JP2010539293A5 - - Google Patents

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Publication number
JP2010539293A5
JP2010539293A5 JP2010524941A JP2010524941A JP2010539293A5 JP 2010539293 A5 JP2010539293 A5 JP 2010539293A5 JP 2010524941 A JP2010524941 A JP 2010524941A JP 2010524941 A JP2010524941 A JP 2010524941A JP 2010539293 A5 JP2010539293 A5 JP 2010539293A5
Authority
JP
Japan
Prior art keywords
article
adhesive
adhesive composition
maleimide
printed circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2010524941A
Other languages
English (en)
Other versions
JP2010539293A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/US2008/075682 external-priority patent/WO2009035958A2/en
Publication of JP2010539293A publication Critical patent/JP2010539293A/ja
Publication of JP2010539293A5 publication Critical patent/JP2010539293A5/ja
Pending legal-status Critical Current

Links

Claims (3)

  1. マレイミド末端ポリイミド樹脂と、
    マレイミド末端ポリイミド樹脂と相溶する熱可塑性樹脂と、
    液体ゴムと、
    熱で活性化したフリーラジカル硬化剤と、
    任意に、シランカップリング剤、酸官能性を有するエチレン性不飽和化合物、並びに導電性粒子及び/又はスクリムのうちの1つ以上と、
    の混合物を含む、接着剤組成物。
  2. フレキシブルプリント回路と、前記フレキシブルプリント回路に接着した請求項1に記載の前記接着剤組成物とを備える、電子物品。
  3. 請求項1に記載の接着剤組成物を第1の物品に提供する工程と、
    前記第2の物品を前記第1の物品上の接着剤に接触させて組立体を形成する工程であって、前記第1の物品と前記第2の物品との間に接着剤を有する工程と、
    接着剤を硬化させる工程と、
    を含む、第1の物品を第2の物品に取り付ける方法。
JP2010524941A 2007-09-13 2008-09-09 低温結合電子接着剤 Pending JP2010539293A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US97211907P 2007-09-13 2007-09-13
PCT/US2008/075682 WO2009035958A2 (en) 2007-09-13 2008-09-09 Low temperature bonding electronic adhesives

Publications (2)

Publication Number Publication Date
JP2010539293A JP2010539293A (ja) 2010-12-16
JP2010539293A5 true JP2010539293A5 (ja) 2011-10-20

Family

ID=40452790

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010524941A Pending JP2010539293A (ja) 2007-09-13 2008-09-09 低温結合電子接着剤

Country Status (7)

Country Link
US (1) US8308991B2 (ja)
EP (1) EP2188622A2 (ja)
JP (1) JP2010539293A (ja)
KR (1) KR20100075906A (ja)
CN (1) CN101849179B (ja)
TW (1) TWI415917B (ja)
WO (1) WO2009035958A2 (ja)

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US20110132537A1 (en) * 2009-12-03 2011-06-09 3M Innovative Properties Company Composition, tape, and use thereof
CN102898959B (zh) * 2011-07-25 2016-07-06 汉高股份有限及两合公司 一种可光固化的粘合剂组合物及其用途
US9056438B2 (en) 2012-05-02 2015-06-16 3M Innovative Properties Company Curable composition, articles comprising the curable composition, and method of making the same
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KR101481710B1 (ko) * 2013-08-29 2015-01-21 도레이첨단소재 주식회사 전자부품용 점착 조성물 및 그를 이용한 전자부품용 점착 테이프
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EP3187557B1 (en) * 2014-08-29 2023-09-13 Furukawa Electric Co., Ltd. Adhesive film and semiconductor package using adhesive film
JP6903915B2 (ja) * 2015-01-16 2021-07-14 昭和電工マテリアルズ株式会社 熱硬化性樹脂組成物、層間絶縁用樹脂フィルム、複合フィルム、プリント配線板及びその製造方法
WO2018087858A1 (ja) * 2016-11-10 2018-05-17 京セラ株式会社 半導体接着用樹脂組成物、半導体接着用シート及びそれを用いた半導体装置
MX2019012405A (es) 2017-04-21 2020-01-27 Henkel IP & Holding GmbH Copolimero de bloque de poli (met) acrilato-bloque de poliimida-poli (met) acrilato funcionalizado con (met) acrilato, metodo de preparacion y uso del mismo.
US10633513B2 (en) * 2018-03-26 2020-04-28 Fina Technology, Inc. Curable low sulfur liquid rubber compositions and methods of manufacturing the same
DE102019107633A1 (de) * 2019-03-25 2020-10-29 Sphera Technology Gmbh Mehrkomponentensystem und Verfahren zur Herstellung eines Mehrkomponentensystems

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