP2398930B1 (enExample)
JP (1) JP2012518722A (enExample)
KR (1) KR101371003B1 (enExample)
WO (1) WO2010096533A1 (enExample)

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US8557088B2 (en) * 2009-02-19 2013-10-15 Fujifilm Corporation Physical vapor deposition with phase shift
US20100206713A1 (en) * 2009-02-19 2010-08-19 Fujifilm Corporation PZT Depositing Using Vapor Deposition
DE102011086111B4 (de) * 2011-11-10 2016-03-17 Fhr Anlagenbau Gmbh Anordnung zur Einspeisung von HF-Strom für Rohrkathoden
US20130284589A1 (en) * 2012-04-30 2013-10-31 Youming Li Radio frequency tuned substrate biased physical vapor deposition apparatus and method of operation
KR102222902B1 (ko) 2014-05-12 2021-03-05 삼성전자주식회사 플라즈마 장비 및 이를 이용한 반도체 소자의 제조 방법
JP6900469B2 (ja) * 2017-05-09 2021-07-07 富士フイルム株式会社 成膜装置および圧電膜の成膜方法
US12209302B2 (en) 2018-12-19 2025-01-28 Evatec Ag Vacuum system and method to deposit a compound layer
CN112853286A (zh) 2019-11-12 2021-05-28 应用材料公司 压电膜的物理气相沉积
WO2021148195A1 (en) * 2020-01-24 2021-07-29 Evatec Ag Phase shift controlled sputter system and process
WO2023286289A1 (ja) * 2021-07-16 2023-01-19 株式会社アルバック 成膜方法及び成膜装置
JP7036999B1 (ja) * 2021-07-16 2022-03-15 株式会社アルバック 成膜方法及び成膜装置

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