JP2010539293A5 - - Google Patents

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Publication number
JP2010539293A5
JP2010539293A5 JP2010524941A JP2010524941A JP2010539293A5 JP 2010539293 A5 JP2010539293 A5 JP 2010539293A5 JP 2010524941 A JP2010524941 A JP 2010524941A JP 2010524941 A JP2010524941 A JP 2010524941A JP 2010539293 A5 JP2010539293 A5 JP 2010539293A5
Authority
JP
Japan
Prior art keywords
article
adhesive
adhesive composition
maleimide
printed circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2010524941A
Other languages
English (en)
Japanese (ja)
Other versions
JP2010539293A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/US2008/075682 external-priority patent/WO2009035958A2/en
Publication of JP2010539293A publication Critical patent/JP2010539293A/ja
Publication of JP2010539293A5 publication Critical patent/JP2010539293A5/ja
Pending legal-status Critical Current

Links

JP2010524941A 2007-09-13 2008-09-09 低温結合電子接着剤 Pending JP2010539293A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US97211907P 2007-09-13 2007-09-13
PCT/US2008/075682 WO2009035958A2 (en) 2007-09-13 2008-09-09 Low temperature bonding electronic adhesives

Publications (2)

Publication Number Publication Date
JP2010539293A JP2010539293A (ja) 2010-12-16
JP2010539293A5 true JP2010539293A5 (enExample) 2011-10-20

Family

ID=40452790

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010524941A Pending JP2010539293A (ja) 2007-09-13 2008-09-09 低温結合電子接着剤

Country Status (7)

Country Link
US (1) US8308991B2 (enExample)
EP (1) EP2188622A2 (enExample)
JP (1) JP2010539293A (enExample)
KR (1) KR20100075906A (enExample)
CN (1) CN101849179B (enExample)
TW (1) TWI415917B (enExample)
WO (1) WO2009035958A2 (enExample)

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US9056438B2 (en) 2012-05-02 2015-06-16 3M Innovative Properties Company Curable composition, articles comprising the curable composition, and method of making the same
CN104797669B (zh) 2012-11-30 2021-04-27 琳得科株式会社 粘接剂组合物、粘接片和电子设备
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KR101481710B1 (ko) * 2013-08-29 2015-01-21 도레이첨단소재 주식회사 전자부품용 점착 조성물 및 그를 이용한 전자부품용 점착 테이프
JP6293554B2 (ja) * 2014-03-31 2018-03-14 株式会社タムラ製作所 異方性導電性ペーストおよびそれを用いたプリント配線基板の製造方法
EP3187557B1 (en) * 2014-08-29 2023-09-13 Furukawa Electric Co., Ltd. Adhesive film and semiconductor package using adhesive film
CN107109055B (zh) * 2015-01-16 2020-11-24 昭和电工材料株式会社 热固性树脂组合物、层间绝缘用树脂膜、复合膜、印刷布线板及其制造方法
CN109952356A (zh) * 2016-11-10 2019-06-28 京瓷株式会社 半导体粘接用树脂组合物、半导体粘接用片以及使用其的半导体装置
EP3612576A4 (en) 2017-04-21 2020-11-18 Henkel AG & Co. KGaA (METH) ACRYLATE FUNCTIONALIZED POLY (METH) ACRYLATE BLOCK POLYIMIDE BLOCK POLY (METH) ACRYLATE COPOLYMER, MANUFACTURING METHOD AND USES THEREOF
US10633513B2 (en) * 2018-03-26 2020-04-28 Fina Technology, Inc. Curable low sulfur liquid rubber compositions and methods of manufacturing the same
DE102019107633A1 (de) * 2019-03-25 2020-10-29 Sphera Technology Gmbh Mehrkomponentensystem und Verfahren zur Herstellung eines Mehrkomponentensystems
CN113840886B (zh) * 2019-05-22 2023-07-04 3M创新有限公司 包含苯乙烯-异戊二烯嵌段共聚物和烯键式不饱和单体的组合物

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