JP2001323224A5 - - Google Patents

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Publication number
JP2001323224A5
JP2001323224A5 JP2000144269A JP2000144269A JP2001323224A5 JP 2001323224 A5 JP2001323224 A5 JP 2001323224A5 JP 2000144269 A JP2000144269 A JP 2000144269A JP 2000144269 A JP2000144269 A JP 2000144269A JP 2001323224 A5 JP2001323224 A5 JP 2001323224A5
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JP
Japan
Prior art keywords
connection
terminal
adhesive composition
circuit
connection terminal
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Application number
JP2000144269A
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English (en)
Japanese (ja)
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JP2001323224A (ja
JP4747396B2 (ja
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Priority to JP2000144269A priority Critical patent/JP4747396B2/ja
Priority claimed from JP2000144269A external-priority patent/JP4747396B2/ja
Publication of JP2001323224A publication Critical patent/JP2001323224A/ja
Publication of JP2001323224A5 publication Critical patent/JP2001323224A5/ja
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Publication of JP4747396B2 publication Critical patent/JP4747396B2/ja
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Expired - Fee Related legal-status Critical Current

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JP2000144269A 2000-05-17 2000-05-17 接着剤組成物、それを用いた回路端子の接続方法及び回路端子の接続構造 Expired - Fee Related JP4747396B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000144269A JP4747396B2 (ja) 2000-05-17 2000-05-17 接着剤組成物、それを用いた回路端子の接続方法及び回路端子の接続構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000144269A JP4747396B2 (ja) 2000-05-17 2000-05-17 接着剤組成物、それを用いた回路端子の接続方法及び回路端子の接続構造

Publications (3)

Publication Number Publication Date
JP2001323224A JP2001323224A (ja) 2001-11-22
JP2001323224A5 true JP2001323224A5 (enExample) 2009-12-03
JP4747396B2 JP4747396B2 (ja) 2011-08-17

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Family Applications (1)

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JP2000144269A Expired - Fee Related JP4747396B2 (ja) 2000-05-17 2000-05-17 接着剤組成物、それを用いた回路端子の接続方法及び回路端子の接続構造

Country Status (1)

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JP (1) JP4747396B2 (enExample)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002184487A (ja) 2000-12-15 2002-06-28 Sony Chem Corp 異方性導電接着剤
JP5111711B2 (ja) * 2002-01-31 2013-01-09 日立化成工業株式会社 接着剤組成物、回路接続用接着剤組成物及び回路接続方法
JP4154919B2 (ja) * 2002-02-28 2008-09-24 日立化成工業株式会社 回路接続材料及びそれを用いた回路端子の接続構造
JP4844461B2 (ja) * 2002-02-28 2011-12-28 日立化成工業株式会社 回路接続材料及びそれを用いた回路端子の接続構造
JP2005347273A (ja) * 2005-06-06 2005-12-15 Hitachi Chem Co Ltd 熱架橋型回路接続材料及びそれを用いた回路板の製造方法
US7579360B2 (en) 2005-06-09 2009-08-25 Bristol-Myers Squibb Company Triazolopyridine 11-beta hydroxysteroid dehydrogenase type I inhibitors
JP5181220B2 (ja) * 2007-04-19 2013-04-10 日立化成株式会社 回路接続用接着フィルム、接続構造体及びその製造方法
JP2007317657A (ja) * 2007-05-08 2007-12-06 Hitachi Chem Co Ltd 熱架橋型回路接続材料及びそれを用いた回路板の製造方法
US8119658B2 (en) 2007-10-01 2012-02-21 Bristol-Myers Squibb Company Triazolopyridine 11-beta hydroxysteroid dehydrogenase type I inhibitors
WO2009044732A1 (ja) * 2007-10-05 2009-04-09 Hitachi Chemical Company, Ltd. 接着剤組成物及びこれを用いた回路接続材料、並びに、回路部材の接続方法及び回路接続体
CN101828434A (zh) * 2007-10-18 2010-09-08 日立化成工业株式会社 粘接剂组合物和使用其的电路连接材料、以及电路部件的连接方法和电路连接体
JP4572960B2 (ja) * 2008-06-23 2010-11-04 日立化成工業株式会社 回路接続用異方導電性接着剤フィルム、それを用いた回路端子の接続方法及び回路端子の接続構造
JP5668636B2 (ja) * 2010-08-24 2015-02-12 日立化成株式会社 回路接続構造体の製造方法
ES2660051T3 (es) 2012-09-28 2018-03-20 Vanderbilt University Compuestos heterocíclicos condensados como inhibidores selectivos de BMP
KR101862734B1 (ko) * 2013-12-26 2018-07-04 타츠타 전선 주식회사 전자 부품 접착 재료 및 전자 부품의 접착 방법

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06293182A (ja) * 1993-04-08 1994-10-21 Nitto Denko Corp 可逆性感熱記録媒体用組成物および可逆性感熱記録シート
JP3729584B2 (ja) * 1996-12-26 2005-12-21 三井化学株式会社 半導体ウエハの裏面研削方法及びその方法に用いる粘着フィルム
JP4402750B2 (ja) * 1997-09-18 2010-01-20 日立化成工業株式会社 回路電極の接続方法
JP4794702B2 (ja) * 1998-03-31 2011-10-19 日立化成工業株式会社 回路接続材料、回路端子の接続構造および回路端子の接続方法
JP3885349B2 (ja) * 1998-03-31 2007-02-21 日立化成工業株式会社 回路接続材料、回路端子の接続構造および回路端子の接続方法
JP4794704B2 (ja) * 1998-03-31 2011-10-19 日立化成工業株式会社 回路接続材料、回路端子の接続構造および回路端子の接続方法

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