JP2009544768A5 - - Google Patents

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Publication number
JP2009544768A5
JP2009544768A5 JP2009520972A JP2009520972A JP2009544768A5 JP 2009544768 A5 JP2009544768 A5 JP 2009544768A5 JP 2009520972 A JP2009520972 A JP 2009520972A JP 2009520972 A JP2009520972 A JP 2009520972A JP 2009544768 A5 JP2009544768 A5 JP 2009544768A5
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JP
Japan
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article
adhesive
weight
parts
adhesive composition
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Application number
JP2009520972A
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English (en)
Japanese (ja)
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JP2009544768A (ja
JP5437802B2 (ja
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Priority claimed from US11/459,091 external-priority patent/US7691475B2/en
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Publication of JP2009544768A publication Critical patent/JP2009544768A/ja
Publication of JP2009544768A5 publication Critical patent/JP2009544768A5/ja
Application granted granted Critical
Publication of JP5437802B2 publication Critical patent/JP5437802B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2009520972A 2006-07-21 2007-07-18 導電性接着剤組成物及びそれを用いた接着方法 Expired - Fee Related JP5437802B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11/459,091 2006-07-21
US11/459,091 US7691475B2 (en) 2006-07-21 2006-07-21 Anisotropic conductive adhesives
PCT/US2007/073763 WO2008011452A1 (en) 2006-07-21 2007-07-18 Anisotropic conductive adhesive compositions

Publications (3)

Publication Number Publication Date
JP2009544768A JP2009544768A (ja) 2009-12-17
JP2009544768A5 true JP2009544768A5 (enExample) 2013-08-29
JP5437802B2 JP5437802B2 (ja) 2014-03-12

Family

ID=38957105

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009520972A Expired - Fee Related JP5437802B2 (ja) 2006-07-21 2007-07-18 導電性接着剤組成物及びそれを用いた接着方法

Country Status (7)

Country Link
US (1) US7691475B2 (enExample)
EP (1) EP2044165A4 (enExample)
JP (1) JP5437802B2 (enExample)
KR (1) KR101395966B1 (enExample)
CN (1) CN101490198B (enExample)
TW (1) TWI491696B (enExample)
WO (1) WO2008011452A1 (enExample)

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US8518304B1 (en) 2003-03-31 2013-08-27 The Research Foundation Of State University Of New York Nano-structure enhancements for anisotropic conductive material and thermal interposers
WO2008010514A1 (en) * 2006-07-20 2008-01-24 Mitsubishi Gas Chemical Company, Inc. Thermocurable polyimide resin composition
JP2008235556A (ja) * 2007-03-20 2008-10-02 Sumitomo Electric Ind Ltd 配線板モジュール及び該配線板モジュールの製造方法
KR20100075906A (ko) 2007-09-13 2010-07-05 쓰리엠 이노베이티브 프로퍼티즈 컴파니 저온 접합 전자부품용 접착
WO2009117345A2 (en) * 2008-03-17 2009-09-24 Henkel Corporation Adhesive compositions for use in die attach applications
JP2012516914A (ja) * 2009-02-02 2012-07-26 ロード コーポレイション マレイミド末端基を持つポリイミドを含む構造用接着剤
US8698320B2 (en) * 2009-12-07 2014-04-15 Henkel IP & Holding GmbH Curable resin compositions useful as underfill sealants for use with low-k dielectric-containing semiconductor devices
WO2012086588A1 (ja) * 2010-12-20 2012-06-28 セメダイン株式会社 導電性接着剤
CN103370354B (zh) * 2011-03-16 2016-01-20 东丽株式会社 环氧树脂组合物及其制造方法以及使用其的半导体装置
JP2013083958A (ja) * 2011-09-26 2013-05-09 Nippon Steel & Sumikin Chemical Co Ltd 感光性樹脂組成物、それを用いた硬化物及び半導体素子
JP6293554B2 (ja) * 2014-03-31 2018-03-14 株式会社タムラ製作所 異方性導電性ペーストおよびそれを用いたプリント配線基板の製造方法
CN106471077B (zh) * 2014-08-29 2020-02-28 古河电气工业株式会社 粘接膜和使用了粘接膜的半导体封装体
WO2017095884A1 (en) * 2015-12-01 2017-06-08 Materion Corporation Metal-on-ceramic substrates
CN107629734B (zh) * 2016-07-15 2019-10-25 杜邦公司 导电粘合剂
CN108913057B (zh) 2017-03-27 2023-11-10 昆山雅森电子材料科技有限公司 一种多层异向型导电布胶及其制作方法
KR102311179B1 (ko) * 2020-02-26 2021-10-13 한국과학기술원 솔더 도전 입자와 플럭스 첨가제를 함유하는 열압착 접합용 이방성 전도성 접착제 및 이를 이용한 전자부품 간 접속방법
CN116134066A (zh) * 2020-07-21 2023-05-16 京瓷株式会社 导热性粘合用片和半导体装置
KR102464438B1 (ko) * 2020-12-10 2022-11-07 포항공과대학교 산학협력단 연신성 acf, 이의 제조방법, 이를 포함하는 계면 접합 부재 및 소자

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JP2002285103A (ja) 2001-03-26 2002-10-03 Sumitomo Bakelite Co Ltd 異方導電性接着剤
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CN1784457B (zh) * 2003-05-05 2010-07-14 设计者分子公司 二酰亚胺连接的马来酰亚胺和聚马来酰亚胺化合物
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JP4115407B2 (ja) 2004-03-03 2008-07-09 古河電気工業株式会社 Ｌｅｄ灯具

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