CN102732158B - 一种固晶胶及led封装方法 - Google Patents
一种固晶胶及led封装方法 Download PDFInfo
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- CN102732158B CN102732158B CN201210213085.2A CN201210213085A CN102732158B CN 102732158 B CN102732158 B CN 102732158B CN 201210213085 A CN201210213085 A CN 201210213085A CN 102732158 B CN102732158 B CN 102732158B
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- bonding adhesive
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- 239000000853 adhesive Substances 0.000 title claims abstract description 67
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 67
- 238000005538 encapsulation Methods 0.000 title claims abstract description 16
- 238000000034 method Methods 0.000 title claims abstract description 15
- 239000011521 glass Substances 0.000 claims abstract description 30
- 239000000758 substrate Substances 0.000 claims abstract description 22
- 239000000463 material Substances 0.000 claims abstract description 9
- 238000002844 melting Methods 0.000 claims abstract description 7
- 230000008018 melting Effects 0.000 claims abstract description 7
- 238000001816 cooling Methods 0.000 claims description 5
- 238000007639 printing Methods 0.000 claims description 4
- 238000003825 pressing Methods 0.000 claims description 2
- 239000000843 powder Substances 0.000 abstract description 15
- 239000003795 chemical substances by application Substances 0.000 abstract description 14
- 239000006185 dispersion Substances 0.000 abstract description 8
- 239000003063 flame retardant Substances 0.000 abstract description 7
- 239000003960 organic solvent Substances 0.000 abstract description 7
- 238000007711 solidification Methods 0.000 abstract description 5
- 230000008023 solidification Effects 0.000 abstract description 5
- 239000000126 substance Substances 0.000 abstract description 5
- 230000000694 effects Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 239000004020 conductor Substances 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 239000002253 acid Substances 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000008595 infiltration Effects 0.000 description 1
- 238000001764 infiltration Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000002932 luster Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 230000002688 persistence Effects 0.000 description 1
- 230000008635 plant growth Effects 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
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- Led Device Packages (AREA)
Abstract
Description
Claims (5)
Priority Applications (1)
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CN201210213085.2A CN102732158B (zh) | 2012-06-26 | 2012-06-26 | 一种固晶胶及led封装方法 |
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CN201210213085.2A CN102732158B (zh) | 2012-06-26 | 2012-06-26 | 一种固晶胶及led封装方法 |
Publications (2)
Publication Number | Publication Date |
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CN102732158A CN102732158A (zh) | 2012-10-17 |
CN102732158B true CN102732158B (zh) | 2015-08-19 |
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CN201210213085.2A Active CN102732158B (zh) | 2012-06-26 | 2012-06-26 | 一种固晶胶及led封装方法 |
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Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103646925B (zh) * | 2013-11-27 | 2017-01-11 | 芜湖致通汽车电子有限公司 | 一种带玻璃衬底的芯片的安装结构 |
CN105405933B (zh) * | 2014-09-09 | 2018-01-26 | 无锡华润华晶微电子有限公司 | 一种led晶片粘合方法 |
CN106159069A (zh) * | 2015-03-11 | 2016-11-23 | 白庆辉 | 一种led灯珠的全新封装制作工艺 |
CN106328792B (zh) * | 2015-06-24 | 2018-12-21 | 周鸣波 | 一种复合led玻璃基面板的直接封装方法和面板 |
CN106439633B (zh) * | 2016-10-28 | 2019-05-28 | 湖南正海现代实验室设备有限公司 | 一种实验室通风柜oled照明灯 |
CN107195760B (zh) * | 2017-04-26 | 2020-01-17 | 安徽欧瑞特照明有限公司 | 一种led封装工艺 |
CN107230740B (zh) * | 2017-04-26 | 2019-09-03 | 安徽欧瑞特照明有限公司 | 一种led固晶工艺 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101775264A (zh) * | 2009-12-24 | 2010-07-14 | 安徽泽润光电有限公司 | Led固晶胶 |
CN101918505A (zh) * | 2008-01-17 | 2010-12-15 | E.I.内穆尔杜邦公司 | 导电粘合剂 |
CN102504741A (zh) * | 2011-10-26 | 2012-06-20 | 中国电器科学研究院有限公司 | 一种碳纳米管填充型大功率led用高导热导电固晶胶粘剂 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1215007C (zh) * | 2003-07-09 | 2005-08-17 | 中日电热(厦门)有限公司 | 一种玻璃封口材料的制造方法 |
CN101442093A (zh) * | 2008-08-22 | 2009-05-27 | 江苏稳润光电有限公司 | 一种led的封装方法 |
CN101685736B (zh) * | 2008-09-28 | 2011-03-30 | 四川虹欧显示器件有限公司 | 透明介质浆料 |
CN101723586B (zh) * | 2009-11-30 | 2011-08-24 | 浙江大学 | 一种应用于半导体照明的荧光粉/玻璃复合体及其制备方法 |
CN101950600A (zh) * | 2010-09-29 | 2011-01-19 | 彩虹集团公司 | 一种透明介质浆料 |
CN102442781B (zh) * | 2010-09-30 | 2014-07-16 | 惠州晶宝光电科技有限公司 | 一种led封装材料及其制备方法与应用 |
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2012
- 2012-06-26 CN CN201210213085.2A patent/CN102732158B/zh active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101918505A (zh) * | 2008-01-17 | 2010-12-15 | E.I.内穆尔杜邦公司 | 导电粘合剂 |
CN101775264A (zh) * | 2009-12-24 | 2010-07-14 | 安徽泽润光电有限公司 | Led固晶胶 |
CN102504741A (zh) * | 2011-10-26 | 2012-06-20 | 中国电器科学研究院有限公司 | 一种碳纳米管填充型大功率led用高导热导电固晶胶粘剂 |
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CN102732158A (zh) | 2012-10-17 |
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Effective date of registration: 20161123 Address after: Zhejiang city in Yiwu Province Road No. 126 Su Su town Patentee after: Shenzhen Refond Optoelectronics Co.,Ltd. Address before: Shenzhen Nanshan District City, Guangdong province 518000 White Pine Road Baiwang letter Industrial Park two District Sixth. Patentee before: Shenzhen Refond Optoelectronics Co.,Ltd. |
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PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
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Denomination of invention: A solid crystal adhesive and LED packaging method Effective date of registration: 20211206 Granted publication date: 20150819 Pledgee: China Merchants Bank Co.,Ltd. Jinhua Yiwu sub branch Pledgor: Shenzhen Refond Optoelectronics Co.,Ltd. Registration number: Y2021330002449 |
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Date of cancellation: 20230807 Granted publication date: 20150819 Pledgee: China Merchants Bank Co.,Ltd. Jinhua Yiwu sub branch Pledgor: Shenzhen Refond Optoelectronics Co.,Ltd. Registration number: Y2021330002449 |
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PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: A Kind of Solid Crystal Adhesive and LED Packaging Method Effective date of registration: 20230822 Granted publication date: 20150819 Pledgee: Yiwu Branch of China Construction Bank Co.,Ltd. Pledgor: Shenzhen Refond Optoelectronics Co.,Ltd. Registration number: Y2023330001801 |