JP2001323249A5 - - Google Patents
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- Publication number
- JP2001323249A5 JP2001323249A5 JP2000144270A JP2000144270A JP2001323249A5 JP 2001323249 A5 JP2001323249 A5 JP 2001323249A5 JP 2000144270 A JP2000144270 A JP 2000144270A JP 2000144270 A JP2000144270 A JP 2000144270A JP 2001323249 A5 JP2001323249 A5 JP 2001323249A5
- Authority
- JP
- Japan
- Prior art keywords
- adhesive
- circuit connection
- heat
- curing agent
- connection according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000853 adhesive Substances 0.000 claims description 12
- 230000001070 adhesive effect Effects 0.000 claims description 11
- 239000003795 chemical substances by application Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 4
- RWSOTUBLDIXVET-UHFFFAOYSA-N Dihydrogen sulfide Chemical class S RWSOTUBLDIXVET-UHFFFAOYSA-N 0.000 claims description 2
- 239000003822 epoxy resin Substances 0.000 claims description 2
- 229920000647 polyepoxide Polymers 0.000 claims description 2
- 229920000642 polymer Polymers 0.000 claims description 2
- 239000002245 particle Substances 0.000 claims 3
- 238000000113 differential scanning calorimetry Methods 0.000 claims 2
- 230000020169 heat generation Effects 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000144270A JP4433564B2 (ja) | 2000-05-17 | 2000-05-17 | 回路接続用接着剤 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000144270A JP4433564B2 (ja) | 2000-05-17 | 2000-05-17 | 回路接続用接着剤 |
Related Child Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2005238698A Division JP2006028521A (ja) | 2005-08-19 | 2005-08-19 | 回路接続用接着剤 |
| JP2005331857A Division JP4626495B2 (ja) | 2005-11-16 | 2005-11-16 | 回路接続用接着剤 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2001323249A JP2001323249A (ja) | 2001-11-22 |
| JP2001323249A5 true JP2001323249A5 (enExample) | 2005-11-04 |
| JP4433564B2 JP4433564B2 (ja) | 2010-03-17 |
Family
ID=18650948
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000144270A Expired - Fee Related JP4433564B2 (ja) | 2000-05-17 | 2000-05-17 | 回路接続用接着剤 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4433564B2 (enExample) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7604868B2 (en) | 1997-03-31 | 2009-10-20 | Hitachi Chemical Company, Ltd. | Electronic circuit including circuit-connecting material |
| JP2005194413A (ja) * | 2004-01-08 | 2005-07-21 | Hitachi Chem Co Ltd | 回路接続用接着フィルム及び回路接続構造体 |
| JP4970767B2 (ja) * | 2005-10-26 | 2012-07-11 | リンテック株式会社 | 導電接合シート用の絶縁シート、導電接合シート、導電接合シートの製造方法および電子複合部品の製造方法 |
| JP4626495B2 (ja) * | 2005-11-16 | 2011-02-09 | 日立化成工業株式会社 | 回路接続用接着剤 |
| JP4650456B2 (ja) | 2006-08-25 | 2011-03-16 | 日立化成工業株式会社 | 回路接続材料、これを用いた回路部材の接続構造及びその製造方法 |
| CN105826418B (zh) | 2007-05-09 | 2017-05-17 | 日立化成株式会社 | 连接结构的制造方法以及太阳能电池模块的制造方法 |
| EP2146355A1 (en) * | 2007-05-09 | 2010-01-20 | Hitachi Chemical Company, Ltd. | Conductor connection member, connection structure, and solar cell module |
| JP5337034B2 (ja) * | 2007-08-10 | 2013-11-06 | 旭化成イーマテリアルズ株式会社 | 接着剤及び接合体 |
| KR101140067B1 (ko) | 2007-10-15 | 2012-04-30 | 히다치 가세고교 가부시끼가이샤 | 회로 접속용 접착 필름 및 회로 접속 구조체 |
| JP5779895B2 (ja) * | 2011-02-08 | 2015-09-16 | 東レ株式会社 | 半導体用絶縁性接着剤 |
| JP5868823B2 (ja) * | 2012-10-01 | 2016-02-24 | 日立化成株式会社 | 異方導電フィルム |
| WO2018181589A1 (ja) * | 2017-03-29 | 2018-10-04 | 日立化成株式会社 | 接着剤組成物及び構造体 |
| JP7234032B2 (ja) * | 2019-05-15 | 2023-03-07 | デクセリアルズ株式会社 | 接着フィルムの製造方法、接着フィルム、及び接続体の製造方法 |
-
2000
- 2000-05-17 JP JP2000144270A patent/JP4433564B2/ja not_active Expired - Fee Related
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