JP2012176449A5 - - Google Patents

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Publication number
JP2012176449A5
JP2012176449A5 JP2011039586A JP2011039586A JP2012176449A5 JP 2012176449 A5 JP2012176449 A5 JP 2012176449A5 JP 2011039586 A JP2011039586 A JP 2011039586A JP 2011039586 A JP2011039586 A JP 2011039586A JP 2012176449 A5 JP2012176449 A5 JP 2012176449A5
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JP
Japan
Prior art keywords
polishing
pad
liquid
polishing apparatus
flow path
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JP2011039586A
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English (en)
Japanese (ja)
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JP5628067B2 (ja
JP2012176449A (ja
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Priority claimed from JP2011039586A external-priority patent/JP5628067B2/ja
Priority to JP2011039586A priority Critical patent/JP5628067B2/ja
Application filed filed Critical
Priority to TW101104875A priority patent/TWI476070B/zh
Priority to US13/397,908 priority patent/US9475167B2/en
Priority to KR1020120018406A priority patent/KR101522070B1/ko
Publication of JP2012176449A publication Critical patent/JP2012176449A/ja
Publication of JP2012176449A5 publication Critical patent/JP2012176449A5/ja
Publication of JP5628067B2 publication Critical patent/JP5628067B2/ja
Application granted granted Critical
Priority to KR1020150054196A priority patent/KR101704187B1/ko
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JP2011039586A 2011-02-25 2011-02-25 研磨パッドの温度調整機構を備えた研磨装置 Active JP5628067B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2011039586A JP5628067B2 (ja) 2011-02-25 2011-02-25 研磨パッドの温度調整機構を備えた研磨装置
TW101104875A TWI476070B (zh) 2011-02-25 2012-02-15 具備用於研磨墊之溫度調整器之研磨裝置
US13/397,908 US9475167B2 (en) 2011-02-25 2012-02-16 Polishing apparatus having temperature regulator for polishing pad
KR1020120018406A KR101522070B1 (ko) 2011-02-25 2012-02-23 연마 패드용 온도 조정 기구를 구비한 연마 장치
KR1020150054196A KR101704187B1 (ko) 2011-02-25 2015-04-17 연마 패드용 온도 조정 기구를 구비한 연마 장치와, 패드 접촉 부재의 세정 방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011039586A JP5628067B2 (ja) 2011-02-25 2011-02-25 研磨パッドの温度調整機構を備えた研磨装置

Publications (3)

Publication Number Publication Date
JP2012176449A JP2012176449A (ja) 2012-09-13
JP2012176449A5 true JP2012176449A5 (cg-RX-API-DMAC7.html) 2013-10-24
JP5628067B2 JP5628067B2 (ja) 2014-11-19

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JP2011039586A Active JP5628067B2 (ja) 2011-02-25 2011-02-25 研磨パッドの温度調整機構を備えた研磨装置

Country Status (4)

Country Link
US (1) US9475167B2 (cg-RX-API-DMAC7.html)
JP (1) JP5628067B2 (cg-RX-API-DMAC7.html)
KR (2) KR101522070B1 (cg-RX-API-DMAC7.html)
TW (1) TWI476070B (cg-RX-API-DMAC7.html)

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