JP2012116715A5 - - Google Patents
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- Publication number
- JP2012116715A5 JP2012116715A5 JP2010268924A JP2010268924A JP2012116715A5 JP 2012116715 A5 JP2012116715 A5 JP 2012116715A5 JP 2010268924 A JP2010268924 A JP 2010268924A JP 2010268924 A JP2010268924 A JP 2010268924A JP 2012116715 A5 JP2012116715 A5 JP 2012116715A5
- Authority
- JP
- Japan
- Prior art keywords
- magnesium oxide
- oxide powder
- thermosetting resin
- resin composition
- content
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 239000000395 magnesium oxide Substances 0.000 claims description 180
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims description 180
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 claims description 180
- 239000000843 powder Substances 0.000 claims description 149
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 100
- 229920001187 thermosetting polymer Polymers 0.000 claims description 50
- 239000000377 silicon dioxide Substances 0.000 claims description 47
- 239000011256 inorganic filler Substances 0.000 claims description 43
- 229910003475 inorganic filler Inorganic materials 0.000 claims description 43
- 239000002245 particle Substances 0.000 claims description 42
- 239000011342 resin composition Substances 0.000 claims description 42
- 239000003822 epoxy resin Substances 0.000 claims description 39
- 229920000647 polyepoxide Polymers 0.000 claims description 39
- 238000004519 manufacturing process Methods 0.000 claims description 33
- 229920005989 resin Polymers 0.000 claims description 27
- 239000011347 resin Substances 0.000 claims description 27
- 238000000034 method Methods 0.000 claims description 21
- 239000000178 monomer Substances 0.000 claims description 20
- 239000002994 raw material Substances 0.000 claims description 15
- 239000000203 mixture Substances 0.000 claims description 13
- 238000010304 firing Methods 0.000 claims description 9
- 239000007787 solid Substances 0.000 claims description 9
- 239000007822 coupling agent Substances 0.000 claims description 6
- 239000007788 liquid Substances 0.000 claims description 6
- 238000010438 heat treatment Methods 0.000 claims description 5
- 238000002156 mixing Methods 0.000 claims description 5
- 239000002270 dispersing agent Substances 0.000 claims description 4
- 229910052739 hydrogen Inorganic materials 0.000 claims description 3
- 239000001257 hydrogen Substances 0.000 claims description 3
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 3
- 238000004381 surface treatment Methods 0.000 claims description 3
- 238000001035 drying Methods 0.000 claims 1
- 238000002360 preparation method Methods 0.000 claims 1
- 230000000052 comparative effect Effects 0.000 description 45
- 239000010410 layer Substances 0.000 description 29
- 238000009413 insulation Methods 0.000 description 25
- 239000002966 varnish Substances 0.000 description 21
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 17
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 12
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 10
- 239000003365 glass fiber Substances 0.000 description 9
- 239000000835 fiber Substances 0.000 description 8
- 239000000758 substrate Substances 0.000 description 8
- 239000011889 copper foil Substances 0.000 description 7
- 239000004593 Epoxy Substances 0.000 description 6
- 238000010521 absorption reaction Methods 0.000 description 6
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 6
- 239000003795 chemical substances by application Substances 0.000 description 6
- 238000010292 electrical insulation Methods 0.000 description 6
- 239000006087 Silane Coupling Agent Substances 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 230000003247 decreasing effect Effects 0.000 description 5
- 238000005553 drilling Methods 0.000 description 5
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 5
- 239000000347 magnesium hydroxide Substances 0.000 description 5
- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 5
- 239000004745 nonwoven fabric Substances 0.000 description 5
- -1 polyethylene terephthalate Polymers 0.000 description 5
- 235000010290 biphenyl Nutrition 0.000 description 4
- 239000004305 biphenyl Substances 0.000 description 4
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 4
- 238000001354 calcination Methods 0.000 description 4
- 239000004020 conductor Substances 0.000 description 4
- 239000005350 fused silica glass Substances 0.000 description 4
- 239000013535 sea water Substances 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 239000002759 woven fabric Substances 0.000 description 4
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 3
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 3
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- 239000011888 foil Substances 0.000 description 3
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 239000000523 sample Substances 0.000 description 3
- 239000007921 spray Substances 0.000 description 3
- TWRXJAOTZQYOKJ-UHFFFAOYSA-L Magnesium chloride Chemical compound [Mg+2].[Cl-].[Cl-] TWRXJAOTZQYOKJ-UHFFFAOYSA-L 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- AXCZMVOFGPJBDE-UHFFFAOYSA-L calcium dihydroxide Chemical compound [OH-].[OH-].[Ca+2] AXCZMVOFGPJBDE-UHFFFAOYSA-L 0.000 description 2
- 239000000920 calcium hydroxide Substances 0.000 description 2
- 229910001861 calcium hydroxide Inorganic materials 0.000 description 2
- 238000009429 electrical wiring Methods 0.000 description 2
- 238000011049 filling Methods 0.000 description 2
- 238000001914 filtration Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 230000020169 heat generation Effects 0.000 description 2
- 238000007561 laser diffraction method Methods 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- KQSABULTKYLFEV-UHFFFAOYSA-N naphthalene-1,5-diamine Chemical compound C1=CC=C2C(N)=CC=CC2=C1N KQSABULTKYLFEV-UHFFFAOYSA-N 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 239000011164 primary particle Substances 0.000 description 2
- 238000000790 scattering method Methods 0.000 description 2
- RMAQACBXLXPBSY-UHFFFAOYSA-N silicic acid Chemical compound O[Si](O)(O)O RMAQACBXLXPBSY-UHFFFAOYSA-N 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 2
- YJTKZCDBKVTVBY-UHFFFAOYSA-N 1,3-Diphenylbenzene Chemical group C1=CC=CC=C1C1=CC=CC(C=2C=CC=CC=2)=C1 YJTKZCDBKVTVBY-UHFFFAOYSA-N 0.000 description 1
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 125000006267 biphenyl group Chemical group 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 229910001629 magnesium chloride Inorganic materials 0.000 description 1
- 239000012764 mineral filler Substances 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 125000002270 phosphoric acid ester group Chemical group 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 238000006068 polycondensation reaction Methods 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 238000002230 thermal chemical vapour deposition Methods 0.000 description 1
- 238000007751 thermal spraying Methods 0.000 description 1
- 230000009974 thixotropic effect Effects 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010268924A JP5447355B2 (ja) | 2010-12-02 | 2010-12-02 | 熱硬化性樹脂組成物の製造法、プリプレグおよび積層板の製造法 |
| CN2011100473213A CN102485804A (zh) | 2010-12-02 | 2011-02-23 | 氧化镁粉末的制造方法、热固性树脂组合物的制造方法、预浸料及叠层板的制造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010268924A JP5447355B2 (ja) | 2010-12-02 | 2010-12-02 | 熱硬化性樹脂組成物の製造法、プリプレグおよび積層板の製造法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2012116715A JP2012116715A (ja) | 2012-06-21 |
| JP2012116715A5 true JP2012116715A5 (https=) | 2012-08-23 |
| JP5447355B2 JP5447355B2 (ja) | 2014-03-19 |
Family
ID=46151379
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010268924A Expired - Fee Related JP5447355B2 (ja) | 2010-12-02 | 2010-12-02 | 熱硬化性樹脂組成物の製造法、プリプレグおよび積層板の製造法 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP5447355B2 (https=) |
| CN (1) | CN102485804A (https=) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5972179B2 (ja) * | 2013-01-15 | 2016-08-17 | タテホ化学工業株式会社 | 被覆酸化マグネシウム粉末及びその製造方法 |
| JP6322794B2 (ja) * | 2014-03-12 | 2018-05-16 | 株式会社東芝 | 電気絶縁材料およびモールド電気機器 |
| JP6300020B2 (ja) * | 2014-06-16 | 2018-03-28 | パナソニックＩｐマネジメント株式会社 | プリント配線板用樹脂組成物、プリント配線板用プリプレグ、積層板、金属張積層板、プリント配線板、及び酸化マグネシウム |
| EP3604223B1 (en) * | 2017-03-28 | 2025-10-22 | Ube Material Industries, Ltd. | Coated magnesium oxide particle and method for producing same, and thermally conductive resin composition |
| CN110204858A (zh) * | 2018-02-28 | 2019-09-06 | 中国电力科学研究院有限公司 | 一种耐低温绝缘高导热浸渍材料及其制备方法 |
| TWI896536B (zh) * | 2019-03-29 | 2025-09-11 | 日商達泰豪化學工業股份有限公司 | 球狀氧化鎂、其製造方法、熱傳導性填充材及樹脂組成物 |
| JP7476529B2 (ja) * | 2019-12-09 | 2024-05-01 | 住友ベークライト株式会社 | 樹脂シートおよび金属ベース基板 |
| TWI818368B (zh) * | 2020-12-25 | 2023-10-11 | 日商宇部材料股份有限公司 | 氧化鎂粉末、熱傳導性填料、樹脂組成物以及氧化鎂粉末之製造方法 |
| JP2024069741A (ja) * | 2021-03-30 | 2024-05-22 | Tdk株式会社 | 酸化マグネシウム組成物粉末、樹脂組成物、樹脂組成物シート、積層基板及び反応性樹脂組成物 |
| CN116654960B (zh) * | 2023-06-27 | 2025-09-09 | 江苏联瑞新材料股份有限公司 | 一种包覆球形氧化镁粉末的制备方法 |
| CN117945738B (zh) * | 2024-03-26 | 2024-06-18 | 辽宁嘉顺科技有限公司 | 一种耐高温发热管用导热绝缘氧化镁的制备方法 |
Family Cites Families (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1465880A (en) * | 1974-07-02 | 1977-03-02 | Quigley Co | Manufacture of magnesia |
| JPS61283648A (ja) * | 1985-06-11 | 1986-12-13 | Sumitomo Bakelite Co Ltd | 高熱伝導性エポキシ樹脂成形材料 |
| US4677026A (en) * | 1985-07-17 | 1987-06-30 | Ube Industries, Ltd. | Resin composition for sealing electronic parts, and hydration-resistant magnesia powder and process for preparation thereof |
| JPS62296303A (ja) * | 1986-06-16 | 1987-12-23 | 新日本化学工業株式会社 | 電気絶縁用マグネシア焼結粉体 |
| JPS63315515A (ja) * | 1987-06-19 | 1988-12-23 | Ube Ind Ltd | マグネシア造粒体およびその製造方法 |
| JP2786191B2 (ja) * | 1987-08-14 | 1998-08-13 | 旭硝子株式会社 | 酸化マグネシウム粉末の製造方法 |
| JP2645086B2 (ja) * | 1988-06-23 | 1997-08-25 | 日本化学工業株式会社 | シリカ被覆水酸化マグネシウム及びその製造法 |
| JP2731854B2 (ja) * | 1989-02-10 | 1998-03-25 | 協和化学工業株式会社 | 高耐水和性、高流動性酸化マグネシウムの製造方法 |
| JPH0379666A (ja) * | 1989-08-22 | 1991-04-04 | Showa Denko Kk | ポリアミド系樹脂組成物 |
| CN100343325C (zh) * | 2000-08-18 | 2007-10-17 | 长春人造树脂厂股份有限公司 | 阻燃性环氧树脂组合物、制备方法及其应用 |
| CN1117699C (zh) * | 2000-11-03 | 2003-08-13 | 清华大学 | 一种耐高温氧化镁电热绝缘材料的制备方法 |
| JP4046491B2 (ja) * | 2001-07-24 | 2008-02-13 | タテホ化学工業株式会社 | 複酸化物被覆酸化マグネシウムの製造方法 |
| KR100785197B1 (ko) * | 2003-10-03 | 2007-12-11 | 다테호 가가쿠 고교 가부시키가이샤 | 구상 피복 산화마그네슘 분말 및 그 제조방법 및 분말을포함하는 수지조성물 |
| JP5010112B2 (ja) * | 2004-07-26 | 2012-08-29 | 新神戸電機株式会社 | プリプレグの製造法、積層板およびプリント配線板の製造法 |
| JP2006036868A (ja) * | 2004-07-26 | 2006-02-09 | Shin Kobe Electric Mach Co Ltd | プリプレグ、積層板およびプリント配線板 |
| JP4315895B2 (ja) * | 2004-12-01 | 2009-08-19 | タテホ化学工業株式会社 | リン含有被覆酸化マグネシウム粉末、その製造方法及びその粉末を含む樹脂組成物 |
| JP4273099B2 (ja) * | 2005-07-29 | 2009-06-03 | 黒崎播磨株式会社 | 製鋼用電気炉内張り補修用吹付材およびこれを使用した製鋼用電気炉内張りの吹付け補修方法 |
| JP4793277B2 (ja) * | 2007-02-14 | 2011-10-12 | 新神戸電機株式会社 | エポキシ樹脂ワニスの製造法、プリプレグの製造法、積層板および配線板の製造法 |
| JP5056620B2 (ja) * | 2008-06-30 | 2012-10-24 | 新神戸電機株式会社 | 配線板 |
-
2010
- 2010-12-02 JP JP2010268924A patent/JP5447355B2/ja not_active Expired - Fee Related
-
2011
- 2011-02-23 CN CN2011100473213A patent/CN102485804A/zh active Pending
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