DK1214864T3 - Siliciumbaseret sensorsystem - Google Patents

Siliciumbaseret sensorsystem

Info

Publication number
DK1214864T3
DK1214864T3 DK00958265T DK00958265T DK1214864T3 DK 1214864 T3 DK1214864 T3 DK 1214864T3 DK 00958265 T DK00958265 T DK 00958265T DK 00958265 T DK00958265 T DK 00958265T DK 1214864 T3 DK1214864 T3 DK 1214864T3
Authority
DK
Denmark
Prior art keywords
microphone
surface mount
different elements
sensor system
technology
Prior art date
Application number
DK00958265T
Other languages
English (en)
Inventor
Jochen F Kuhmann
Peter U Scheel
Matthias Muellenborn
Original Assignee
Sonionmems As
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/570,434 external-priority patent/US6522762B1/en
Application filed by Sonionmems As filed Critical Sonionmems As
Application granted granted Critical
Publication of DK1214864T3 publication Critical patent/DK1214864T3/da

Links

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/005—Electrostatic transducers using semiconductor materials
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/04—Microphones
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R25/00—Deaf-aid sets, i.e. electro-acoustic or electro-mechanical hearing aids; Electric tinnitus maskers providing an auditory perception
    • H04R25/60—Mounting or interconnection of hearing aid parts, e.g. inside tips, housings or to ossicles
    • H04R25/609—Mounting or interconnection of hearing aid parts, e.g. inside tips, housings or to ossicles of circuitry
DK00958265T 1999-09-06 2000-09-06 Siliciumbaseret sensorsystem DK1214864T3 (da)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
DKPA199901254 1999-09-06
US39162899A 1999-09-07 1999-09-07
US09/570,434 US6522762B1 (en) 1999-09-07 2000-05-12 Silicon-based sensor system
PCT/DK2000/000491 WO2001019134A2 (en) 1999-09-06 2000-09-06 Silicon-based sensor system

Publications (1)

Publication Number Publication Date
DK1214864T3 true DK1214864T3 (da) 2003-08-25

Family

ID=27221189

Family Applications (1)

Application Number Title Priority Date Filing Date
DK00958265T DK1214864T3 (da) 1999-09-06 2000-09-06 Siliciumbaseret sensorsystem

Country Status (10)

Country Link
EP (1) EP1214864B1 (da)
JP (2) JP4459498B2 (da)
CN (1) CN1203726C (da)
AT (1) ATE242587T1 (da)
AU (1) AU6984100A (da)
CA (1) CA2383740C (da)
DE (1) DE60003199T2 (da)
DK (1) DK1214864T3 (da)
PL (1) PL209935B1 (da)
WO (1) WO2001019134A2 (da)

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US6696645B2 (en) * 2002-05-08 2004-02-24 The Regents Of The University Of Michigan On-wafer packaging for RF-MEMS
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US7466835B2 (en) 2003-03-18 2008-12-16 Sonion A/S Miniature microphone with balanced termination
JP2004356708A (ja) * 2003-05-27 2004-12-16 Hosiden Corp 音響検出機構及びその製造方法
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CN100499877C (zh) * 2003-12-17 2009-06-10 中国科学院声学研究所 具有高灵敏度的用于硅微电容传声器的芯片及其制备方法
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JP4553611B2 (ja) * 2004-03-15 2010-09-29 三洋電機株式会社 回路装置
JP4539450B2 (ja) * 2004-11-04 2010-09-08 オムロン株式会社 容量型振動センサ及びその製造方法
DE102005008512B4 (de) 2005-02-24 2016-06-23 Epcos Ag Elektrisches Modul mit einem MEMS-Mikrofon
DE102005008511B4 (de) 2005-02-24 2019-09-12 Tdk Corporation MEMS-Mikrofon
DE102005053765B4 (de) 2005-11-10 2016-04-14 Epcos Ag MEMS-Package und Verfahren zur Herstellung
DE102005053767B4 (de) 2005-11-10 2014-10-30 Epcos Ag MEMS-Mikrofon, Verfahren zur Herstellung und Verfahren zum Einbau
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CN101005718B (zh) * 2006-01-16 2011-04-20 财团法人工业技术研究院 微型声学传感器及其制造方法
JP4771290B2 (ja) * 2006-07-19 2011-09-14 ヤマハ株式会社 圧力センサの製造方法
DE112007003083B4 (de) * 2006-12-22 2019-05-09 Tdk Corp. Mikrofonbaugruppe mit Unterfüllmittel mit niedrigem Wärmeausdehnungskoeffizienten
JP4893380B2 (ja) * 2007-03-09 2012-03-07 ヤマハ株式会社 コンデンサマイク装置
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DE102007008518A1 (de) * 2007-02-21 2008-08-28 Infineon Technologies Ag Modul mit einem ein bewegliches Element umfassenden Halbleiterchip
US8767983B2 (en) * 2007-06-01 2014-07-01 Infineon Technologies Ag Module including a micro-electro-mechanical microphone
JP2009081624A (ja) * 2007-09-26 2009-04-16 Rohm Co Ltd 半導体センサ装置
TWI336770B (en) * 2007-11-05 2011-02-01 Ind Tech Res Inst Sensor
TWI365525B (en) * 2007-12-24 2012-06-01 Ind Tech Res Inst An ultra thin package for a sensor chip of a micro electro mechanical system
EP2094028B8 (en) * 2008-02-22 2017-03-29 TDK Corporation Miniature microphone assembly with solder sealing ring
CN102187685B (zh) * 2008-10-14 2015-03-11 美商楼氏电子有限公司 具有多个换能器元件的传声器
KR20120014591A (ko) * 2009-05-18 2012-02-17 노우레스 일렉트로닉스, 엘엘시 감소된 진동 감도를 갖는 마이크로폰
KR101609270B1 (ko) 2009-08-12 2016-04-06 삼성전자주식회사 압전형 마이크로 스피커 및 그 제조 방법
DE102009047592B4 (de) * 2009-12-07 2019-06-19 Robert Bosch Gmbh Verfahren zur Herstellung eines Siliziumzwischenträgers
IT1397976B1 (it) * 2009-12-23 2013-02-04 St Microelectronics Rousset Trasduttore di tipo microelettromeccanico e relativo procedimento di assemblaggio.
JP2013093637A (ja) * 2010-02-24 2013-05-16 Panasonic Corp 半導体装置及びその製造方法
TWI491009B (zh) 2010-10-08 2015-07-01 晶片級電磁干擾屏蔽結構及製造方法
CN102456669B (zh) * 2010-10-25 2015-07-22 环旭电子股份有限公司 芯片级电磁干扰屏蔽结构及制造方法
CN102726065B (zh) * 2010-12-30 2014-06-04 歌尔声学股份有限公司 Mems麦克风及其封装方法
JP5721452B2 (ja) * 2011-01-27 2015-05-20 ローム株式会社 静電容量型ｍｅｍｓセンサ
JP5799619B2 (ja) 2011-06-24 2015-10-28 船井電機株式会社 マイクロホンユニット
DE102011086722A1 (de) * 2011-11-21 2013-05-23 Robert Bosch Gmbh Mikromechanische Funktionsvorrichtung, insbesondere Lautsprechervorrichtung, und entsprechendes Herstellungsverfahren
US20130147040A1 (en) * 2011-12-09 2013-06-13 Robert Bosch Gmbh Mems chip scale package
DE102012203373A1 (de) * 2012-03-05 2013-09-05 Robert Bosch Gmbh Mikromechanische Schallwandleranordnung und ein entsprechendes Herstellungsverfahren
US20140090485A1 (en) * 2012-10-02 2014-04-03 Robert Bosch Gmbh MEMS Pressure Sensor Assembly
DE112012007235T5 (de) * 2012-12-18 2015-09-24 Epcos Ag Top-Port-Mems-Mikrofon und Verfahren zu dessen Herstellung
US20140312439A1 (en) * 2013-04-19 2014-10-23 Infineon Technologies Ag Microphone Module and Method of Manufacturing Thereof
ITTO20130350A1 (it) 2013-04-30 2014-10-31 St Microelectronics Srl Assemblaggio a livello di fetta di un dispositivo sensore mems e relativo dispositivo sensore mems
US9264832B2 (en) 2013-10-30 2016-02-16 Solid State System Co., Ltd. Microelectromechanical system (MEMS) microphone with protection film and MEMS microphonechips at wafer level
GB2538177B (en) * 2014-06-10 2017-09-13 Cirrus Logic Int Semiconductor Ltd Packaging for MEMS transducers
EP3195358A4 (en) * 2014-09-17 2018-04-25 Intel Corporation DIE WITH INTEGRATED MICROPHONE DEVICE USING THROUGH-SILICON VIAS (TSVs)
CN104780490A (zh) * 2015-04-20 2015-07-15 歌尔声学股份有限公司 一种mems麦克风的封装结构及其制造方法
TWI660466B (zh) * 2017-04-26 2019-05-21 矽品精密工業股份有限公司 封裝結構及其製法
CN111711903B (zh) * 2020-06-24 2021-10-01 歌尔微电子有限公司 微型麦克风防尘装置及mems麦克风

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Also Published As

Publication number Publication date
CN1387741A (zh) 2002-12-25
WO2001019134A2 (en) 2001-03-15
CN1203726C (zh) 2005-05-25
EP1214864A2 (en) 2002-06-19
JP4459498B2 (ja) 2010-04-28
DE60003199T2 (de) 2004-07-01
JP2007028671A (ja) 2007-02-01
CA2383740C (en) 2005-04-05
JP4303742B2 (ja) 2009-07-29
CA2383740A1 (en) 2001-03-15
AU6984100A (en) 2001-04-10
JP2003508998A (ja) 2003-03-04
DE60003199D1 (de) 2003-07-10
EP1214864B1 (en) 2003-06-04
PL354095A1 (en) 2003-12-29
WO2001019134A3 (en) 2001-09-07
PL209935B1 (pl) 2011-11-30
ATE242587T1 (de) 2003-06-15

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