JP2012109621A - 電子部品内装型プリント基板 - Google Patents
電子部品内装型プリント基板 Download PDFInfo
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- JP2012109621A JP2012109621A JP2012047565A JP2012047565A JP2012109621A JP 2012109621 A JP2012109621 A JP 2012109621A JP 2012047565 A JP2012047565 A JP 2012047565A JP 2012047565 A JP2012047565 A JP 2012047565A JP 2012109621 A JP2012109621 A JP 2012109621A
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- electronic component
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
- H01L24/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
- H01L24/24—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of an individual high density interconnect connector
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
- H01L2224/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
- H01L2224/24—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of an individual high density interconnect connector
- H01L2224/241—Disposition
- H01L2224/24151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/24221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/24225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/24227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the HDI interconnect not connecting to the same level of the item at which the semiconductor or solid-state body is mounted, e.g. the semiconductor or solid-state body being mounted in a cavity or on a protrusion of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01013—Aluminum [Al]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01047—Silver [Ag]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12042—LASER
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0147—Carriers and holders
- H05K2203/0156—Temporary polymeric carrier or foil, e.g. for processing or transferring
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/007—Manufacture or processing of a substrate for a printed circuit board supported by a temporary or sacrificial carrier
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49139—Assembling to base an electrical component, e.g., capacitor, etc. by inserting component lead or terminal into base aperture
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49146—Assembling to base an electrical component, e.g., capacitor, etc. with encapsulating, e.g., potting, etc.
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
【解決手段】空洞115が厚さ方向に形成されたベース基板110;活性面123がベース基板110の一面と一致するように空洞115内に配置された電子部品120;ベース基板110の他面全体に積層されて電子部品120を埋め込むRCC(Resin Coated Copper Foil)またはプリプレグ(prepreg)絶縁材130;及びベース基板110の一面に形成されて電子部品120の接続端子125と接続する接続パターン145を含む第1回路層140;を含んでなる。電子部品120の活性面123をベース基板110の一面に一致させて配置することにより、別のビアホール加工が不要であり、多大な費用が消耗されるレーザー工程を省略することができるとともに、製造工程を簡素化することができ、製造費用を節減することができる。
【選択図】図2
Description
110 ベース基板
111 絶縁素材
113、113a 銅箔
115 空洞
120 電子部品
123 活性面
125 接続端子
127 パッシベーション層
130 絶縁材
135 銅箔
140 第1回路層
141 メッキ層
145 接続パターン
150 第2回路層
160 ビア
170 ビルドアップ層
180 支持テープ
190 支持基板
210 ソルダレジスト層
Claims (8)
- 空洞が厚さ方向に形成されたベース基板;
活性面が前記ベース基板の一面と一致するように前記空洞内に配置された電子部品;
前記ベース基板の他面全体に積層されて前記電子部品を埋め込むRCC(Resin Coated Copper Foil)またはプリプレグ(prepreg)絶縁材;及び
前記ベース基板の一面に形成されて前記電子部品の接続端子と接続する接続パターンを含む第1回路層;
を含むことを特徴とする電子部品内装型プリント基板。 - 前記絶縁材の他面に形成された第2回路層をさらに含むことを特徴とする請求項1に記載の電子部品内装型プリント基板。
- 前記第1回路層と前記第2回路層を連結するように、前記ベース基板と前記絶縁材を貫いて形成されたビアをさらに含むことを特徴とする請求項2に記載の電子部品内装型プリント基板。
- 前記ベース基板の一面または前記絶縁材の他面に積層されたビルドアップ層をさらに含むことを特徴とする請求項1に記載の電子部品内装型プリント基板。
- 前記ベース基板が、アンクラッド銅張積層板(unclad CCL)またはエポキシ系樹脂でなることを特徴とする請求項1に記載の電子部品内装型プリント基板。
- 前記ベース基板が、前記第1回路層に対応するように、パターニングされた銅箔が一面に形成されたことを特徴とする請求項1に記載の電子部品内装型プリント基板。
- 前記電子部品の活性面が、前記電子部品の接続端子の露出面であることを特徴とする請求項1に記載の電子部品内装型プリント基板。
- 前記電子部品の活性面が、パッシベーション層の露出面であり、前記電子部品の接続端子が、前記パッシベーション層に埋め込まれたことを特徴とする請求項1に記載の電子部品内装型プリント基板。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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KR1020090117807A KR101095130B1 (ko) | 2009-12-01 | 2009-12-01 | 전자부품 내장형 인쇄회로기판 및 그 제조방법 |
KR10-2009-0117807 | 2009-12-01 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2010009968A Division JP2011119628A (ja) | 2009-12-01 | 2010-01-20 | 電子部品内装型プリント基板及びその製造方法 |
Publications (1)
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JP2012109621A true JP2012109621A (ja) | 2012-06-07 |
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Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
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JP2010009968A Pending JP2011119628A (ja) | 2009-12-01 | 2010-01-20 | 電子部品内装型プリント基板及びその製造方法 |
JP2012047567A Pending JP2012134536A (ja) | 2009-12-01 | 2012-03-05 | 電子部品内装型プリント基板の製造方法 |
JP2012047565A Pending JP2012109621A (ja) | 2009-12-01 | 2012-03-05 | 電子部品内装型プリント基板 |
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Application Number | Title | Priority Date | Filing Date |
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JP2010009968A Pending JP2011119628A (ja) | 2009-12-01 | 2010-01-20 | 電子部品内装型プリント基板及びその製造方法 |
JP2012047567A Pending JP2012134536A (ja) | 2009-12-01 | 2012-03-05 | 電子部品内装型プリント基板の製造方法 |
Country Status (3)
Country | Link |
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US (2) | US20110127076A1 (ja) |
JP (3) | JP2011119628A (ja) |
KR (1) | KR101095130B1 (ja) |
Cited By (5)
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WO2013186966A1 (ja) * | 2012-06-14 | 2013-12-19 | パナソニック株式会社 | 複合多層配線基板とその製造方法 |
JP2014027250A (ja) * | 2012-07-26 | 2014-02-06 | Samsung Electro-Mechanics Co Ltd | 積層型コアレス基板及びその製造方法 |
JP2014110423A (ja) * | 2012-12-04 | 2014-06-12 | Samsung Electro-Mechanics Co Ltd | 電子部品組込み基板及びその製造方法 |
JP2016134624A (ja) * | 2015-01-22 | 2016-07-25 | サムソン エレクトロ−メカニックス カンパニーリミテッド. | 電子素子内蔵型印刷回路基板及びその製造方法 |
CN110798974A (zh) * | 2018-08-01 | 2020-02-14 | 宏启胜精密电子(秦皇岛)有限公司 | 埋嵌式基板及其制作方法,及具有该埋嵌式基板的电路板 |
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KR101148601B1 (ko) * | 2010-07-05 | 2012-05-25 | 삼성전기주식회사 | 아이씨 모듈 및 이의 제조 방법과 아이씨 모듈을 이용한 임베디드 인쇄회로기판 및 이의 제조 방법 |
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JP2008193121A (ja) * | 2008-04-24 | 2008-08-21 | Ibiden Co Ltd | 多層プリント配線板及び多層プリント配線板の製造方法 |
JP2009194382A (ja) * | 2008-02-14 | 2009-08-27 | Ibiden Co Ltd | プリント配線板の製造方法 |
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JPS5667987A (en) * | 1979-11-06 | 1981-06-08 | Casio Computer Co Ltd | Method of manufacturing circuit board |
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JP2014027250A (ja) * | 2012-07-26 | 2014-02-06 | Samsung Electro-Mechanics Co Ltd | 積層型コアレス基板及びその製造方法 |
JP2014110423A (ja) * | 2012-12-04 | 2014-06-12 | Samsung Electro-Mechanics Co Ltd | 電子部品組込み基板及びその製造方法 |
JP2016134624A (ja) * | 2015-01-22 | 2016-07-25 | サムソン エレクトロ−メカニックス カンパニーリミテッド. | 電子素子内蔵型印刷回路基板及びその製造方法 |
CN110798974A (zh) * | 2018-08-01 | 2020-02-14 | 宏启胜精密电子(秦皇岛)有限公司 | 埋嵌式基板及其制作方法,及具有该埋嵌式基板的电路板 |
CN110798974B (zh) * | 2018-08-01 | 2021-11-16 | 宏启胜精密电子(秦皇岛)有限公司 | 埋嵌式基板及其制作方法,及具有该埋嵌式基板的电路板 |
Also Published As
Publication number | Publication date |
---|---|
KR20110061221A (ko) | 2011-06-09 |
US20110127076A1 (en) | 2011-06-02 |
JP2011119628A (ja) | 2011-06-16 |
KR101095130B1 (ko) | 2011-12-16 |
US20140298648A1 (en) | 2014-10-09 |
JP2012134536A (ja) | 2012-07-12 |
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