JP4717334B2 - 回路接続材料並びに回路端子の接続構造及び接続方法 - Google Patents
回路接続材料並びに回路端子の接続構造及び接続方法 Download PDFInfo
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- JP4717334B2 JP4717334B2 JP2003186397A JP2003186397A JP4717334B2 JP 4717334 B2 JP4717334 B2 JP 4717334B2 JP 2003186397 A JP2003186397 A JP 2003186397A JP 2003186397 A JP2003186397 A JP 2003186397A JP 4717334 B2 JP4717334 B2 JP 4717334B2
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- 238000000790 scattering method Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 125000002914 sec-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 239000010944 silver (metal) Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000007790 solid phase Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 229920003051 synthetic elastomer Polymers 0.000 description 1
- OPQYOFWUFGEMRZ-UHFFFAOYSA-N tert-butyl 2,2-dimethylpropaneperoxoate Chemical compound CC(C)(C)OOC(=O)C(C)(C)C OPQYOFWUFGEMRZ-UHFFFAOYSA-N 0.000 description 1
- SWAXTRYEYUTSAP-UHFFFAOYSA-N tert-butyl ethaneperoxoate Chemical compound CC(=O)OOC(C)(C)C SWAXTRYEYUTSAP-UHFFFAOYSA-N 0.000 description 1
- XTXFUQOLBKQKJU-UHFFFAOYSA-N tert-butylperoxy(trimethyl)silane Chemical compound CC(C)(C)OO[Si](C)(C)C XTXFUQOLBKQKJU-UHFFFAOYSA-N 0.000 description 1
- WPZJSWWEEJJSIZ-UHFFFAOYSA-N tetrabromobisphenol-F Natural products C1=C(Br)C(O)=C(Br)C=C1CC1=CC(Br)=C(O)C(Br)=C1 WPZJSWWEEJJSIZ-UHFFFAOYSA-N 0.000 description 1
- 238000005979 thermal decomposition reaction Methods 0.000 description 1
- 239000013008 thixotropic agent Substances 0.000 description 1
- 125000003866 trichloromethyl group Chemical group ClC(Cl)(Cl)* 0.000 description 1
- 125000002023 trifluoromethyl group Chemical group FC(F)(F)* 0.000 description 1
- LENZDBCJOHFCAS-UHFFFAOYSA-N tris Chemical compound OCC(N)(CO)CO LENZDBCJOHFCAS-UHFFFAOYSA-N 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
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Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
Landscapes
- Polyethers (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Conductive Materials (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003186397A JP4717334B2 (ja) | 1997-03-31 | 2003-06-30 | 回路接続材料並びに回路端子の接続構造及び接続方法 |
Applications Claiming Priority (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1997079424 | 1997-03-31 | ||
| JP1997079422 | 1997-03-31 | ||
| JP7942497 | 1997-03-31 | ||
| JP7942297 | 1997-03-31 | ||
| JP25293397 | 1997-09-18 | ||
| JP1997252933 | 1997-09-18 | ||
| JP2003186397A JP4717334B2 (ja) | 1997-03-31 | 2003-06-30 | 回路接続材料並びに回路端子の接続構造及び接続方法 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP54145798A Division JP3587859B2 (ja) | 1997-03-31 | 1998-03-31 | 回路接続材料並びに回路端子の接続構造及び接続方法 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2005116151A Division JP5020476B6 (ja) | 1997-03-31 | 2005-04-13 | 回路接続材料並びに回路端子の接続構造及び接続方法 |
| JP2005116157A Division JP4016995B2 (ja) | 1997-03-31 | 2005-04-13 | 回路接続材料並びに回路端子の接続構造及び接続方法 |
| JP2005116155A Division JP4265565B2 (ja) | 1997-03-31 | 2005-04-13 | 回路接続材料並びに回路端子の接続構造及び接続方法 |
| JP2005116147A Division JP4289319B2 (ja) | 1997-03-31 | 2005-04-13 | 回路接続材料並びに回路端子の接続構造及び接続方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2004128465A JP2004128465A (ja) | 2004-04-22 |
| JP2004128465A5 JP2004128465A5 (enExample) | 2005-09-22 |
| JP4717334B2 true JP4717334B2 (ja) | 2011-07-06 |
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| Application Number | Title | Priority Date | Filing Date |
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| JP2003186397A Expired - Fee Related JP4717334B2 (ja) | 1997-03-31 | 2003-06-30 | 回路接続材料並びに回路端子の接続構造及び接続方法 |
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| Country | Link |
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| JP (1) | JP4717334B2 (enExample) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| AU6520798A (en) | 1997-03-31 | 1998-10-22 | Hitachi Chemical Company, Ltd. | Circuit connecting material, and structure and method of connecting circuit terminal |
| US7604868B2 (en) | 1997-03-31 | 2009-10-20 | Hitachi Chemical Company, Ltd. | Electronic circuit including circuit-connecting material |
| JP5032749B2 (ja) | 2005-03-16 | 2012-09-26 | パナソニック株式会社 | 光フィルタおよび照明装置 |
| JP3852858B1 (ja) | 2005-08-16 | 2006-12-06 | 株式会社日立製作所 | 半導体放射線検出器、放射線検出モジュールおよび核医学診断装置 |
| JP5070748B2 (ja) * | 2006-04-05 | 2012-11-14 | 日立化成工業株式会社 | 接着剤組成物、回路接続材料、接続体及び半導体装置 |
| JP5266598B2 (ja) * | 2008-11-28 | 2013-08-21 | ナガセケムテックス株式会社 | 縮環構造含有フェノキシ樹脂 |
| JP7198479B2 (ja) * | 2018-08-31 | 2023-01-04 | 学校法人早稲田大学 | 半導体素子接合構造、半導体素子接合構造の生成方法及び導電性接合剤 |
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| JP2004128465A (ja) | 2004-04-22 |
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