JP4315895B2 - リン含有被覆酸化マグネシウム粉末、その製造方法及びその粉末を含む樹脂組成物 - Google Patents
リン含有被覆酸化マグネシウム粉末、その製造方法及びその粉末を含む樹脂組成物 Download PDFInfo
- Publication number
- JP4315895B2 JP4315895B2 JP2004348464A JP2004348464A JP4315895B2 JP 4315895 B2 JP4315895 B2 JP 4315895B2 JP 2004348464 A JP2004348464 A JP 2004348464A JP 2004348464 A JP2004348464 A JP 2004348464A JP 4315895 B2 JP4315895 B2 JP 4315895B2
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- Japan
- Prior art keywords
- resin
- phosphorus
- phosphate
- oxide powder
- magnesium oxide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000000843 powder Substances 0.000 title claims description 118
- 239000000395 magnesium oxide Substances 0.000 title claims description 113
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 title claims description 113
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 title claims description 113
- 239000011574 phosphorus Substances 0.000 title claims description 48
- 229910052698 phosphorus Inorganic materials 0.000 title claims description 48
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 title claims description 28
- 239000011342 resin composition Substances 0.000 title claims description 20
- 238000004519 manufacturing process Methods 0.000 title claims description 13
- -1 magnesium phosphate compound Chemical class 0.000 claims description 50
- 229920005989 resin Polymers 0.000 claims description 39
- 239000011347 resin Substances 0.000 claims description 39
- 239000011247 coating layer Substances 0.000 claims description 35
- 239000004137 magnesium phosphate Substances 0.000 claims description 26
- 229960002261 magnesium phosphate Drugs 0.000 claims description 26
- 229910000157 magnesium phosphate Inorganic materials 0.000 claims description 26
- 235000010994 magnesium phosphates Nutrition 0.000 claims description 26
- 229910019142 PO4 Inorganic materials 0.000 claims description 22
- 239000010452 phosphate Substances 0.000 claims description 22
- 150000001875 compounds Chemical class 0.000 claims description 17
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 claims description 17
- 239000002253 acid Substances 0.000 claims description 13
- 239000011777 magnesium Substances 0.000 claims description 12
- 238000010304 firing Methods 0.000 claims description 10
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 8
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 claims description 8
- 239000003822 epoxy resin Substances 0.000 claims description 8
- 229920000647 polyepoxide Polymers 0.000 claims description 8
- 230000017525 heat dissipation Effects 0.000 claims description 7
- 230000002378 acidificating effect Effects 0.000 claims description 6
- 229910052782 aluminium Inorganic materials 0.000 claims description 6
- 229910052749 magnesium Inorganic materials 0.000 claims description 6
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 claims description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 5
- GVALZJMUIHGIMD-UHFFFAOYSA-H magnesium phosphate Chemical compound [Mg+2].[Mg+2].[Mg+2].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O GVALZJMUIHGIMD-UHFFFAOYSA-H 0.000 claims description 5
- 239000005011 phenolic resin Substances 0.000 claims description 5
- 229910052710 silicon Inorganic materials 0.000 claims description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 4
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 4
- 229910000147 aluminium phosphate Inorganic materials 0.000 claims description 4
- 125000001117 oleyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])/C([H])=C([H])\C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 claims description 4
- 239000010703 silicon Substances 0.000 claims description 4
- 229920002050 silicone resin Polymers 0.000 claims description 4
- 239000010936 titanium Substances 0.000 claims description 4
- LJKDOMVGKKPJBH-UHFFFAOYSA-N 2-ethylhexyl dihydrogen phosphate Chemical compound CCCCC(CC)COP(O)(O)=O LJKDOMVGKKPJBH-UHFFFAOYSA-N 0.000 claims description 3
- 239000004734 Polyphenylene sulfide Substances 0.000 claims description 3
- 238000006243 chemical reaction Methods 0.000 claims description 3
- 229910052742 iron Inorganic materials 0.000 claims description 3
- UHGIMQLJWRAPLT-UHFFFAOYSA-N octadecyl dihydrogen phosphate Chemical compound CCCCCCCCCCCCCCCCCCOP(O)(O)=O UHGIMQLJWRAPLT-UHFFFAOYSA-N 0.000 claims description 3
- 229920000069 polyphenylene sulfide Polymers 0.000 claims description 3
- 229920005992 thermoplastic resin Polymers 0.000 claims description 3
- 229920001187 thermosetting polymer Polymers 0.000 claims description 3
- 229910052719 titanium Inorganic materials 0.000 claims description 3
- 239000004641 Diallyl-phthalate Substances 0.000 claims description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims description 2
- 229920000106 Liquid crystal polymer Polymers 0.000 claims description 2
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 claims description 2
- 229920000877 Melamine resin Polymers 0.000 claims description 2
- 239000004640 Melamine resin Substances 0.000 claims description 2
- 239000004696 Poly ether ether ketone Substances 0.000 claims description 2
- 229930182556 Polyacetal Natural products 0.000 claims description 2
- 239000004962 Polyamide-imide Substances 0.000 claims description 2
- 239000004697 Polyetherimide Substances 0.000 claims description 2
- 229920001807 Urea-formaldehyde Polymers 0.000 claims description 2
- 229920000180 alkyd Polymers 0.000 claims description 2
- QUDWYFHPNIMBFC-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,2-dicarboxylate Chemical compound C=CCOC(=O)C1=CC=CC=C1C(=O)OCC=C QUDWYFHPNIMBFC-UHFFFAOYSA-N 0.000 claims description 2
- FJTUUPVRIANHEX-UHFFFAOYSA-N butan-1-ol;phosphoric acid Chemical compound CCCCO.OP(O)(O)=O FJTUUPVRIANHEX-UHFFFAOYSA-N 0.000 claims description 2
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 claims description 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 claims description 2
- 239000011737 fluorine Substances 0.000 claims description 2
- 229910052731 fluorine Inorganic materials 0.000 claims description 2
- QPPQHRDVPBTVEV-UHFFFAOYSA-N isopropyl dihydrogen phosphate Chemical compound CC(C)OP(O)(O)=O QPPQHRDVPBTVEV-UHFFFAOYSA-N 0.000 claims description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 2
- 229920002492 poly(sulfone) Polymers 0.000 claims description 2
- 229920006122 polyamide resin Polymers 0.000 claims description 2
- 229920002312 polyamide-imide Polymers 0.000 claims description 2
- 229920001230 polyarylate Polymers 0.000 claims description 2
- 229920001707 polybutylene terephthalate Polymers 0.000 claims description 2
- 229920005668 polycarbonate resin Polymers 0.000 claims description 2
- 239000004431 polycarbonate resin Substances 0.000 claims description 2
- 229920001225 polyester resin Polymers 0.000 claims description 2
- 239000004645 polyester resin Substances 0.000 claims description 2
- 229920002530 polyetherether ketone Polymers 0.000 claims description 2
- 229920001601 polyetherimide Polymers 0.000 claims description 2
- 229920006324 polyoxymethylene Polymers 0.000 claims description 2
- 229920005749 polyurethane resin Polymers 0.000 claims description 2
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 claims description 2
- 150000002148 esters Chemical class 0.000 claims 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 48
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 18
- 230000000052 comparative effect Effects 0.000 description 9
- 238000000034 method Methods 0.000 description 9
- 229920002379 silicone rubber Polymers 0.000 description 9
- 238000004381 surface treatment Methods 0.000 description 9
- 238000012360 testing method Methods 0.000 description 9
- 230000015572 biosynthetic process Effects 0.000 description 7
- 239000000945 filler Substances 0.000 description 7
- 239000002245 particle Substances 0.000 description 7
- 239000000377 silicon dioxide Substances 0.000 description 7
- 238000003786 synthesis reaction Methods 0.000 description 7
- 239000004065 semiconductor Substances 0.000 description 6
- 239000004945 silicone rubber Substances 0.000 description 6
- 239000000463 material Substances 0.000 description 5
- 239000000203 mixture Substances 0.000 description 5
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 4
- 229920006351 engineering plastic Polymers 0.000 description 4
- 238000011049 filling Methods 0.000 description 4
- 229910052839 forsterite Inorganic materials 0.000 description 4
- HCWCAKKEBCNQJP-UHFFFAOYSA-N magnesium orthosilicate Chemical compound [Mg+2].[Mg+2].[O-][Si]([O-])([O-])[O-] HCWCAKKEBCNQJP-UHFFFAOYSA-N 0.000 description 4
- 238000002844 melting Methods 0.000 description 4
- 230000008018 melting Effects 0.000 description 4
- 239000004944 Liquid Silicone Rubber Substances 0.000 description 3
- 229910004283 SiO 4 Inorganic materials 0.000 description 3
- 239000013078 crystal Substances 0.000 description 3
- 238000005538 encapsulation Methods 0.000 description 3
- 239000010410 layer Substances 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 229920003986 novolac Polymers 0.000 description 3
- 125000006850 spacer group Chemical group 0.000 description 3
- 229910017976 MgO 4 Inorganic materials 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000011231 conductive filler Substances 0.000 description 2
- 238000004512 die casting Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000001914 filtration Methods 0.000 description 2
- 229910021485 fumed silica Inorganic materials 0.000 description 2
- 239000004519 grease Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- QWVGKYWNOKOFNN-UHFFFAOYSA-N o-cresol Chemical compound CC1=CC=CC=C1O QWVGKYWNOKOFNN-UHFFFAOYSA-N 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 150000003017 phosphorus Chemical class 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- LWIHDJKSTIGBAC-UHFFFAOYSA-K tripotassium phosphate Chemical compound [K+].[K+].[K+].[O-]P([O-])([O-])=O LWIHDJKSTIGBAC-UHFFFAOYSA-K 0.000 description 2
- BNGXYYYYKUGPPF-UHFFFAOYSA-M (3-methylphenyl)methyl-triphenylphosphanium;chloride Chemical compound [Cl-].CC1=CC=CC(C[P+](C=2C=CC=CC=2)(C=2C=CC=CC=2)C=2C=CC=CC=2)=C1 BNGXYYYYKUGPPF-UHFFFAOYSA-M 0.000 description 1
- WRIDQFICGBMAFQ-UHFFFAOYSA-N (E)-8-Octadecenoic acid Natural products CCCCCCCCCC=CCCCCCCC(O)=O WRIDQFICGBMAFQ-UHFFFAOYSA-N 0.000 description 1
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- LQJBNNIYVWPHFW-UHFFFAOYSA-N 20:1omega9c fatty acid Natural products CCCCCCCCCCC=CCCCCCCCC(O)=O LQJBNNIYVWPHFW-UHFFFAOYSA-N 0.000 description 1
- QSBYPNXLFMSGKH-UHFFFAOYSA-N 9-Heptadecensaeure Natural products CCCCCCCC=CCCCCCCCC(O)=O QSBYPNXLFMSGKH-UHFFFAOYSA-N 0.000 description 1
- 239000004254 Ammonium phosphate Substances 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- 229910002651 NO3 Inorganic materials 0.000 description 1
- NHNBFGGVMKEFGY-UHFFFAOYSA-N Nitrate Chemical compound [O-][N+]([O-])=O NHNBFGGVMKEFGY-UHFFFAOYSA-N 0.000 description 1
- ZQPPMHVWECSIRJ-UHFFFAOYSA-N Oleic acid Natural products CCCCCCCCC=CCCCCCCCC(O)=O ZQPPMHVWECSIRJ-UHFFFAOYSA-N 0.000 description 1
- 239000005642 Oleic acid Substances 0.000 description 1
- 229910001347 Stellite Inorganic materials 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 description 1
- 238000002441 X-ray diffraction Methods 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 125000003342 alkenyl group Chemical group 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- AZDRQVAHHNSJOQ-UHFFFAOYSA-N alumane Chemical class [AlH3] AZDRQVAHHNSJOQ-UHFFFAOYSA-N 0.000 description 1
- 229910000148 ammonium phosphate Inorganic materials 0.000 description 1
- 235000019289 ammonium phosphates Nutrition 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 239000004841 bisphenol A epoxy resin Substances 0.000 description 1
- 239000004842 bisphenol F epoxy resin Substances 0.000 description 1
- 238000001354 calcination Methods 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 230000001413 cellular effect Effects 0.000 description 1
- AHICWQREWHDHHF-UHFFFAOYSA-N chromium;cobalt;iron;manganese;methane;molybdenum;nickel;silicon;tungsten Chemical compound C.[Si].[Cr].[Mn].[Fe].[Co].[Ni].[Mo].[W] AHICWQREWHDHHF-UHFFFAOYSA-N 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000002485 combustion reaction Methods 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 229910002026 crystalline silica Inorganic materials 0.000 description 1
- 230000018044 dehydration Effects 0.000 description 1
- 238000006297 dehydration reaction Methods 0.000 description 1
- MNNHAPBLZZVQHP-UHFFFAOYSA-N diammonium hydrogen phosphate Chemical compound [NH4+].[NH4+].OP([O-])([O-])=O MNNHAPBLZZVQHP-UHFFFAOYSA-N 0.000 description 1
- RCJVRSBWZCNNQT-UHFFFAOYSA-N dichloridooxygen Chemical compound ClOCl RCJVRSBWZCNNQT-UHFFFAOYSA-N 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 239000005350 fused silica glass Substances 0.000 description 1
- 239000008187 granular material Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 125000000623 heterocyclic group Chemical group 0.000 description 1
- 238000006703 hydration reaction Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 150000002506 iron compounds Chemical class 0.000 description 1
- MVFCKEFYUDZOCX-UHFFFAOYSA-N iron(2+);dinitrate Chemical compound [Fe+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O MVFCKEFYUDZOCX-UHFFFAOYSA-N 0.000 description 1
- QXJSBBXBKPUZAA-UHFFFAOYSA-N isooleic acid Natural products CCCCCCCC=CCCCCCCCCC(O)=O QXJSBBXBKPUZAA-UHFFFAOYSA-N 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- ZQPPMHVWECSIRJ-KTKRTIGZSA-N oleic acid Chemical compound CCCCCCCC\C=C/CCCCCCCC(O)=O ZQPPMHVWECSIRJ-KTKRTIGZSA-N 0.000 description 1
- AFEQENGXSMURHA-UHFFFAOYSA-N oxiran-2-ylmethanamine Chemical compound NCC1CO1 AFEQENGXSMURHA-UHFFFAOYSA-N 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229910000160 potassium phosphate Inorganic materials 0.000 description 1
- 235000011009 potassium phosphates Nutrition 0.000 description 1
- 238000000634 powder X-ray diffraction Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000002250 progressing effect Effects 0.000 description 1
- 229920003987 resole Polymers 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 150000003377 silicon compounds Chemical class 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 229920002545 silicone oil Polymers 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 239000001488 sodium phosphate Substances 0.000 description 1
- 229910000162 sodium phosphate Inorganic materials 0.000 description 1
- 235000011008 sodium phosphates Nutrition 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 229910052596 spinel Inorganic materials 0.000 description 1
- 239000011029 spinel Substances 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000012756 surface treatment agent Substances 0.000 description 1
- 230000002195 synergetic effect Effects 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 150000003609 titanium compounds Chemical class 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- CENHPXAQKISCGD-UHFFFAOYSA-N trioxathietane 4,4-dioxide Chemical compound O=S1(=O)OOO1 CENHPXAQKISCGD-UHFFFAOYSA-N 0.000 description 1
- RYFMWSXOAZQYPI-UHFFFAOYSA-K trisodium phosphate Chemical compound [Na+].[Na+].[Na+].[O-]P([O-])([O-])=O RYFMWSXOAZQYPI-UHFFFAOYSA-K 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 229910000859 α-Fe Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01F—COMPOUNDS OF THE METALS BERYLLIUM, MAGNESIUM, ALUMINIUM, CALCIUM, STRONTIUM, BARIUM, RADIUM, THORIUM, OR OF THE RARE-EARTH METALS
- C01F5/00—Compounds of magnesium
- C01F5/02—Magnesia
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L101/00—Compositions of unspecified macromolecular compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09C—TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS, TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES ; PREPARATION OF CARBON BLACK ; PREPARATION OF INORGANIC MATERIALS WHICH ARE NO SINGLE CHEMICAL COMPOUNDS AND WHICH ARE MAINLY USED AS PIGMENTS OR FILLERS
- C09C1/00—Treatment of specific inorganic materials other than fibrous fillers; Preparation of carbon black
- C09C1/02—Compounds of alkaline earth metals or magnesium
- C09C1/028—Compounds containing only magnesium as metal
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
- H01L23/295—Organic, e.g. plastic containing a filler
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/564—Details not otherwise provided for, e.g. protection against moisture
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
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Description
合成例1
結晶子径が58.3×10−9mの単結晶の集合体であるMgO粉末(タテホ化学工業株式会社製KMAO−H)を、衝撃式粉砕機を用いて、粒径100×10−6m以下に粉砕した。ヒュームドシリカ(純度99.9質量%以上、比表面積200±20m2/g)を、MgOに対して混合比が10質量%になるように湿式添加し、400〜500rpmで10分間撹拌混合した。撹拌混合後、ろ過、脱水して得られたケーキを、乾燥機を用いて、130℃で一晩乾燥した。乾燥したケーキをサンプルミルで解砕して、原料のMgO粉末と同程度の粒径に調整し、シリカを表面に存在させたMgO粉末を得た。この粉末を、LPGと酸素との燃焼により形成された高温火炎中に供給し、溶融・球状化処理を行い、フォルステライト(Mg2SiO4)で被覆された球状被覆MgO粉末を得た。
合成例1において、溶融・球状化処理に代えて、空気中、1400℃で1時間焼成したのち、再度サンプルミルにて解砕して原料のMgO粉末と同程度の粒径に調整し、フォルステライト(Mg2SiO4)で被覆した被覆MgO粉末を得た。
合成例2で調製した粉末をヘンシェルミキサーに入れ、PAPを粉末に対して5質量%添加し、10分間撹拌処理した後、500℃で1時間焼成し、PAP処理した被覆MgO粉末を得た。この粉末のX線回折パターンを粉末X線回折法により測定したところ、リン酸マグネシウム系化合物よりなる被覆層の組成は、Mg2P2O7であった。さらに、下記に示す方法で耐水性試験を実施し、結果を表1に示した。
まず、試料のIg−loss(A)を測定する。次いで、試料5gと水100mlとを入れた密閉容器を、所定温度の乾燥機中に所定時間静置した後、試料のIg−loss(B)を測定する。Ig−lossの増加分(ΔIg−loss=B−A)を算出する。なお、温度及び静置時間は、95℃で120時間とした。
PAPの添加量を種々に変えたことを除いては、実施例1と同様にしてリン含有被覆MgO粉末を調製し、同様の耐水性試験を実施して結果を表1に示した。
PAP添加後の焼成温度を種々に変えたことを除いては、上記実施例1と同様にしてリン含有被覆MgO粉末を調製し、同様の耐水性試験を実施して結果を表1に示した。
合成例1で作製した粉末を使用したことを除いては、実施例1と同様にしてPAP処理した球状被覆MgO粉末を得、同様に耐水性試験を実施して結果を表1に示した。
添加するリン化合物を、2−エチルヘキシルアシッドホスフェート(城北化学工業株式会社製、JP508)、オレイルアシッドホスフェート(城北化学工業株式会社製、JP518O)及びリン酸に変えたことを除いては、実施例1と同様にして被覆MgO粉末を得、同様に耐水性試験を実施して結果を表1に示した。
合成例1で作製した被覆球状MgO粉末を、リン化合物処理をせずにそのまま使用し、実施例1と同様の耐水性試験を行い、結果を表1に示した。
合成例2で作製した被覆MgO粉末を、リン化合物処理をせずにそのまま使用し、実施例1と同様の耐水性試験を行い、結果を表1に示した。
結晶子径が58.3×10−9mの単結晶の集合体であるMgO粉末(タテホ化学工業株式会社製KMAO−H)を、衝撃式粉砕機を用いて、粒径100×10−6m以下に粉砕した。このMgO粉末をヘンシェルミキサーに入れ、PAPを5質量%添加し、10分間撹拌処理した後、500℃で1時間焼成しPAP処理したMgO粉末を得た。上記実施例1と同様にこの粉末の耐水性を評価し、結果を表1に示した。
結晶子径が58.3×10−9mの単結晶集合体であるMgO粉末(タテホ化学工業株式会社製、KMAO−H)を、衝撃式粉砕機を用いて、粒径100×10−6m以下に粉砕した。このMgO粉末をヘンシェルミキサーに入れ、オレイルアシッドホスフェート(城北化学工業株式会社製、JP518O)を1質量%添加し、10分間撹拌混合した後、120℃で乾燥し、オレイルアシッドホスフェート処理したMgO粉末を得た。上記実施例1と同様にこの粉末の耐水性を評価し、結果を表1に示した。
1)本発明のリン酸マグネシウム系化合物で被覆された複酸化物MgO粉末(実施例1〜12)は、リン酸マグネシウム系化合物で被覆されていない複酸化物MgO粉末(比較例2,3)と比べて、耐水性に優れており、95℃×120時間の過酷な環境における耐水性も大幅に向上する。
Claims (13)
- 表面に複酸化物よりなる被覆層を有する被覆酸化マグネシウム粉末の、前記表面の少なくとも一部に、リン酸マグネシウム系化合物よりなる被覆層をさらに有し、かつ、前記被覆酸化マグネシウム粉末に対する前記リン酸マグネシウム系化合物の含有量が、リンに換算して全体の0.1〜10質量%であることを特徴とする、リン含有被覆酸化マグネシウム粉末。
- 前記リン酸マグネシウム系化合物が、MgxPyOz(x=1〜3、y=2、z=6〜8)で示される、請求項1記載のリン含有被覆酸化マグネシウム粉末。
- 前記複酸化物が、アルミニウム、鉄、ケイ素及びチタンからなる群から選択される1以上の元素とマグネシウムとを含む、請求項1又は2記載のリン含有被覆酸化マグネシウム粉末。
- 請求項1〜3のいずれか1項記載のリン含有被覆酸化マグネシウム粉末を樹脂に含有させてなる樹脂組成物。
- 前記樹脂が熱硬化性樹脂である、請求項4記載の樹脂組成物。
- 前記熱硬化性樹脂が、フェノール樹脂、尿素樹脂、メラミン樹脂、アルキド樹脂、ポリエステル樹脂、エポキシ樹脂、ジアリルフタレート樹脂、ポリウレタン樹脂、又はシリコーン樹脂である、請求項5記載の樹脂組成物。
- 前記樹脂が熱可塑性樹脂である、請求項4記載の樹脂組成物。
- 前記熱可塑性樹脂が、ポリアミド樹脂、ポリアセタール樹脂、ポリカーボネート樹脂、ポリブチレンテレフタレート樹脂、ポリスルフォン樹脂、ポリアミドイミド樹脂、ポリエーテルイミド樹脂、ポリアリレート樹脂、ポリフェニレンスルフィド樹脂、ポリエーテルエーテルケトン樹脂、フッ素樹脂又は液晶ポリマーである、請求項7記載の樹脂組成物。
- 請求項4〜8のいずれか1項記載の樹脂組成物を用いた放熱部材。
- 表面に複酸化物の被覆層を有する被覆酸化マグネシウム粉末を、リン化合物で処理したのち、300℃以上で焼成することにより、前記被覆酸化マグネシウム粉末表面の少なくとも一部にリン酸マグネシウム系化合物を形成することを特徴とする、リン含有被覆酸化マグネシウム粉末の製造方法。
- 前記リン化合物が、リン酸、リン酸塩及び酸性リン酸エステルからなる群から選択される1種以上の化合物である、請求項10記載の製造方法。
- 前記酸性リン酸エステルが、イソプロピルアシッドホスフェート、2−エチルヘキシルアシッドホスフェート、オレイルアシッドホスフェート、メチルアシッドホスフェート、エチルアシッドホスフェート、プロピルアシッドホスフェート、ブチルアシッドホスフェート、ラウリルアシッドホスフェート、及びステアリルアシッドホスフェートからなる群から選択される1種以上のエステルである、請求項11記載の製造方法。
- 前記リン化合物を、前記被覆酸化マグネシウム粉末に対する前記リン酸マグネシウム系化合物の含有量がリンに換算して全体の0.1〜10質量%となるように添加した、請求項10〜12のいずれか1項記載の製造方法。
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JP2004348464A JP4315895B2 (ja) | 2004-12-01 | 2004-12-01 | リン含有被覆酸化マグネシウム粉末、その製造方法及びその粉末を含む樹脂組成物 |
TW094140026A TW200621641A (en) | 2004-12-01 | 2005-11-15 | Magnesium oxide powder coating phosphorus-containing, fabricating method thereof and resin composition containing thereof |
PCT/JP2005/022051 WO2006059666A1 (ja) | 2004-12-01 | 2005-12-01 | リン含有被覆酸化マグネシウム粉末、その製造方法及びその粉末を含む樹脂組成物 |
KR1020067015533A KR100799042B1 (ko) | 2004-12-01 | 2005-12-01 | 인 함유 피복 산화마그네슘 분말, 그 제조방법 및 그분말을 포함하는 수지 조성물 |
EP05811536A EP1818311A4 (en) | 2004-12-01 | 2005-12-01 | PHOSPHORUS-COATED MAGNESIUM OXIDE POWDER, ASSOCIATED PREPARATION METHOD AND RESIN COMPOSITION THEREOF |
CNB200580007368XA CN100509630C (zh) | 2004-12-01 | 2005-12-01 | 含磷包覆氧化镁粉末、其制造方法以及含该粉末的树脂组合物 |
US10/597,007 US7393885B2 (en) | 2004-12-01 | 2005-12-01 | Phosphorus-containing coated magnesium oxide powder, method for producing same, and resin composition containing such powder |
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JP5032813B2 (ja) * | 2006-09-25 | 2012-09-26 | タテホ化学工業株式会社 | 被覆酸化マグネシウム粉末、その製造方法及びそれを含む樹脂組成物 |
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JP5972179B2 (ja) * | 2013-01-15 | 2016-08-17 | タテホ化学工業株式会社 | 被覆酸化マグネシウム粉末及びその製造方法 |
KR101933142B1 (ko) | 2014-02-14 | 2018-12-27 | 우베 마테리알즈 가부시키가이샤 | 산화마그네슘, 열전도성 필러 및 이것을 포함하는 열전도성 수지 조성물 그리고 산화마그네슘의 제조 방법 |
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WO2001010958A1 (fr) * | 1999-08-06 | 2001-02-15 | Kyowa Chemical Industry Co., Ltd. | Particules d'oxyde de magnesium hautement resistantes a l'acide et a l'hydratation et compositions de resine |
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TW200621641A (en) | 2006-07-01 |
CN1930084A (zh) | 2007-03-14 |
US20070184269A1 (en) | 2007-08-09 |
EP1818311A4 (en) | 2009-07-22 |
KR100799042B1 (ko) | 2008-01-28 |
WO2006059666A1 (ja) | 2006-06-08 |
JP2006151778A (ja) | 2006-06-15 |
CN100509630C (zh) | 2009-07-08 |
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