JP2004128465A5 - - Google Patents
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- Publication number
- JP2004128465A5 JP2004128465A5 JP2003186397A JP2003186397A JP2004128465A5 JP 2004128465 A5 JP2004128465 A5 JP 2004128465A5 JP 2003186397 A JP2003186397 A JP 2003186397A JP 2003186397 A JP2003186397 A JP 2003186397A JP 2004128465 A5 JP2004128465 A5 JP 2004128465A5
- Authority
- JP
- Japan
- Prior art keywords
- connection terminal
- circuit
- connection
- terminal
- material according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 239000000463 material Substances 0.000 claims 14
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims 6
- 238000010526 radical polymerization reaction Methods 0.000 claims 5
- 239000000126 substance Substances 0.000 claims 5
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 3
- 229910052737 gold Inorganic materials 0.000 claims 3
- 239000010931 gold Substances 0.000 claims 3
- 238000010438 heat treatment Methods 0.000 claims 3
- 238000000034 method Methods 0.000 claims 3
- 229910052697 platinum Inorganic materials 0.000 claims 3
- 229910052709 silver Inorganic materials 0.000 claims 3
- 239000004332 silver Substances 0.000 claims 3
- 239000011135 tin Substances 0.000 claims 3
- 229910052718 tin Inorganic materials 0.000 claims 3
- 239000004840 adhesive resin Substances 0.000 claims 2
- 229920006223 adhesive resin Polymers 0.000 claims 2
- 239000003795 chemical substances by application Substances 0.000 claims 2
- 229910052751 metal Inorganic materials 0.000 claims 2
- 239000002184 metal Substances 0.000 claims 2
- 239000002245 particle Substances 0.000 claims 2
- 229920000800 acrylic rubber Polymers 0.000 claims 1
- 238000006243 chemical reaction Methods 0.000 claims 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims 1
- 238000005259 measurement Methods 0.000 claims 1
- 229920000058 polyacrylate Polymers 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 230000000630 rising effect Effects 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003186397A JP4717334B2 (ja) | 1997-03-31 | 2003-06-30 | 回路接続材料並びに回路端子の接続構造及び接続方法 |
Applications Claiming Priority (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1997079424 | 1997-03-31 | ||
| JP1997079422 | 1997-03-31 | ||
| JP7942497 | 1997-03-31 | ||
| JP7942297 | 1997-03-31 | ||
| JP25293397 | 1997-09-18 | ||
| JP1997252933 | 1997-09-18 | ||
| JP2003186397A JP4717334B2 (ja) | 1997-03-31 | 2003-06-30 | 回路接続材料並びに回路端子の接続構造及び接続方法 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP54145798A Division JP3587859B2 (ja) | 1997-03-31 | 1998-03-31 | 回路接続材料並びに回路端子の接続構造及び接続方法 |
Related Child Applications (4)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2005116151A Division JP5020476B6 (ja) | 1997-03-31 | 2005-04-13 | 回路接続材料並びに回路端子の接続構造及び接続方法 |
| JP2005116157A Division JP4016995B2 (ja) | 1997-03-31 | 2005-04-13 | 回路接続材料並びに回路端子の接続構造及び接続方法 |
| JP2005116155A Division JP4265565B2 (ja) | 1997-03-31 | 2005-04-13 | 回路接続材料並びに回路端子の接続構造及び接続方法 |
| JP2005116147A Division JP4289319B2 (ja) | 1997-03-31 | 2005-04-13 | 回路接続材料並びに回路端子の接続構造及び接続方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2004128465A JP2004128465A (ja) | 2004-04-22 |
| JP2004128465A5 true JP2004128465A5 (enExample) | 2005-09-22 |
| JP4717334B2 JP4717334B2 (ja) | 2011-07-06 |
Family
ID=32303584
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2003186397A Expired - Fee Related JP4717334B2 (ja) | 1997-03-31 | 2003-06-30 | 回路接続材料並びに回路端子の接続構造及び接続方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4717334B2 (enExample) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| AU6520798A (en) | 1997-03-31 | 1998-10-22 | Hitachi Chemical Company, Ltd. | Circuit connecting material, and structure and method of connecting circuit terminal |
| US7604868B2 (en) | 1997-03-31 | 2009-10-20 | Hitachi Chemical Company, Ltd. | Electronic circuit including circuit-connecting material |
| JP5032749B2 (ja) | 2005-03-16 | 2012-09-26 | パナソニック株式会社 | 光フィルタおよび照明装置 |
| JP3852858B1 (ja) | 2005-08-16 | 2006-12-06 | 株式会社日立製作所 | 半導体放射線検出器、放射線検出モジュールおよび核医学診断装置 |
| JP5070748B2 (ja) * | 2006-04-05 | 2012-11-14 | 日立化成工業株式会社 | 接着剤組成物、回路接続材料、接続体及び半導体装置 |
| JP5266598B2 (ja) * | 2008-11-28 | 2013-08-21 | ナガセケムテックス株式会社 | 縮環構造含有フェノキシ樹脂 |
| JP7198479B2 (ja) * | 2018-08-31 | 2023-01-04 | 学校法人早稲田大学 | 半導体素子接合構造、半導体素子接合構造の生成方法及び導電性接合剤 |
-
2003
- 2003-06-30 JP JP2003186397A patent/JP4717334B2/ja not_active Expired - Fee Related
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