JP2011046760A5 - - Google Patents
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- Publication number
- JP2011046760A5 JP2011046760A5 JP2009193888A JP2009193888A JP2011046760A5 JP 2011046760 A5 JP2011046760 A5 JP 2011046760A5 JP 2009193888 A JP2009193888 A JP 2009193888A JP 2009193888 A JP2009193888 A JP 2009193888A JP 2011046760 A5 JP2011046760 A5 JP 2011046760A5
- Authority
- JP
- Japan
- Prior art keywords
- magnesium oxide
- oxide powder
- resin composition
- thermosetting resin
- thermal conductivity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000395 magnesium oxide Substances 0.000 claims description 125
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims description 125
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 claims description 125
- 239000000843 powder Substances 0.000 claims description 103
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 92
- 239000000377 silicon dioxide Substances 0.000 claims description 43
- 229920001187 thermosetting polymer Polymers 0.000 claims description 40
- 239000002245 particle Substances 0.000 claims description 39
- 239000011342 resin composition Substances 0.000 claims description 39
- 239000011256 inorganic filler Substances 0.000 claims description 34
- 229910003475 inorganic filler Inorganic materials 0.000 claims description 34
- 239000003822 epoxy resin Substances 0.000 claims description 31
- 229920000647 polyepoxide Polymers 0.000 claims description 31
- 238000000034 method Methods 0.000 claims description 20
- 239000000178 monomer Substances 0.000 claims description 18
- 239000002994 raw material Substances 0.000 claims description 16
- 229920005989 resin Polymers 0.000 claims description 15
- 239000011347 resin Substances 0.000 claims description 15
- 238000004519 manufacturing process Methods 0.000 claims description 14
- 238000010304 firing Methods 0.000 claims description 12
- 239000000203 mixture Substances 0.000 claims description 12
- 239000007787 solid Substances 0.000 claims description 7
- 238000010438 heat treatment Methods 0.000 claims description 5
- 238000004381 surface treatment Methods 0.000 claims description 5
- 229910052739 hydrogen Inorganic materials 0.000 claims description 3
- 239000001257 hydrogen Substances 0.000 claims description 3
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 3
- 238000001035 drying Methods 0.000 claims description 2
- 238000009413 insulation Methods 0.000 description 20
- 230000000052 comparative effect Effects 0.000 description 18
- 239000010410 layer Substances 0.000 description 17
- 239000002966 varnish Substances 0.000 description 13
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 9
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical group C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 8
- 238000010521 absorption reaction Methods 0.000 description 7
- 239000003795 chemical substances by application Substances 0.000 description 6
- 239000011889 copper foil Substances 0.000 description 6
- 239000000835 fiber Substances 0.000 description 6
- 239000004593 Epoxy Substances 0.000 description 5
- 239000003365 glass fiber Substances 0.000 description 5
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 5
- 239000000347 magnesium hydroxide Substances 0.000 description 5
- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 5
- -1 polyethylene terephthalate Polymers 0.000 description 5
- 239000006087 Silane Coupling Agent Substances 0.000 description 4
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 4
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 4
- 230000003247 decreasing effect Effects 0.000 description 4
- 239000005350 fused silica glass Substances 0.000 description 4
- 239000013535 sea water Substances 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 3
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 3
- 235000010290 biphenyl Nutrition 0.000 description 3
- 239000004305 biphenyl Substances 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000011888 foil Substances 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 3
- 230000020169 heat generation Effects 0.000 description 3
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 239000004745 nonwoven fabric Substances 0.000 description 3
- 239000000523 sample Substances 0.000 description 3
- 239000002759 woven fabric Substances 0.000 description 3
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- 238000001354 calcination Methods 0.000 description 2
- AXCZMVOFGPJBDE-UHFFFAOYSA-L calcium dihydroxide Chemical compound [OH-].[OH-].[Ca+2] AXCZMVOFGPJBDE-UHFFFAOYSA-L 0.000 description 2
- 239000000920 calcium hydroxide Substances 0.000 description 2
- 229910001861 calcium hydroxide Inorganic materials 0.000 description 2
- 235000011116 calcium hydroxide Nutrition 0.000 description 2
- 239000012776 electronic material Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000007561 laser diffraction method Methods 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- KQSABULTKYLFEV-UHFFFAOYSA-N naphthalene-1,5-diamine Chemical compound C1=CC=C2C(N)=CC=CC2=C1N KQSABULTKYLFEV-UHFFFAOYSA-N 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 239000011164 primary particle Substances 0.000 description 2
- 238000000790 scattering method Methods 0.000 description 2
- RMAQACBXLXPBSY-UHFFFAOYSA-N silicic acid Chemical compound O[Si](O)(O)O RMAQACBXLXPBSY-UHFFFAOYSA-N 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 2
- YJTKZCDBKVTVBY-UHFFFAOYSA-N 1,3-Diphenylbenzene Chemical group C1=CC=CC=C1C1=CC=CC(C=2C=CC=CC=2)=C1 YJTKZCDBKVTVBY-UHFFFAOYSA-N 0.000 description 1
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- 0 CCC(C)(CC(*)COc(c(*)c1)c(*)cc1-c1cc(*)c(*C(C)(C)CC2OC2)c(*)c1)Oc(c(*)c1)c(*)cc1-c(cc1*)cc(*)c1OCC1OC1 Chemical compound CCC(C)(CC(*)COc(c(*)c1)c(*)cc1-c1cc(*)c(*C(C)(C)CC2OC2)c(*)c1)Oc(c(*)c1)c(*)cc1-c(cc1*)cc(*)c1OCC1OC1 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 125000006267 biphenyl group Chemical group 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 210000000744 eyelid Anatomy 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 239000012764 mineral filler Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 150000003014 phosphoric acid esters Chemical class 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 238000006068 polycondensation reaction Methods 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000007751 thermal spraying Methods 0.000 description 1
- 230000009974 thixotropic effect Effects 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009193888A JP5263076B2 (ja) | 2009-08-25 | 2009-08-25 | 酸化マグネシウム粉末の製造法、熱硬化性樹脂組成物、プリプレグおよび積層板の製造法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009193888A JP5263076B2 (ja) | 2009-08-25 | 2009-08-25 | 酸化マグネシウム粉末の製造法、熱硬化性樹脂組成物、プリプレグおよび積層板の製造法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2011046760A JP2011046760A (ja) | 2011-03-10 |
| JP2011046760A5 true JP2011046760A5 (https=) | 2012-08-23 |
| JP5263076B2 JP5263076B2 (ja) | 2013-08-14 |
Family
ID=43833426
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009193888A Expired - Fee Related JP5263076B2 (ja) | 2009-08-25 | 2009-08-25 | 酸化マグネシウム粉末の製造法、熱硬化性樹脂組成物、プリプレグおよび積層板の製造法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5263076B2 (https=) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014119462A1 (ja) * | 2013-01-30 | 2014-08-07 | Dic株式会社 | 熱伝導性フィラー、その製造方法、これを用いる樹脂組成物、その成形体及び高熱伝導材料 |
| CN106029571B (zh) | 2014-02-14 | 2019-02-19 | 宇部材料工业株式会社 | 氧化镁、导热性填料及含有其的导热性树脂组合物以及氧化镁的制造方法 |
| JP6300020B2 (ja) * | 2014-06-16 | 2018-03-28 | パナソニックＩｐマネジメント株式会社 | プリント配線板用樹脂組成物、プリント配線板用プリプレグ、積層板、金属張積層板、プリント配線板、及び酸化マグネシウム |
| CN117945738B (zh) * | 2024-03-26 | 2024-06-18 | 辽宁嘉顺科技有限公司 | 一种耐高温发热管用导热绝缘氧化镁的制备方法 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61283648A (ja) * | 1985-06-11 | 1986-12-13 | Sumitomo Bakelite Co Ltd | 高熱伝導性エポキシ樹脂成形材料 |
| JP2731854B2 (ja) * | 1989-02-10 | 1998-03-25 | 協和化学工業株式会社 | 高耐水和性、高流動性酸化マグネシウムの製造方法 |
| JP4046491B2 (ja) * | 2001-07-24 | 2008-02-13 | タテホ化学工業株式会社 | 複酸化物被覆酸化マグネシウムの製造方法 |
| JP3850371B2 (ja) * | 2001-12-25 | 2006-11-29 | タテホ化学工業株式会社 | 酸化マグネシウム粉末を含む樹脂組成物 |
| JP5549061B2 (ja) * | 2007-12-27 | 2014-07-16 | ダイソー株式会社 | 熱硬化性樹脂組成物 |
-
2009
- 2009-08-25 JP JP2009193888A patent/JP5263076B2/ja not_active Expired - Fee Related
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