JP2011510139A - 導電性接着剤 - Google Patents

導電性接着剤 Download PDF

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Publication number
JP2011510139A
JP2011510139A JP2010543300A JP2010543300A JP2011510139A JP 2011510139 A JP2011510139 A JP 2011510139A JP 2010543300 A JP2010543300 A JP 2010543300A JP 2010543300 A JP2010543300 A JP 2010543300A JP 2011510139 A JP2011510139 A JP 2011510139A
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JP
Japan
Prior art keywords
conductive adhesive
powder
conductive
substrate
electric circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2010543300A
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English (en)
Japanese (ja)
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JP2011510139A5 (enExample
Inventor
明 稲葉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EIDP Inc
Original Assignee
EI Du Pont de Nemours and Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by EI Du Pont de Nemours and Co filed Critical EI Du Pont de Nemours and Co
Publication of JP2011510139A publication Critical patent/JP2011510139A/ja
Publication of JP2011510139A5 publication Critical patent/JP2011510139A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2483/00—Presence of polysiloxane
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
    • H01L2224/92—Specific sequence of method steps
    • H01L2224/922—Connecting different surfaces of the semiconductor or solid-state body with connectors of different types
    • H01L2224/9222—Sequential connecting processes
    • H01L2224/92242—Sequential connecting processes the first connecting process involving a layer connector
    • H01L2224/92247—Sequential connecting processes the first connecting process involving a layer connector the second connecting process involving a wire connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0162—Silicon containing polymer, e.g. silicone
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2848—Three or more layers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2852—Adhesive compositions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Conductive Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Die Bonding (AREA)
JP2010543300A 2008-01-17 2009-01-19 導電性接着剤 Pending JP2011510139A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12/009,305 US8044330B2 (en) 2008-01-17 2008-01-17 Electrically conductive adhesive
PCT/US2009/031367 WO2009092064A2 (en) 2008-01-17 2009-01-19 Electrically conductive adhesive

Publications (2)

Publication Number Publication Date
JP2011510139A true JP2011510139A (ja) 2011-03-31
JP2011510139A5 JP2011510139A5 (enExample) 2012-02-02

Family

ID=40756861

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010543300A Pending JP2011510139A (ja) 2008-01-17 2009-01-19 導電性接着剤

Country Status (4)

Country Link
US (1) US8044330B2 (enExample)
JP (1) JP2011510139A (enExample)
CN (1) CN101918505B (enExample)
WO (1) WO2009092064A2 (enExample)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014046088A1 (ja) * 2012-09-24 2014-03-27 デクセリアルズ株式会社 異方性導電接着剤及び接続構造体
JP2017530205A (ja) * 2014-07-11 2017-10-12 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニーＥ．Ｉ．Ｄｕ Ｐｏｎｔ Ｄｅ Ｎｅｍｏｕｒｓ Ａｎｄ Ｃｏｍｐａｎｙ 低温硬化してエレクトロニクス用途の熱伝導経路を形成する流動性組成物およびそれに関連する方法
EP3299430A1 (en) 2016-09-23 2018-03-28 Nichia Corporation Electrically conductive adhesive and electrically conductive material
US11542417B2 (en) 2018-10-29 2023-01-03 Namics Corporation Conductive resin composition, conductive adhesive, and semiconductor device
JP7722985B2 (ja) 2021-03-30 2025-08-13 リンテック株式会社 接着ペースト、接着ペーストの使用方法及び半導体装置の製造方法

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009152422A1 (en) * 2008-06-13 2009-12-17 E.I. Du Pont De Nemours And Company Insulating paste for low temperature curing application
EP2431438B1 (en) * 2010-09-20 2012-11-28 Henkel AG & Co. KGaA Electrically conductive adhesives
CN102676096B (zh) * 2012-05-23 2013-08-07 江苏省东泰精细化工有限责任公司 一种含纳米棒状氧化锌的有机硅导电胶的制备方法
CN102732158B (zh) * 2012-06-26 2015-08-19 深圳市瑞丰光电子股份有限公司 一种固晶胶及led封装方法
EP2894641B1 (en) * 2012-09-05 2017-07-26 Hitachi Chemical Company, Ltd. Silver paste composition and semiconductor device using same
CN104854176B (zh) 2012-12-20 2017-06-06 道康宁公司 可固化有机硅组合物、导电有机硅粘合剂、制备及使用它们的方法以及包含它们的电气装置
US9196606B2 (en) * 2013-01-09 2015-11-24 Nthdegree Technologies Worldwide Inc. Bonding transistor wafer to LED wafer to form active LED modules
EP2770018A2 (de) 2013-02-20 2014-08-27 ELG Carbon Fibre International GmbH Kohlenstofffaserhaltige Partikel sowie deren Verwendung und Herstellung
EP2770019B1 (de) * 2013-02-20 2018-07-04 ELG Carbon Fibre International GmbH Kohlenstofffaserhaltige Partikel sowie deren Verwendung und Herstellung
WO2014150302A1 (en) * 2013-03-14 2014-09-25 Dow Corning Corporation Conductive silicone materials and uses
KR102250406B1 (ko) * 2013-03-14 2021-05-12 다우 실리콘즈 코포레이션 경화성 실리콘 조성물, 전기 전도성 실리콘 접착제, 이의 제조 및 사용 방법, 및 이를 포함하는 전기 디바이스
WO2014159792A1 (en) 2013-03-14 2014-10-02 Dow Corning Corporation Curable silicone compositions, electrically conductive silicone adhesives, methods of making and using same, and electrical devices containing same
US9480166B2 (en) * 2013-04-16 2016-10-25 E I Du Pont De Nemours And Company Method of manufacturing non-firing type electrode
TWI480357B (zh) * 2013-12-17 2015-04-11 財團法人工業技術研究院 導電膠組成物與電極的形成方法
US10658554B2 (en) 2014-06-19 2020-05-19 Inkron Oy LED lamp with siloxane particle material
CN104570518A (zh) * 2015-02-06 2015-04-29 京东方科技集团股份有限公司 一种显示装置及其制作方法
WO2017035709A1 (en) 2015-08-28 2017-03-09 E.I. Du Pont De Nemours And Company Coated copper particles and use thereof
CN107922802B (zh) 2015-08-28 2020-09-25 杜邦公司 导电粘合剂
CN107922801B (zh) 2015-08-28 2020-06-19 杜邦公司 导电粘合剂
CN105969296A (zh) * 2016-06-27 2016-09-28 强新正品（苏州）环保材料科技有限公司 导电胶
CN106190010A (zh) * 2016-08-08 2016-12-07 强新正品（苏州）环保材料科技有限公司 导电胶粘剂
JP6607166B2 (ja) * 2016-10-31 2019-11-20 信越化学工業株式会社 熱伝導性シリコーン組成物及び半導体装置
CN106898409A (zh) * 2017-04-21 2017-06-27 广东国利先进复合材料研发有限公司 一种导电板及其制备方法
CN107666729B (zh) * 2017-08-14 2020-11-06 深圳市维特欣达科技有限公司 一种中温固化电热浆的制备方法及中温固化电热浆
CN108022671A (zh) * 2017-11-01 2018-05-11 江苏稳润光电科技有限公司 一种led导电银胶的制作方法
CN110809374A (zh) * 2018-08-06 2020-02-18 相丰科技股份有限公司 一种电路板及其制造方法
CN110129000A (zh) * 2019-06-11 2019-08-16 郝建强 自由基热固化有机硅导电胶
CN110831347A (zh) * 2019-10-23 2020-02-21 深圳市华星光电半导体显示技术有限公司 绑定材料、显示面板及Micro-LED芯片的绑定方法
CN114141403B (zh) * 2021-09-30 2024-09-10 大连海外华昇电子科技有限公司 一种多层陶瓷电容器用银钯浆及其制作工艺和应用

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Publication number Priority date Publication date Assignee Title
JPH0948916A (ja) * 1995-08-04 1997-02-18 Toray Dow Corning Silicone Co Ltd 導電性シリコーンゴム組成物および半導体装置
JPH108006A (ja) * 1996-06-26 1998-01-13 Three Bond Co Ltd 導電性接着剤組成物及び当該組成物で接続した電子部品
JP2000133043A (ja) * 1998-10-22 2000-05-12 Three Bond Co Ltd 接続抵抗値を改善する導電性組成物
JP2003292781A (ja) * 2002-04-03 2003-10-15 Dow Corning Toray Silicone Co Ltd 導電性シリコーンゴム組成物
JP2004091750A (ja) * 2002-09-04 2004-03-25 Shin Etsu Chem Co Ltd 導電性シリコーン粘着剤組成物
JP2004197030A (ja) * 2002-12-20 2004-07-15 Shin Etsu Chem Co Ltd 導電性接着剤
JP2005194372A (ja) * 2004-01-07 2005-07-21 Shin Etsu Polymer Co Ltd シリコーン接着剤

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FR2605326A1 (fr) 1986-10-20 1988-04-22 Rhone Poulenc Multi Tech Composition potentiellement adhesive electriquement conductrice.
FR2606784B1 (fr) 1986-11-14 1989-03-03 Rhone Poulenc Multi Tech Composition potentiellement adhesive electriquement conductrice
JPH0447604A (ja) * 1990-06-15 1992-02-17 Du Pont Japan Ltd 導電性樹脂組成物
US5210941A (en) 1991-07-19 1993-05-18 Poly Circuits, Inc. Method for making circuit board having a metal support
US6521144B2 (en) 2000-01-07 2003-02-18 Matsushita Electric Industrial Co., Ltd. Conductive adhesive and connection structure using the same
EP1615979A1 (en) 2003-04-15 2006-01-18 Koninklijke Philips Electronics N.V. Thermally resistant adhesive
KR100601341B1 (ko) 2004-06-23 2006-07-14 엘에스전선 주식회사 이방 도전성 접착제 및 이를 이용한 접착필름

Patent Citations (7)

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Publication number Priority date Publication date Assignee Title
JPH0948916A (ja) * 1995-08-04 1997-02-18 Toray Dow Corning Silicone Co Ltd 導電性シリコーンゴム組成物および半導体装置
JPH108006A (ja) * 1996-06-26 1998-01-13 Three Bond Co Ltd 導電性接着剤組成物及び当該組成物で接続した電子部品
JP2000133043A (ja) * 1998-10-22 2000-05-12 Three Bond Co Ltd 接続抵抗値を改善する導電性組成物
JP2003292781A (ja) * 2002-04-03 2003-10-15 Dow Corning Toray Silicone Co Ltd 導電性シリコーンゴム組成物
JP2004091750A (ja) * 2002-09-04 2004-03-25 Shin Etsu Chem Co Ltd 導電性シリコーン粘着剤組成物
JP2004197030A (ja) * 2002-12-20 2004-07-15 Shin Etsu Chem Co Ltd 導電性接着剤
JP2005194372A (ja) * 2004-01-07 2005-07-21 Shin Etsu Polymer Co Ltd シリコーン接着剤

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014046088A1 (ja) * 2012-09-24 2014-03-27 デクセリアルズ株式会社 異方性導電接着剤及び接続構造体
JP2014067762A (ja) * 2012-09-24 2014-04-17 Dexerials Corp 異方性導電接着剤
JP2017530205A (ja) * 2014-07-11 2017-10-12 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニーＥ．Ｉ．Ｄｕ Ｐｏｎｔ Ｄｅ Ｎｅｍｏｕｒｓ Ａｎｄ Ｃｏｍｐａｎｙ 低温硬化してエレクトロニクス用途の熱伝導経路を形成する流動性組成物およびそれに関連する方法
EP3299430A1 (en) 2016-09-23 2018-03-28 Nichia Corporation Electrically conductive adhesive and electrically conductive material
US11162004B2 (en) 2016-09-23 2021-11-02 Nichia Corporation Electrically conductive adhesive and electrically conductive material
US11739238B2 (en) 2016-09-23 2023-08-29 Nichia Corporation Electrically conductive adhesive and electrically conductive material
US11542417B2 (en) 2018-10-29 2023-01-03 Namics Corporation Conductive resin composition, conductive adhesive, and semiconductor device
JP7722985B2 (ja) 2021-03-30 2025-08-13 リンテック株式会社 接着ペースト、接着ペーストの使用方法及び半導体装置の製造方法

Also Published As

Publication number Publication date
US20090186219A1 (en) 2009-07-23
WO2009092064A3 (en) 2010-01-28
US8044330B2 (en) 2011-10-25
CN101918505B (zh) 2013-01-02
WO2009092064A2 (en) 2009-07-23
CN101918505A (zh) 2010-12-15

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