WO2008146723A1 - 樹脂組成物、樹脂スペーサ用フィルムおよび半導体装置 - Google Patents

樹脂組成物、樹脂スペーサ用フィルムおよび半導体装置 Download PDF

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Publication number
WO2008146723A1
WO2008146723A1 PCT/JP2008/059507 JP2008059507W WO2008146723A1 WO 2008146723 A1 WO2008146723 A1 WO 2008146723A1 JP 2008059507 W JP2008059507 W JP 2008059507W WO 2008146723 A1 WO2008146723 A1 WO 2008146723A1
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WO
WIPO (PCT)
Prior art keywords
resin
resin composition
spacer film
semiconductor device
filler
Prior art date
Application number
PCT/JP2008/059507
Other languages
English (en)
French (fr)
Inventor
Toyosei Takahashi
Rie Takayama
Original Assignee
Sumitomo Bakelite Company Limited
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Company Limited filed Critical Sumitomo Bakelite Company Limited
Priority to CN200880017238A priority Critical patent/CN101679758A/zh
Priority to US12/601,642 priority patent/US20100164126A1/en
Priority to EP08764553A priority patent/EP2154205A4/en
Publication of WO2008146723A1 publication Critical patent/WO2008146723A1/ja

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0047—Photosensitive materials characterised by additives for obtaining a metallic or ceramic pattern, e.g. by firing
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/295—Organic, e.g. plastic containing a filler
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Ceramic Engineering (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Materials For Photolithography (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Polymerisation Methods In General (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

　本発明の樹脂組成物は、基板と、半導体素子との間に空隙部を形成するための樹脂スペーサとして用いるための樹脂組成物であって、前記樹脂組成物は、アルカリ可溶性樹脂と、光重合性樹脂と、光重合開始剤と、粒子状の充填材とを含み、前記充填材の平均粒径が０．０５～０．３５μｍ以下であり、前記充填材の含有量が１～４０重量％である。また、本発明の樹脂スペーサ用フィルムは、上記に記載の樹脂組成物で構成されている。
PCT/JP2008/059507 2007-05-25 2008-05-23 樹脂組成物、樹脂スペーサ用フィルムおよび半導体装置 WO2008146723A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN200880017238A CN101679758A (zh) 2007-05-25 2008-05-23 树脂组合物、树脂衬热用膜及半导体装置
US12/601,642 US20100164126A1 (en) 2007-05-25 2008-05-23 Resin composition, resin spacer film, and semiconductor device
EP08764553A EP2154205A4 (en) 2007-05-25 2008-05-23 RESIN COMPOSITION, SPACER RESIN FILM, AND SEMICONDUCTOR DEVICE

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2007-139098 2007-05-25
JP2007139098 2007-05-25
JP2007-148177 2007-06-04
JP2007148177 2007-06-04

Publications (1)

Publication Number Publication Date
WO2008146723A1 true WO2008146723A1 (ja) 2008-12-04

Family

ID=40074976

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/059507 WO2008146723A1 (ja) 2007-05-25 2008-05-23 樹脂組成物、樹脂スペーサ用フィルムおよび半導体装置

Country Status (7)

Country Link
US (1) US20100164126A1 (ja)
EP (1) EP2154205A4 (ja)
JP (2) JP4959627B2 (ja)
KR (1) KR20100022019A (ja)
CN (1) CN101679758A (ja)
TW (1) TW200912527A (ja)
WO (1) WO2008146723A1 (ja)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010095593A1 (ja) * 2009-02-23 2010-08-26 住友ベークライト株式会社 半導体ウエハー接合体、半導体ウエハー接合体の製造方法および半導体装置
WO2010103903A1 (ja) * 2009-03-12 2010-09-16 住友ベークライト株式会社 スペーサ形成用フィルム、半導体ウエハーおよび半導体装置
WO2010113759A1 (ja) * 2009-03-31 2010-10-07 住友ベークライト株式会社 樹脂スペーサー用フィルム、受光装置及びその製造方法、並びにｍｅｍｓデバイス及びその製造方法
JP2010258419A (ja) * 2009-03-31 2010-11-11 Sumitomo Bakelite Co Ltd 配線板用樹脂組成物、および配線板用樹脂シート
JP2011013622A (ja) * 2009-07-06 2011-01-20 Hitachi Chem Co Ltd アルカリ現像可能な感光性樹脂組成物及びそれを用いた感光性フィルム
CN102369481A (zh) * 2009-04-14 2012-03-07 住友电木株式会社 感光性树脂组合物、粘合膜及光接收装置
WO2015182581A1 (ja) * 2014-05-29 2015-12-03 アーゼット・エレクトロニック・マテリアルズ（ルクセンブルグ） ソシエテ・ア・レスポンサビリテ・リミテ 空隙形成用組成物、その組成物を用いて形成された空隙を具備した半導体装置、およびその組成物を用いた半導体装置の製造方法

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101978320A (zh) * 2008-03-18 2011-02-16 住友电木株式会社 光敏树脂组合物、用于光敏树脂隔离物的膜和半导体装置
KR101413611B1 (ko) * 2009-04-21 2014-07-01 샌트랄 글래스 컴퍼니 리미티드 탑코트 조성물 및 패턴 형성 방법
JP5600903B2 (ja) * 2009-08-05 2014-10-08 日立化成株式会社 感光性樹脂組成物、並びにこれを用いた感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法
JP5624794B2 (ja) * 2010-04-19 2014-11-12 東京応化工業株式会社 ネガ型感光性樹脂組成物、感光性ドライフィルム、及び受光装置
CN103748516A (zh) * 2011-08-10 2014-04-23 日立化成株式会社 感光性树脂组合物、感光性薄膜、永久抗蚀剂以及永久抗蚀剂的制造方法
JP2013194188A (ja) * 2012-03-22 2013-09-30 Sumitomo Bakelite Co Ltd 透明シート及び電子部品用基板
JP2013178526A (ja) * 2013-04-01 2013-09-09 Hitachi Chemical Co Ltd 中空構造体及びその製造方法
CN106661245B (zh) * 2014-07-28 2020-08-21 住友化学株式会社 膜的制造方法及涂布液的保管方法
US9630835B2 (en) * 2014-08-25 2017-04-25 Texas Instruments Incorporated Wafer level packaging of MEMS
JPWO2016170771A1 (ja) * 2015-04-24 2017-11-30 日本曹達株式会社 有機無機複合体形成用組成物
JP6809461B2 (ja) * 2015-07-29 2021-01-06 昭和電工マテリアルズ株式会社 接着剤組成物、硬化物、半導体装置及びその製造方法
JP7520543B2 (ja) 2020-03-25 2024-07-23 三菱製紙株式会社 感光性樹脂組成物

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Publication number Priority date Publication date Assignee Title
JP2000104034A (ja) * 1998-09-30 2000-04-11 Sumitomo Bakelite Co Ltd 感光性アディティブ接着剤組成物
JP2000136230A (ja) * 1998-08-28 2000-05-16 Nippon Shokubai Co Ltd 感光性樹脂組成物
JP2000319354A (ja) * 1999-05-10 2000-11-21 Jsr Corp 感放射線性樹脂組成物、層間絶縁膜およびスペーサー
JP2003073543A (ja) * 2001-09-03 2003-03-12 Sumitomo Bakelite Co Ltd 樹脂組成物、プリプレグ及びそれを用いたプリント配線板
JP2003297876A (ja) * 2002-03-29 2003-10-17 Sumitomo Bakelite Co Ltd 半導体パッケージの製造方法
JP2006016610A (ja) * 2004-05-31 2006-01-19 Sumitomo Bakelite Co Ltd 樹脂組成物、接着フィルムおよび樹脂ワニス
JP2006323089A (ja) 2005-05-18 2006-11-30 Hitachi Chem Co Ltd 感光性樹脂組成物及びこれを用いた感光性フィルム
JP2007102117A (ja) * 2005-10-07 2007-04-19 Nippon Synthetic Chem Ind Co Ltd:The レーザー用画像形成材、及びパターンめっき用画像形成方法
JP2007139098A (ja) 2005-11-18 2007-06-07 Denso Corp 配管継手
JP2007148177A (ja) 2005-08-12 2007-06-14 Sharp Corp 光源制御装置、照明装置及び液晶表示装置

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JP2005062621A (ja) * 2003-08-18 2005-03-10 Sekisui Chem Co Ltd 光硬化性樹脂組成物、柱状スペーサ及び液晶表示素子

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JP2000104034A (ja) * 1998-09-30 2000-04-11 Sumitomo Bakelite Co Ltd 感光性アディティブ接着剤組成物
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JP2003073543A (ja) * 2001-09-03 2003-03-12 Sumitomo Bakelite Co Ltd 樹脂組成物、プリプレグ及びそれを用いたプリント配線板
JP2003297876A (ja) * 2002-03-29 2003-10-17 Sumitomo Bakelite Co Ltd 半導体パッケージの製造方法
JP2006016610A (ja) * 2004-05-31 2006-01-19 Sumitomo Bakelite Co Ltd 樹脂組成物、接着フィルムおよび樹脂ワニス
JP2006323089A (ja) 2005-05-18 2006-11-30 Hitachi Chem Co Ltd 感光性樹脂組成物及びこれを用いた感光性フィルム
JP2007148177A (ja) 2005-08-12 2007-06-14 Sharp Corp 光源制御装置、照明装置及び液晶表示装置
JP2007102117A (ja) * 2005-10-07 2007-04-19 Nippon Synthetic Chem Ind Co Ltd:The レーザー用画像形成材、及びパターンめっき用画像形成方法
JP2007139098A (ja) 2005-11-18 2007-06-07 Denso Corp 配管継手

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Title
See also references of EP2154205A4

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010095593A1 (ja) * 2009-02-23 2010-08-26 住友ベークライト株式会社 半導体ウエハー接合体、半導体ウエハー接合体の製造方法および半導体装置
CN102326249A (zh) * 2009-02-23 2012-01-18 住友电木株式会社 半导体晶片接合体、半导体晶片接合体的制造方法和半导体装置
WO2010103903A1 (ja) * 2009-03-12 2010-09-16 住友ベークライト株式会社 スペーサ形成用フィルム、半導体ウエハーおよび半導体装置
CN102341908A (zh) * 2009-03-12 2012-02-01 住友电木株式会社 间隔体形成用膜、半导体晶片和半导体装置
WO2010113759A1 (ja) * 2009-03-31 2010-10-07 住友ベークライト株式会社 樹脂スペーサー用フィルム、受光装置及びその製造方法、並びにｍｅｍｓデバイス及びその製造方法
JP2010258419A (ja) * 2009-03-31 2010-11-11 Sumitomo Bakelite Co Ltd 配線板用樹脂組成物、および配線板用樹脂シート
JPWO2010113759A1 (ja) * 2009-03-31 2012-10-11 住友ベークライト株式会社 受光装置の製造方法、及びｍｅｍｓデバイスの製造方法
CN102369481A (zh) * 2009-04-14 2012-03-07 住友电木株式会社 感光性树脂组合物、粘合膜及光接收装置
JP2011013622A (ja) * 2009-07-06 2011-01-20 Hitachi Chem Co Ltd アルカリ現像可能な感光性樹脂組成物及びそれを用いた感光性フィルム
WO2015182581A1 (ja) * 2014-05-29 2015-12-03 アーゼット・エレクトロニック・マテリアルズ（ルクセンブルグ） ソシエテ・ア・レスポンサビリテ・リミテ 空隙形成用組成物、その組成物を用いて形成された空隙を具備した半導体装置、およびその組成物を用いた半導体装置の製造方法
JPWO2015182581A1 (ja) * 2014-05-29 2017-04-20 アーゼッド・エレクトロニック・マテリアルズ（ルクセンブルグ）ソシエテ・ア・レスポンサビリテ・リミテ 空隙形成用組成物、その組成物を用いて形成された空隙を具備した半導体装置、およびその組成物を用いた半導体装置の製造方法
US10435555B2 (en) 2014-05-29 2019-10-08 Az Electronic Materials (Luxembourg) S.A.R.L Void forming composition, semiconductor device provided with voids formed using composition, and method for manufacturing semiconductor device using composition

Also Published As

Publication number Publication date
EP2154205A1 (en) 2010-02-17
JP2009293010A (ja) 2009-12-17
JP2009015309A (ja) 2009-01-22
EP2154205A4 (en) 2011-01-05
JP4959627B2 (ja) 2012-06-27
CN101679758A (zh) 2010-03-24
TW200912527A (en) 2009-03-16
KR20100022019A (ko) 2010-02-26
US20100164126A1 (en) 2010-07-01

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