JP4717334B2 - 回路接続材料並びに回路端子の接続構造及び接続方法 - Google Patents

回路接続材料並びに回路端子の接続構造及び接続方法 Download PDF

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Publication number
JP4717334B2
JP4717334B2 JP2003186397A JP2003186397A JP4717334B2 JP 4717334 B2 JP4717334 B2 JP 4717334B2 JP 2003186397 A JP2003186397 A JP 2003186397A JP 2003186397 A JP2003186397 A JP 2003186397A JP 4717334 B2 JP4717334 B2 JP 4717334B2
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Japan
Prior art keywords
circuit
connection
connection terminal
resin
group
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Expired - Fee Related
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JP2003186397A
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English (en)
Japanese (ja)
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JP2004128465A (ja
JP2004128465A5 (enExample
Inventor
伊津夫 渡辺
貢 藤縄
征宏 有福
朋子 金澤
敦司 桑野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Showa Denko Materials Co Ltd
Resonac Corp
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Application filed by Hitachi Chemical Co Ltd, Showa Denko Materials Co Ltd, Resonac Corp filed Critical Hitachi Chemical Co Ltd
Priority to JP2003186397A priority Critical patent/JP4717334B2/ja
Publication of JP2004128465A publication Critical patent/JP2004128465A/ja
Publication of JP2004128465A5 publication Critical patent/JP2004128465A5/ja
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Publication of JP4717334B2 publication Critical patent/JP4717334B2/ja
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins

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  • Polyethers (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Conductive Materials (AREA)
JP2003186397A 1997-03-31 2003-06-30 回路接続材料並びに回路端子の接続構造及び接続方法 Expired - Fee Related JP4717334B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2003186397A JP4717334B2 (ja) 1997-03-31 2003-06-30 回路接続材料並びに回路端子の接続構造及び接続方法

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
JP1997079422 1997-03-31
JP7942497 1997-03-31
JP1997079424 1997-03-31
JP7942297 1997-03-31
JP1997252933 1997-09-18
JP25293397 1997-09-18
JP2003186397A JP4717334B2 (ja) 1997-03-31 2003-06-30 回路接続材料並びに回路端子の接続構造及び接続方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP54145798A Division JP3587859B2 (ja) 1997-03-31 1998-03-31 回路接続材料並びに回路端子の接続構造及び接続方法

Related Child Applications (4)

Application Number Title Priority Date Filing Date
JP2005116155A Division JP4265565B2 (ja) 1997-03-31 2005-04-13 回路接続材料並びに回路端子の接続構造及び接続方法
JP2005116157A Division JP4016995B2 (ja) 1997-03-31 2005-04-13 回路接続材料並びに回路端子の接続構造及び接続方法
JP2005116151A Division JP5020476B6 (ja) 1997-03-31 2005-04-13 回路接続材料並びに回路端子の接続構造及び接続方法
JP2005116147A Division JP4289319B2 (ja) 1997-03-31 2005-04-13 回路接続材料並びに回路端子の接続構造及び接続方法

Publications (3)

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JP2004128465A JP2004128465A (ja) 2004-04-22
JP2004128465A5 JP2004128465A5 (enExample) 2005-09-22
JP4717334B2 true JP4717334B2 (ja) 2011-07-06

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JP2003186397A Expired - Fee Related JP4717334B2 (ja) 1997-03-31 2003-06-30 回路接続材料並びに回路端子の接続構造及び接続方法

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JP (1) JP4717334B2 (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1542273B1 (en) 1997-03-31 2013-09-25 Hitachi Chemical Co., Ltd. Circuit-connecting material and circuit terminal connected structure and connecting method
US7618713B2 (en) 1997-03-31 2009-11-17 Hitachi Chemical Company, Ltd. Circuit-connecting material and circuit terminal connected structure and connecting method
JP5032749B2 (ja) 2005-03-16 2012-09-26 パナソニック株式会社 光フィルタおよび照明装置
JP3852858B1 (ja) 2005-08-16 2006-12-06 株式会社日立製作所 半導体放射線検出器、放射線検出モジュールおよび核医学診断装置
JP5070748B2 (ja) * 2006-04-05 2012-11-14 日立化成工業株式会社 接着剤組成物、回路接続材料、接続体及び半導体装置
JP5266598B2 (ja) * 2008-11-28 2013-08-21 ナガセケムテックス株式会社 縮環構造含有フェノキシ樹脂
JP7198479B2 (ja) * 2018-08-31 2023-01-04 学校法人早稲田大学 半導体素子接合構造、半導体素子接合構造の生成方法及び導電性接合剤

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Publication number Publication date
JP2004128465A (ja) 2004-04-22

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