CN101918505B - 导电粘合剂 - Google Patents

导电粘合剂 Download PDF

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Publication number
CN101918505B
CN101918505B CN200980103163XA CN200980103163A CN101918505B CN 101918505 B CN101918505 B CN 101918505B CN 200980103163X A CN200980103163X A CN 200980103163XA CN 200980103163 A CN200980103163 A CN 200980103163A CN 101918505 B CN101918505 B CN 101918505B
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CN
China
Prior art keywords
electroconductive binder
powder
weight
substrate
conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN200980103163XA
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English (en)
Chinese (zh)
Other versions
CN101918505A (zh
Inventor
稻叶明
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EIDP Inc
Original Assignee
EI Du Pont de Nemours and Co
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Filing date
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Application filed by EI Du Pont de Nemours and Co filed Critical EI Du Pont de Nemours and Co
Publication of CN101918505A publication Critical patent/CN101918505A/zh
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Publication of CN101918505B publication Critical patent/CN101918505B/zh
Expired - Fee Related legal-status Critical Current
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2483/00—Presence of polysiloxane
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
    • H01L2224/92—Specific sequence of method steps
    • H01L2224/922—Connecting different surfaces of the semiconductor or solid-state body with connectors of different types
    • H01L2224/9222—Sequential connecting processes
    • H01L2224/92242—Sequential connecting processes the first connecting process involving a layer connector
    • H01L2224/92247—Sequential connecting processes the first connecting process involving a layer connector the second connecting process involving a wire connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0162—Silicon containing polymer, e.g. silicone
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2848—Three or more layers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2852—Adhesive compositions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Conductive Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Die Bonding (AREA)
CN200980103163XA 2008-01-17 2009-01-19 导电粘合剂 Expired - Fee Related CN101918505B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/009,305 US8044330B2 (en) 2008-01-17 2008-01-17 Electrically conductive adhesive
US12/009,305 2008-01-17
PCT/US2009/031367 WO2009092064A2 (en) 2008-01-17 2009-01-19 Electrically conductive adhesive

Publications (2)

Publication Number Publication Date
CN101918505A CN101918505A (zh) 2010-12-15
CN101918505B true CN101918505B (zh) 2013-01-02

Family

ID=40756861

Family Applications (1)

Application Number Title Priority Date Filing Date
CN200980103163XA Expired - Fee Related CN101918505B (zh) 2008-01-17 2009-01-19 导电粘合剂

Country Status (4)

Country Link
US (1) US8044330B2 (enExample)
JP (1) JP2011510139A (enExample)
CN (1) CN101918505B (enExample)
WO (1) WO2009092064A2 (enExample)

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WO2009152422A1 (en) * 2008-06-13 2009-12-17 E.I. Du Pont De Nemours And Company Insulating paste for low temperature curing application
EP2431438B1 (en) * 2010-09-20 2012-11-28 Henkel AG & Co. KGaA Electrically conductive adhesives
CN102676096B (zh) * 2012-05-23 2013-08-07 江苏省东泰精细化工有限责任公司 一种含纳米棒状氧化锌的有机硅导电胶的制备方法
CN102732158B (zh) * 2012-06-26 2015-08-19 深圳市瑞丰光电子股份有限公司 一种固晶胶及led封装方法
EP2894641B1 (en) * 2012-09-05 2017-07-26 Hitachi Chemical Company, Ltd. Silver paste composition and semiconductor device using same
JP6066643B2 (ja) * 2012-09-24 2017-01-25 デクセリアルズ株式会社 異方性導電接着剤
CN104854176B (zh) 2012-12-20 2017-06-06 道康宁公司 可固化有机硅组合物、导电有机硅粘合剂、制备及使用它们的方法以及包含它们的电气装置
US9196606B2 (en) * 2013-01-09 2015-11-24 Nthdegree Technologies Worldwide Inc. Bonding transistor wafer to LED wafer to form active LED modules
EP2770018A2 (de) 2013-02-20 2014-08-27 ELG Carbon Fibre International GmbH Kohlenstofffaserhaltige Partikel sowie deren Verwendung und Herstellung
EP2770019B1 (de) * 2013-02-20 2018-07-04 ELG Carbon Fibre International GmbH Kohlenstofffaserhaltige Partikel sowie deren Verwendung und Herstellung
WO2014150302A1 (en) * 2013-03-14 2014-09-25 Dow Corning Corporation Conductive silicone materials and uses
KR102250406B1 (ko) * 2013-03-14 2021-05-12 다우 실리콘즈 코포레이션 경화성 실리콘 조성물, 전기 전도성 실리콘 접착제, 이의 제조 및 사용 방법, 및 이를 포함하는 전기 디바이스
WO2014159792A1 (en) 2013-03-14 2014-10-02 Dow Corning Corporation Curable silicone compositions, electrically conductive silicone adhesives, methods of making and using same, and electrical devices containing same
US9480166B2 (en) * 2013-04-16 2016-10-25 E I Du Pont De Nemours And Company Method of manufacturing non-firing type electrode
TWI480357B (zh) * 2013-12-17 2015-04-11 財團法人工業技術研究院 導電膠組成物與電極的形成方法
US10658554B2 (en) 2014-06-19 2020-05-19 Inkron Oy LED lamp with siloxane particle material
JP6595575B2 (ja) * 2014-07-11 2019-10-23 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー 低温硬化してエレクトロニクス用途の熱伝導経路を形成する流動性組成物およびそれに関連する方法
CN104570518A (zh) * 2015-02-06 2015-04-29 京东方科技集团股份有限公司 一种显示装置及其制作方法
WO2017035709A1 (en) 2015-08-28 2017-03-09 E.I. Du Pont De Nemours And Company Coated copper particles and use thereof
CN107922802B (zh) 2015-08-28 2020-09-25 杜邦公司 导电粘合剂
CN107922801B (zh) 2015-08-28 2020-06-19 杜邦公司 导电粘合剂
CN105969296A (zh) * 2016-06-27 2016-09-28 强新正品（苏州）环保材料科技有限公司 导电胶
CN106190010A (zh) * 2016-08-08 2016-12-07 强新正品（苏州）环保材料科技有限公司 导电胶粘剂
JP6870258B2 (ja) 2016-09-23 2021-05-12 日亜化学工業株式会社 導電性接着剤および導電性材料
JP6607166B2 (ja) * 2016-10-31 2019-11-20 信越化学工業株式会社 熱伝導性シリコーン組成物及び半導体装置
CN106898409A (zh) * 2017-04-21 2017-06-27 广东国利先进复合材料研发有限公司 一种导电板及其制备方法
CN107666729B (zh) * 2017-08-14 2020-11-06 深圳市维特欣达科技有限公司 一种中温固化电热浆的制备方法及中温固化电热浆
CN108022671A (zh) * 2017-11-01 2018-05-11 江苏稳润光电科技有限公司 一种led导电银胶的制作方法
CN110809374A (zh) * 2018-08-06 2020-02-18 相丰科技股份有限公司 一种电路板及其制造方法
JP7373208B2 (ja) 2018-10-29 2023-11-02 ナミックス株式会社 導電性樹脂組成物、導電性接着剤、および半導体装置
CN110129000A (zh) * 2019-06-11 2019-08-16 郝建强 自由基热固化有机硅导电胶
CN110831347A (zh) * 2019-10-23 2020-02-21 深圳市华星光电半导体显示技术有限公司 绑定材料、显示面板及Micro-LED芯片的绑定方法
JP7722985B2 (ja) 2021-03-30 2025-08-13 リンテック株式会社 接着ペースト、接着ペーストの使用方法及び半導体装置の製造方法
CN114141403B (zh) * 2021-09-30 2024-09-10 大连海外华昇电子科技有限公司 一种多层陶瓷电容器用银钯浆及其制作工艺和应用

Citations (2)

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US4820446A (en) * 1986-11-14 1989-04-11 Ciba-Geigy Corporation Electrically conductive, potentially adhesive composition
CN1087104A (zh) * 1990-06-15 1994-05-25 E·I·内穆尔杜邦公司 导电粘合剂

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US5210941A (en) 1991-07-19 1993-05-18 Poly Circuits, Inc. Method for making circuit board having a metal support
JP3950490B2 (ja) * 1995-08-04 2007-08-01 東レ・ダウコーニング株式会社 導電性シリコーンゴム組成物および半導体装置
JPH108006A (ja) * 1996-06-26 1998-01-13 Three Bond Co Ltd 導電性接着剤組成物及び当該組成物で接続した電子部品
JP3669180B2 (ja) * 1998-10-22 2005-07-06 株式会社スリーボンド 接続抵抗値を改善する導電性組成物
US6521144B2 (en) 2000-01-07 2003-02-18 Matsushita Electric Industrial Co., Ltd. Conductive adhesive and connection structure using the same
JP3999994B2 (ja) 2002-04-03 2007-10-31 東レ・ダウコーニング株式会社 導電性シリコーンゴム組成物
JP3956121B2 (ja) * 2002-09-04 2007-08-08 信越化学工業株式会社 導電性シリコーン粘着剤組成物
JP3991218B2 (ja) * 2002-12-20 2007-10-17 信越化学工業株式会社 導電性接着剤及びその製造方法
EP1615979A1 (en) 2003-04-15 2006-01-18 Koninklijke Philips Electronics N.V. Thermally resistant adhesive
JP2005194372A (ja) * 2004-01-07 2005-07-21 Shin Etsu Polymer Co Ltd シリコーン接着剤
KR100601341B1 (ko) 2004-06-23 2006-07-14 엘에스전선 주식회사 이방 도전성 접착제 및 이를 이용한 접착필름

Patent Citations (2)

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US4820446A (en) * 1986-11-14 1989-04-11 Ciba-Geigy Corporation Electrically conductive, potentially adhesive composition
CN1087104A (zh) * 1990-06-15 1994-05-25 E·I·内穆尔杜邦公司 导电粘合剂

Also Published As

Publication number Publication date
US20090186219A1 (en) 2009-07-23
JP2011510139A (ja) 2011-03-31
WO2009092064A3 (en) 2010-01-28
US8044330B2 (en) 2011-10-25
WO2009092064A2 (en) 2009-07-23
CN101918505A (zh) 2010-12-15

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