JP2010539293A - 低温結合電子接着剤 - Google Patents

低温結合電子接着剤 Download PDF

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Publication number
JP2010539293A
JP2010539293A JP2010524941A JP2010524941A JP2010539293A JP 2010539293 A JP2010539293 A JP 2010539293A JP 2010524941 A JP2010524941 A JP 2010524941A JP 2010524941 A JP2010524941 A JP 2010524941A JP 2010539293 A JP2010539293 A JP 2010539293A
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JP
Japan
Prior art keywords
adhesive
article
adhesive composition
less
maleimide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2010524941A
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English (en)
Japanese (ja)
Other versions
JP2010539293A5 (enExample
Inventor
ジー． ラーソン，エリック
エル．ディー． ゼンナー，ロバート
ティー． マーレイ，キャメロン
ケー． スラ，ラビ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Innovative Properties Co
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3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of JP2010539293A publication Critical patent/JP2010539293A/ja
Publication of JP2010539293A5 publication Critical patent/JP2010539293A5/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J179/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
    • C09J179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C09J179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C08L2666/24—Graft or block copolymers according to groups C08L51/00, C08L53/00 or C08L55/02; Derivatives thereof
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/304—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being heat-activatable, i.e. not tacky at temperatures inferior to 30°C
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K2323/00—Functional layers of liquid crystal optical display excluding electroactive liquid crystal layer characterised by chemical composition
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K2323/00—Functional layers of liquid crystal optical display excluding electroactive liquid crystal layer characterised by chemical composition
    • C09K2323/05—Bonding or intermediate layer characterised by chemical composition, e.g. sealant or spacer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0133—Elastomeric or compliant polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Wire Bonding (AREA)
JP2010524941A 2007-09-13 2008-09-09 低温結合電子接着剤 Pending JP2010539293A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US97211907P 2007-09-13 2007-09-13
PCT/US2008/075682 WO2009035958A2 (en) 2007-09-13 2008-09-09 Low temperature bonding electronic adhesives

Publications (2)

Publication Number Publication Date
JP2010539293A true JP2010539293A (ja) 2010-12-16
JP2010539293A5 JP2010539293A5 (enExample) 2011-10-20

Family

ID=40452790

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010524941A Pending JP2010539293A (ja) 2007-09-13 2008-09-09 低温結合電子接着剤

Country Status (7)

Country Link
US (1) US8308991B2 (enExample)
EP (1) EP2188622A2 (enExample)
JP (1) JP2010539293A (enExample)
KR (1) KR20100075906A (enExample)
CN (1) CN101849179B (enExample)
TW (1) TWI415917B (enExample)
WO (1) WO2009035958A2 (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015193725A (ja) * 2014-03-31 2015-11-05 株式会社タムラ製作所 異方性導電性接着剤およびそれを用いたプリント配線基板
WO2016031553A1 (ja) * 2014-08-29 2016-03-03 古河電気工業株式会社 接着フィルム及び接着フィルムを用いた半導体パッケージ
JP2016135859A (ja) * 2015-01-16 2016-07-28 日立化成株式会社 熱硬化性樹脂組成物、層間絶縁用樹脂フィルム、接着補助層付き層間絶縁用樹脂フィルム、及びプリント配線板

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010088648A2 (en) * 2009-02-02 2010-08-05 Lord Corporation Structural adhesives containing maleimide terminated polyimides
US20110132537A1 (en) * 2009-12-03 2011-06-09 3M Innovative Properties Company Composition, tape, and use thereof
CN102898959B (zh) * 2011-07-25 2016-07-06 汉高股份有限及两合公司 一种可光固化的粘合剂组合物及其用途
US9056438B2 (en) 2012-05-02 2015-06-16 3M Innovative Properties Company Curable composition, articles comprising the curable composition, and method of making the same
EP2927295B1 (en) * 2012-11-30 2018-04-25 LINTEC Corporation Adhesive agent composition, adhesive sheet, and electronic device
KR20140085023A (ko) * 2012-12-27 2014-07-07 삼성전기주식회사 인쇄 회로 기판 및 그 제조 방법
KR101481710B1 (ko) * 2013-08-29 2015-01-21 도레이첨단소재 주식회사 전자부품용 점착 조성물 및 그를 이용한 전자부품용 점착 테이프
EP3540025B1 (en) * 2016-11-10 2023-09-13 Kyocera Corporation Semiconductor-bonding resin composition, semiconductor-bonding sheet, and semiconductor device using semiconductor-bonding sheet
KR102408266B1 (ko) 2017-04-21 2022-06-14 헨켈 아게 운트 코. 카게아아 (메트)아크릴레이트 관능화된 폴리(메트)아크릴레이트-블록-폴리이미드-블록-폴리(메트)아크릴레이트 공중합체, 그의 제조 방법 및 용도
US10633513B2 (en) * 2018-03-26 2020-04-28 Fina Technology, Inc. Curable low sulfur liquid rubber compositions and methods of manufacturing the same
DE102019107633A1 (de) * 2019-03-25 2020-10-29 Sphera Technology Gmbh Mehrkomponentensystem und Verfahren zur Herstellung eines Mehrkomponentensystems
EP3973020B1 (en) * 2019-05-22 2024-01-17 3M Innovative Properties Company Composition comprising styrene isoprene block copolymer and ethylenically unsaturated monomer

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04115407A (ja) * 1990-09-03 1992-04-16 Soken Kagaku Kk 異方導電性接着剤組成物
JPH10147762A (ja) * 1996-11-20 1998-06-02 Sumitomo Bakelite Co Ltd 異方導電性接着剤
JPH10195403A (ja) * 1997-01-13 1998-07-28 Sumitomo Bakelite Co Ltd 異方導電性接着剤
JPH1112555A (ja) * 1997-06-24 1999-01-19 Sumitomo Bakelite Co Ltd 異方導電性接着剤
JPH11100558A (ja) * 1997-09-29 1999-04-13 Sumitomo Bakelite Co Ltd 異方導電性接着剤
JP2000044905A (ja) * 1998-03-18 2000-02-15 Sumitomo Bakelite Co Ltd 異方導電性接着剤及びそれを用いた電子機器
US20040225059A1 (en) * 2003-05-05 2004-11-11 Mizori Farhad G. Imide-extended liquid bismaleimide resin
JP2006045459A (ja) * 2004-08-09 2006-02-16 Hitachi Chem Co Ltd 接着剤組成物、回路接続構造体及び半導体装置
JP2006257208A (ja) * 2005-03-16 2006-09-28 Hitachi Chem Co Ltd 接着剤、回路接続用接着剤、接続体及び半導体装置
WO2007046189A1 (ja) * 2005-10-18 2007-04-26 Hitachi Chemical Company, Ltd. 接着剤組成物、回路接続材料、回路接続部材の接続構造及び半導体装置

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5611917A (en) 1979-07-10 1981-02-05 Mitsui Toatsu Chem Inc Thermosetting resin composition
US4920005A (en) 1985-01-04 1990-04-24 Raychem Corporation Aromatic polymer compositions
JPH05275568A (ja) 1992-01-22 1993-10-22 Hitachi Ltd 多層配線回路板及びその製法
JP3304479B2 (ja) 1993-03-19 2002-07-22 東レ株式会社 Ｔａｂ用接着剤付きテープ
US6034194A (en) 1994-09-02 2000-03-07 Quantum Materials/Dexter Corporation Bismaleimide-divinyl adhesive compositions and uses therefor
US6960636B2 (en) 1994-09-02 2005-11-01 Henkel Corporation Thermosetting resin compositions containing maleimide and/or vinyl compounds
JPH08272744A (ja) 1995-03-30 1996-10-18 Canon Inc 情報処理方法及び装置
US5928767A (en) 1995-06-07 1999-07-27 Dexter Corporation Conductive film composite
JP3363331B2 (ja) 1996-11-14 2003-01-08 住友ベークライト株式会社 異方導電性接着剤
JPH10168413A (ja) 1996-12-16 1998-06-23 Sumitomo Bakelite Co Ltd 異方導電性接着剤
DE69826476T2 (de) * 1997-07-04 2005-01-20 Nippon Zeon Co., Ltd. Klebstoff für halbleiterbauteile
JPH1135903A (ja) 1997-07-14 1999-02-09 Sumitomo Bakelite Co Ltd 異方導電性接着剤
TW459032B (en) * 1998-03-18 2001-10-11 Sumitomo Bakelite Co An anisotropic conductive adhesive and method for preparation thereof and an electronic apparatus using said adhesive
US6133401A (en) 1998-06-29 2000-10-17 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Method to prepare processable polyimides with reactive endgroups using 1,3-bis (3-aminophenoxy) benzene
US6355750B1 (en) * 1998-07-02 2002-03-12 National Starch And Chemical Investment Holding Corporation Dye attach adhesives for use in microelectronic devices
US6265530B1 (en) 1998-07-02 2001-07-24 National Starch And Chemical Investment Holding Corporation Die attach adhesives for use in microelectronic devices
DE10025356A1 (de) * 2000-05-23 2001-11-29 Gewerk Keramchemie Hartgummi-Beschichtungen für den Korrosionsschutz
JP4788036B2 (ja) 2000-11-29 2011-10-05 日立化成工業株式会社 回路接続用フィルム状接着剤、回路端子の接続構造および回路端子の接続方法
JP2002201440A (ja) 2000-12-28 2002-07-19 Hitachi Chem Co Ltd 異方導電性樹脂フィルム状形成物及びそれを用いた回路板の接続方法並びに接続構造体
JP2002285103A (ja) 2001-03-26 2002-10-03 Sumitomo Bakelite Co Ltd 異方導電性接着剤
US6831132B2 (en) 2002-03-28 2004-12-14 Henkel Corporation Film adhesives containing maleimide compounds and methods for use thereof
JP5328006B2 (ja) 2003-05-05 2013-10-30 デジグナー モレキュールズ インコーポレイテッド イミド−リンクしたマレインイミドおよびポリマレインイミド化合物
JP4115407B2 (ja) 2004-03-03 2008-07-09 古河電気工業株式会社 Ｌｅｄ灯具
WO2006110634A2 (en) 2005-04-11 2006-10-19 3M Innovative Properties Company Connection method of a flexible printed circuit board with two printed circuit boards, and electric or electronic component with parts connected by the connection method
US7691475B2 (en) 2006-07-21 2010-04-06 3M Innovative Properties Company Anisotropic conductive adhesives

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04115407A (ja) * 1990-09-03 1992-04-16 Soken Kagaku Kk 異方導電性接着剤組成物
JPH10147762A (ja) * 1996-11-20 1998-06-02 Sumitomo Bakelite Co Ltd 異方導電性接着剤
JPH10195403A (ja) * 1997-01-13 1998-07-28 Sumitomo Bakelite Co Ltd 異方導電性接着剤
JPH1112555A (ja) * 1997-06-24 1999-01-19 Sumitomo Bakelite Co Ltd 異方導電性接着剤
JPH11100558A (ja) * 1997-09-29 1999-04-13 Sumitomo Bakelite Co Ltd 異方導電性接着剤
JP2000044905A (ja) * 1998-03-18 2000-02-15 Sumitomo Bakelite Co Ltd 異方導電性接着剤及びそれを用いた電子機器
US20040225059A1 (en) * 2003-05-05 2004-11-11 Mizori Farhad G. Imide-extended liquid bismaleimide resin
JP2006045459A (ja) * 2004-08-09 2006-02-16 Hitachi Chem Co Ltd 接着剤組成物、回路接続構造体及び半導体装置
JP2006257208A (ja) * 2005-03-16 2006-09-28 Hitachi Chem Co Ltd 接着剤、回路接続用接着剤、接続体及び半導体装置
WO2007046189A1 (ja) * 2005-10-18 2007-04-26 Hitachi Chemical Company, Ltd. 接着剤組成物、回路接続材料、回路接続部材の接続構造及び半導体装置

Cited By (5)

* Cited by examiner, † Cited by third party
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JP2015193725A (ja) * 2014-03-31 2015-11-05 株式会社タムラ製作所 異方性導電性接着剤およびそれを用いたプリント配線基板
WO2016031553A1 (ja) * 2014-08-29 2016-03-03 古河電気工業株式会社 接着フィルム及び接着フィルムを用いた半導体パッケージ
JPWO2016031553A1 (ja) * 2014-08-29 2017-04-27 古河電気工業株式会社 接着フィルム及び接着フィルムを用いた半導体パッケージ
US10115707B2 (en) 2014-08-29 2018-10-30 Furukawa Electric Co., Ltd. Adhesive film and semiconductor package using adhesive film
JP2016135859A (ja) * 2015-01-16 2016-07-28 日立化成株式会社 熱硬化性樹脂組成物、層間絶縁用樹脂フィルム、接着補助層付き層間絶縁用樹脂フィルム、及びプリント配線板

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CN101849179A (zh) 2010-09-29
EP2188622A2 (en) 2010-05-26
US20090087591A1 (en) 2009-04-02
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US8308991B2 (en) 2012-11-13

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