JP2001323249A5 - - Google Patents

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Publication number
JP2001323249A5
JP2001323249A5 JP2000144270A JP2000144270A JP2001323249A5 JP 2001323249 A5 JP2001323249 A5 JP 2001323249A5 JP 2000144270 A JP2000144270 A JP 2000144270A JP 2000144270 A JP2000144270 A JP 2000144270A JP 2001323249 A5 JP2001323249 A5 JP 2001323249A5
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JP
Japan
Prior art keywords
adhesive
circuit connection
heat
curing agent
connection according
Prior art date
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Application number
JP2000144270A
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English (en)
Japanese (ja)
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JP2001323249A (ja
JP4433564B2 (ja
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Priority to JP2000144270A priority Critical patent/JP4433564B2/ja
Priority claimed from JP2000144270A external-priority patent/JP4433564B2/ja
Publication of JP2001323249A publication Critical patent/JP2001323249A/ja
Publication of JP2001323249A5 publication Critical patent/JP2001323249A5/ja
Application granted granted Critical
Publication of JP4433564B2 publication Critical patent/JP4433564B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2000144270A 2000-05-17 2000-05-17 回路接続用接着剤 Expired - Fee Related JP4433564B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000144270A JP4433564B2 (ja) 2000-05-17 2000-05-17 回路接続用接着剤

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000144270A JP4433564B2 (ja) 2000-05-17 2000-05-17 回路接続用接着剤

Related Child Applications (2)

Application Number Title Priority Date Filing Date
JP2005238698A Division JP2006028521A (ja) 2005-08-19 2005-08-19 回路接続用接着剤
JP2005331857A Division JP4626495B2 (ja) 2005-11-16 2005-11-16 回路接続用接着剤

Publications (3)

Publication Number Publication Date
JP2001323249A JP2001323249A (ja) 2001-11-22
JP2001323249A5 true JP2001323249A5 (enExample) 2005-11-04
JP4433564B2 JP4433564B2 (ja) 2010-03-17

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ID=18650948

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000144270A Expired - Fee Related JP4433564B2 (ja) 2000-05-17 2000-05-17 回路接続用接着剤

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JP (1) JP4433564B2 (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7618713B2 (en) 1997-03-31 2009-11-17 Hitachi Chemical Company, Ltd. Circuit-connecting material and circuit terminal connected structure and connecting method
JP2005194413A (ja) * 2004-01-08 2005-07-21 Hitachi Chem Co Ltd 回路接続用接着フィルム及び回路接続構造体
JP4970767B2 (ja) * 2005-10-26 2012-07-11 リンテック株式会社 導電接合シート用の絶縁シート、導電接合シート、導電接合シートの製造方法および電子複合部品の製造方法
JP4626495B2 (ja) * 2005-11-16 2011-02-09 日立化成工業株式会社 回路接続用接着剤
JP4650456B2 (ja) 2006-08-25 2011-03-16 日立化成工業株式会社 回路接続材料、これを用いた回路部材の接続構造及びその製造方法
JP5115553B2 (ja) 2007-05-09 2013-01-09 日立化成工業株式会社 導電体接続用部材、接続構造及び太陽電池モジュール
KR101081706B1 (ko) 2007-05-09 2011-11-09 히다치 가세고교 가부시끼가이샤 도전체의 접속 방법, 도전체 접속용 부재, 접속 구조 및 태양 전지 모듈
KR101139749B1 (ko) * 2007-08-10 2012-04-26 아사히 가세이 이-매터리얼즈 가부시키가이샤 접착제 및 접합체
WO2009051043A1 (ja) 2007-10-15 2009-04-23 Hitachi Chemical Company, Ltd. 回路接続用接着フィルム及び回路接続構造体
JP5779895B2 (ja) * 2011-02-08 2015-09-16 東レ株式会社 半導体用絶縁性接着剤
JP5868823B2 (ja) * 2012-10-01 2016-02-24 日立化成株式会社 異方導電フィルム
CN110461984A (zh) * 2017-03-29 2019-11-15 日立化成株式会社 粘接剂组合物及结构体
JP7234032B2 (ja) * 2019-05-15 2023-03-07 デクセリアルズ株式会社 接着フィルムの製造方法、接着フィルム、及び接続体の製造方法

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